Patents by Inventor Stanton Earl Weaver, Jr.
Stanton Earl Weaver, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100328896Abstract: An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.Type: ApplicationFiled: June 29, 2010Publication date: December 30, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: David Mulford Shaddock, Deng Tao, Hendrik Pieter Jacobus De Bock, Dalong Zhong, Christopher Michael Eastman, Kevin Matthew Durocher, Stanton Earl Weaver, JR.
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Publication number: 20100294475Abstract: Disclosed herein is an heat transfer device comprising a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous layer having a thickness effective to enclose a region between opposing faces; the region providing a passage for the transport of a fluid; the porous layer having a thermal conductivity of about 0.1 to about 2000 watts per meter-Kelvin and a mass flow rate of about 10?9 to about 10?4 kilograms per second.Type: ApplicationFiled: May 22, 2009Publication date: November 25, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Brian Magann Rush, Hendrik Pieter Jacobus de Bock, Tao Deng, Boris Alexander Russ, Kripa Kiran Varanasi, Stanton Earl Weaver, JR.
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Publication number: 20100294467Abstract: Disclosed herein is an heat transfer device that includes a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell; the shell having an outer surface and an inner surface; and a particle layer disposed on the inner surface of the shell; the particle layer having a thickness effective to enclose a region for transferring a fluid between opposing faces; the particle layer including a first layer and a second layer; the second layer being disposed upon the first layer; the first layer having average particle sizes of about 10 to about 10,000,000 nanometers; the second layer having average particle sizes of about 10 to about 10,000 nanometers.Type: ApplicationFiled: May 22, 2009Publication date: November 25, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Kripa Kiran Varanasi, Pramod Chamarthy, Hendrik Pieter Jacobus de Bock, Lauraine Denault, Tao Deng, Aaron Jay Knobloch, Ambarish Jayant Kulkarni, Brian Magann Rush, Boris Alexander Russ, Stanton Earl Weaver, JR.
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ENCLOSURE FOR HEAT TRANSFER DEVICES, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
Publication number: 20100294461Abstract: Disclosed herein is a heat transfer device that includes a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell during the operation of the heat transfer device; the shell having an outer surface and an inner surface; and a porous layer disposed on the inner surface of the shell; the porous particle layer having a thickness effective to enclose a vapor space between opposing faces; the vapor space being effective to provide a passage for the transport of a fluid; the heat transfer device having a thermal conductivity of greater than or equal to about 10 watts per meter-Kelvin and a coefficient of thermal expansion that is substantially similar to that of a semiconductor.Type: ApplicationFiled: May 22, 2009Publication date: November 25, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Stanton Earl Weaver, JR., Shakti Singh Chauhan, Aaron Jay Knobloch, Ambarish Jayant Kulkarni, Kripa Kiran Varanasi -
Publication number: 20100284147Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Mehmet Arik, Charles Erklin Seeley, Yogen Vishwas Utturkar, William Edward Burdick, JR., Kunal Ravindra Goray, Stanton Earl Weaver, JR.
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Publication number: 20100258270Abstract: A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.Type: ApplicationFiled: April 9, 2009Publication date: October 14, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Mehmet Arik, Tunc Icoz, Juan Manuel Rivas Davila, Charles Erklin Seeley, Yogen Vishwas Utturkar, Stanton Earl Weaver, JR.
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Patent number: 7805950Abstract: A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.Type: GrantFiled: October 26, 2007Date of Patent: October 5, 2010Assignee: General Electric CompanyInventor: Stanton Earl Weaver, Jr.
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Publication number: 20100018843Abstract: An electrical component is disclosed. The electrical component includes at least two electrical contacts movable relative to each other between an open position and a closed position, wherein at least one of the electrical contacts includes a material having a work function that is less than about 3.5 eV, and wherein the distance between the electrical contacts, in the closed position, is greater than 0 nm and up to about 30 nm. A device including a plurality of electrical switches is also disclosed.Type: ApplicationFiled: July 24, 2008Publication date: January 28, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Marco Francesco Aimi, Stanton Earl Weaver, Jr., Sudhakar Eddula Reddy, Om Prakash, Ertugrul Berkcan
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Patent number: 7635869Abstract: In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10?, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36?) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.Type: GrantFiled: September 14, 2006Date of Patent: December 22, 2009Assignee: Lumination LLCInventors: Boris Kolodin, Michael Hsing, Stanton Earl Weaver, Jr., Ivan Eliashevich, Srinath K. Aanegola
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Patent number: 7572973Abstract: A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.Type: GrantFiled: December 5, 2008Date of Patent: August 11, 2009Assignee: General Electric CompanyInventors: Stanton Earl Weaver, Jr., Robert John Wojnarowski
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Patent number: 7498507Abstract: A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.Type: GrantFiled: March 16, 2005Date of Patent: March 3, 2009Assignee: General Electric CompanyInventors: Stanton Earl Weaver, Jr., Robert John Wojnarowski
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Publication number: 20090031733Abstract: A refrigeration system is provided. The refrigeration system includes at least one thermal blocking thermotunneling device. The thermal blocking thermotunneling device comprises a first and a second surface separated by a nanoscale gap of less than about 20 nm, such that tunneling of electrons causes a unidirectional transfer of heat from the first surface to the second surface. Further, the at least one thermal blocking thermotunneling device has a thermal back path of less than about 70 percent.Type: ApplicationFiled: July 31, 2007Publication date: February 5, 2009Applicant: GENERAL ELECTRIC COMPANYInventors: Stanton Earl Weaver, JR., Mehmet Arik, James William Bray, Ahmed Elasser, Robert John Wojnarowski, Mark Wayne Wilson, Jason Knud Klindtworth, Surajit Atha
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Patent number: 7482634Abstract: The present invention is directed towards a source of ultraviolet energy, wherein the source is a UV-emitting LED's. In an embodiment of the invention, the UV-LED's are characterized by a base layer material including a substrate, a p-doped semiconductor material, a multiple quantum well, a n-doped semiconductor material, upon which base material a p-type metal resides and wherein the base structure has a mesa configuration, which mesa configuration may be rounded on a boundary surface, or which may be non-rounded, such as a mesa having an upper boundary surface that is flat. In other words, the p-type metal resides upon a mesa formed out of the base structure materials. In a more specific embodiment, the UV-LED structure includes n-type metallization layer, passivation layers, and bond pads positioned at appropriate locations of the device. In a more specific embodiment, the p-type metal layer is encapsulated in the encapsulating layer.Type: GrantFiled: September 24, 2004Date of Patent: January 27, 2009Assignee: Lockheed Martin CorporationInventors: Robert John Wojnarowski, Stanton Earl Weaver, Jr., Abasifreke Udo Ebong, Xian An (Andrew) Cao, Steven Francis LeBoeuf, Larry Burton Rowland, Stephen D. Arthur
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Publication number: 20090001372Abstract: The present invention provides an optoelectronic device comprising a heat source and a heat transfer fluid. The present invention also provides a method of preparing an optoelectronic device, which comprises (i) providing a heat source, and (ii) filling a space in the vicinity of the heat source with a heat transfer liquid. The optoelectronic device has gained technical merits such as improved heat removing efficiency, lower chip/junction temperature, increased lumen output, longer operational lifetime, and better reliability, among others.Type: ApplicationFiled: June 29, 2007Publication date: January 1, 2009Inventors: Mehmet Arik, Stanton Earl Weaver, JR.
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Publication number: 20080310110Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.Type: ApplicationFiled: June 12, 2007Publication date: December 18, 2008Applicant: GENERAL ELECTRIC COMPANYInventors: Mehmet Arik, Charles Erklin Seeley, Yogen Vishwas Utturkar, William Edward Burdick, Jr., Kunal Ravindra Goray, Stanton Earl Weaver, Jr.
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Patent number: 7431479Abstract: A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.Type: GrantFiled: March 19, 2007Date of Patent: October 7, 2008Assignee: Lumination LLCInventors: Stanton Earl Weaver, Jr., Thomas Elliot Stecher
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Publication number: 20080035947Abstract: A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.Type: ApplicationFiled: December 9, 2004Publication date: February 14, 2008Inventors: Stanton Earl Weaver Jr., Chen-Lun Hsing Chen, Boris Kolodin, Thomas Elliot Stecher, James Reginelli, Deborah Ann Haitko, Xiang Gao, Ivan Eliashevich
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Patent number: 7305839Abstract: A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.Type: GrantFiled: June 30, 2004Date of Patent: December 11, 2007Assignee: General Electric CompanyInventor: Stanton Earl Weaver, Jr.
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Patent number: 7260939Abstract: A method of manufacturing a thermal transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier having a plurality of closed shapes on the first thermally conductive substrate and providing a nanotube catalyst material on the first thermally conductive substrate in a nanotube growth area oriented within each of the plurality of closed shapes of the patterned electrical barrier. The method also includes orienting the second thermally conductive substrate opposite the first thermally conductive substrate such that the patterned electrical barrier is disposed between the first and second thermally conductive substrates and providing a precursor gas proximate the nanotube catalyst material to facilitate growth of nanotubes in the nanotube growth areas from the first thermally conductive substrate toward, and limited by, the second thermally conductive substrate.Type: GrantFiled: December 17, 2004Date of Patent: August 28, 2007Assignee: General Electric CompanyInventor: Stanton Earl Weaver, Jr.
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Patent number: 7201497Abstract: A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.Type: GrantFiled: July 15, 2004Date of Patent: April 10, 2007Assignee: Lumination, LLCInventors: Stanton Earl Weaver, Jr., Thomas Elliot Stecher