Abstract: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

Abstract: A sensor package and method are described. The sensor package includes an enclosure, a diaphragm coupled to the enclosure. The diaphragm is configured to receive vibrations from an ambient environment. Further, the sensor package includes a pressure sensing element disposed inside the enclosure, and a pressure transfer medium disposed inside the enclosure and proximate the pressure sensing element, where the pressure transfer medium includes a fluid, and a plurality of filler particles suspended in the fluid. The filler particles serve to reduce a coefficient of thermal expansion of the pressure transfer medium.

Abstract: A two-stage valve for controlling the flow of fluid from a pressurized fluid supply with an upper main body including a cavity with a contoured inner surface; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A first valve opens and closes the flow of gas from the pressurized gas supply to the cavity. A second valve allows the pressure in the cavity to exhaust to the environment. Raising and lowering of the pressure in the cavity causes the pre-stressed diaphragm to open and close the flow of gas from the pressurized gas supply through the primary flow path of the two-stage valve. The design is suitable as a microvalve using Micro-Electro-Mechanical Systems (MEMS) concepts.

Abstract: A two-stage valve for controlling the flow of gas from a pressurized gas supply with an upper main body including a cavity; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A secondary flow path exists from the pressurized gas supply through the lower main body, through the upper main body, and terminating in the cavity in the upper main body. A first valve is installed in the secondary flow path to open and close the flow of gas from the pressurized gas supply to the cavity. A second valve installed in an exhaust passage in the upper main body allows the pressure in the cavity to exhaust to the environment. When the second valve is closed, the pressure in the cavity in the upper main body can be increased to lower the pre-stressed diaphragm.

Abstract: A method for fabricating a substrate package for a high density interconnect multichip module stack comprises: providing a substrate having holes extending therethrough and having a bottom surface with metallization situated thereon; providing a metal sheet having grooves extending therethrough; attaching the metal sheet to the bottom surface of the substrate; attaching metal plugs through the holes to the metal sheet; and removing portions of the substrate to expose the metal plugs and separate the metal sheet into a plurality of segments defined by the grooves.

Abstract: A high density interconnected multi-chip module is provided with a stress-reducing compliant material disposed around the chips prior to molding a polymeric substrate around the chips. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A compliant material is deposited around the chips, and then a mold form is positioned around the chips. Polymeric substrate molding material is added within the mold form, and then the substrate molding material is hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and faces of the chips. A thermal plug may be affixed to the backside of a chip prior to the addition of substrate molding material.