Patents by Inventor Stanton Earl Weaver, Jr.
Stanton Earl Weaver, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8912643Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.Type: GrantFiled: December 10, 2012Date of Patent: December 16, 2014Assignee: General Electric CompanyInventors: Hendrik Pieter Jacobus de Bock, Stanton Earl Weaver, Jr., Raj Bahadur, Eric Ayres Browne, Gary Dwayne Mandrusiak
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Publication number: 20140240993Abstract: A cooling system is provided. The cooling system includes an enclosure. The enclosure is defined by walls among which at least one is movable. The enclosure further includes at least one aperture on at least one wall. The system further includes an amplification element that is coupled with at least one walls of the enclosure. Further, the cooling system includes an actuation unit mechanically coupled with the amplification element. The actuation unit includes at least one actuation signal triggered actuator configured to cause a displacement the amplification element. In the cooling system, the amplification element is configured to amplify the actuator caused displacement through to the at least one wall of the enclosure such that fluid enters and exits the enclosure from the at least one aperture.Type: ApplicationFiled: February 28, 2013Publication date: August 28, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Charles Erklin Seeley, Stanton Earl Weaver, JR., Brian Magann Rush, Mark Howard Giammattei
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Patent number: 8811014Abstract: A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.Type: GrantFiled: December 29, 2011Date of Patent: August 19, 2014Assignee: General Electric CompanyInventors: Shakti Singh Chauhan, Stanton Earl Weaver, Jr., Tao Deng, Christopher Michael Eastman, Wenwu Zhang
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Patent number: 8780559Abstract: An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.Type: GrantFiled: December 29, 2011Date of Patent: July 15, 2014Assignee: General Electric CompanyInventors: Stanton Earl Weaver, Jr., Tao Deng, Hendrik Pieter Jacobus de Bock, Shakti Singh Chauhan
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Publication number: 20140160677Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.Type: ApplicationFiled: December 10, 2012Publication date: June 12, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Hendrik Pieter Jacobus de Bock, Stanton Earl Weaver, Jr., Raj Bahadur, Eric Ayres Browne, Gary Dwayne Mandrusiak
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Patent number: 8695686Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.Type: GrantFiled: January 7, 2010Date of Patent: April 15, 2014Assignee: General Electric CompanyInventors: Rajdeep Sharma, Stanton Earl Weaver, Jr., Charles Erklin Seeley, Mehmet Arik, Tunc Icoz, Charles Franklin Wolfe, Jr., Yogen Vishwas Utturkar
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Publication number: 20140002990Abstract: A thermal management system for electronic devices is provided. The thermal management system includes a plurality of synthetic jets provided in a stacked arrangement and separated by respective spacers within the stacked arrangement. The stack of synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation.Type: ApplicationFiled: June 29, 2012Publication date: January 2, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Rajdeep Sharma, Stanton Earl Weaver, JR.
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Publication number: 20140002991Abstract: A thermal management system for electronic devices is provided. The thermal management system includes one or more synthetic jets. The synthetic jets may be used to facilitate airflow in the thermal management system, such as to facilitate air flow over a heat sink in one implementation. In one implementation, the synthetic jets are operated at an ultrasonic frequency.Type: ApplicationFiled: June 29, 2012Publication date: January 2, 2014Applicant: GENERAL ELECTRIC COMPANYInventors: Rajdeep Sharma, Stanton Earl Weaver, JR., Mehmet Arik
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Patent number: 8506105Abstract: An apparatus is provided including at least one electronic component. The apparatus also includes an enclosure enclosing the at least one electronic component. The enclosure includes at least one wall defined by a membrane. The apparatus further includes a piezoelectric actuator that is fixed at a first end and rigidly attached to the membrane at a second end. Application of alternating current to the piezoelectric actuator generates a pulsating mechanical deformation of the membrane.Type: GrantFiled: August 18, 2011Date of Patent: August 13, 2013Assignee: Generla Electric CompanyInventors: Rajdeep Sharma, Stanton Earl Weaver, Jr., Glenn Howard Kuenzler, Mehmet Arik, Gary Robert Allen, Jeffrey Marc Nall
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Patent number: 8496049Abstract: A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.Type: GrantFiled: April 9, 2009Date of Patent: July 30, 2013Assignee: General Electric CompanyInventors: Mehmet Arik, Tunc Icoz, Juan Manuel Rivas Davila, Charles Erklin Seeley, Yogen Vishwas Utturkar, Stanton Earl Weaver, Jr.
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Publication number: 20130168050Abstract: A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.Type: ApplicationFiled: December 29, 2011Publication date: July 4, 2013Inventors: Shakti Singh Chauhan, Stanton Earl Weaver, JR., Tao Deng, Christopher Michael Eastman, Wenwu Zhang
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Publication number: 20130170142Abstract: An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.Type: ApplicationFiled: December 29, 2011Publication date: July 4, 2013Applicant: GENERAL ELECTRIC COMPANYInventors: Stanton Earl Weaver, JR., Tao Deng, Hendrik Pieter Jacobus de Bock, Shakti Singh Chauhan
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Patent number: 8405996Abstract: An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.Type: GrantFiled: June 29, 2010Date of Patent: March 26, 2013Assignee: General Electric CompanyInventors: David Mulford Shaddock, Deng Tao, Hendrik Pieter Jacobus De Bock, Dalong Zhong, Christopher Michael Eastman, Kevin Matthew Durocher, Stanton Earl Weaver, Jr.
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Patent number: 8364427Abstract: A flow sensor assembly is provided and includes a flow conduit configured to impart a disturbance to a flow, multiple sensors disposed at respective sensing locations along the flow conduit. Each sensor is responsive to the disturbance of the flow and generates a corresponding response signal. The flow sensor assembly further includes a processor operably connected to each sensor, the processor being configured to compute a cross-correlation function between the response signals generated by said sensors, and determine a flow rate and a direction for the flow through the conduit based on the computed cross-correlation function. Additional flow sensor assembly arrangements are also disclosed.Type: GrantFiled: January 7, 2010Date of Patent: January 29, 2013Assignee: General Electric CompanyInventors: Ertugrul Berkcan, Shankar Chandrasekaran, Bo Li, Stanton Earl Weaver, Jr.
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Patent number: 8342819Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.Type: GrantFiled: July 21, 2010Date of Patent: January 1, 2013Assignee: General Electric CompanyInventors: Mehmet Arik, Charles Erklin Seeley, Yogen Vishwas Utturkar, William Edward Burdick, Jr., Kunal Ravindra Goray, Stanton Earl Weaver, Jr.
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Publication number: 20120051058Abstract: An apparatus is provided including at least one electronic component. The apparatus also includes an enclosure enclosing the at least one electronic component. The enclosure includes at least one wall defined by a membrane. The apparatus further includes a piezoelectric actuator that is fixed at a first end and rigidly attached to the membrane at a second end. Application of alternating current to the piezoelectric actuator generates a pulsating mechanical deformation of the membrane.Type: ApplicationFiled: August 18, 2011Publication date: March 1, 2012Applicant: General Electric CompanyInventors: Rajdeep Sharma, Stanton Earl Weaver, JR., Glenn Howard Kuenzler, Mehmet Arik, Gary Robert Allen, Jeffrey Marc Nall
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Publication number: 20110162823Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.Type: ApplicationFiled: January 7, 2010Publication date: July 7, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Rajdeep Sharma, Stanton Earl Weaver, JR., Charles Erklin Seeley, Mehmet Arik, Tunc Icoz, Charles Franklin Wolfe, JR., Yogen Vishwas Utturkar
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Publication number: 20110166800Abstract: A flow sensor assembly is provided and includes a flow conduit configured to impart a disturbance to a flow, multiple sensors disposed at respective sensing locations along the flow conduit. Each sensor is responsive to the disturbance of the flow and generates a corresponding response signal. The flow sensor assembly further includes a processor operably connected to each sensor, the processor being configured to compute a cross-correlation function between the response signals generated by said sensors, and determine a flow rate and a direction for the flow through the conduit based on the computed cross-correlation function. Additional flow sensor assembly arrangements are also disclosed.Type: ApplicationFiled: January 7, 2010Publication date: July 7, 2011Applicant: GENERAL ELECTRIC COMPANYInventors: Ertugrul Berkcan, Shankar Chandrasekaran, Bo Li, Stanton Earl Weaver, JR.
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Patent number: 7969734Abstract: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.Type: GrantFiled: January 3, 2007Date of Patent: June 28, 2011Assignee: General Electric CompanyInventors: Mehmet Arik, Chellappa Balan, Todd Garrett Wetzel, Stephen Adam Solovitz, Charles Max Byrd, Stanton Earl Weaver, Jr.
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Patent number: 7878232Abstract: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.Type: GrantFiled: July 9, 2004Date of Patent: February 1, 2011Assignee: GE Lighting Solutions, LLCInventors: Mehmet Arik, Stanton Earl Weaver, Jr.