Abstract: In order to clean optical components (35) inside an EUV lithography device in a gentle manner, a cleaning module for an EUV lithography device includes a supply line for molecular hydrogen and a heating filament for producing atomic hydrogen and hydrogen ions for cleaning purposes. The cleaning module also has an element, (33) arranged to apply an electric and/or magnetic field, downstream of the heating filament (29) in the direction of flow of the hydrogen (31, 32). The element can be designed as a deflection unit, as a filter unit and/or as an acceleration unit for the ion beam (32).

Abstract: An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

Abstract: An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

Abstract: An optical module, in particular for microlithography, with an optical element unit, a support device, a deformation device and a measuring device is disclosed. The support device is supported on the optical element unit, whereas for deforming an optical surface of the optical element unit, the deformation device engages a deformation section of the optical element unit comprising the optical surface. For determining the position and/or the orientation of the optical element unit with respect to an external reference in at least one degree of freedom, the measuring device comprises at least one measuring element, wherein the measuring element is arranged on a reference section of the optical element unit.

Abstract: The disclosure relates to an optical system, such as a projection exposure apparatus for semiconductor lithography, including a manipulable correction arrangement for reducing image aberrations. In some embodiments, the system includes at least one manipulator configured to reduce image aberrations. The manipulator can include at least one optical element which can be manipulated by at least one actuator. The manipulator can be formed in changeable fashion together with an actuator.

Abstract: The disclosure relates to an optical system, such as a projection exposure apparatus for semiconductor lithography, including a manipulable correction arrangement for reducing image aberrations. In some embodiments, the system includes at least one manipulator configured to reduce image aberrations. The manipulator can include at least one optical element which can be manipulated by at least one actuator. The manipulator can be formed in changeable fashion together with an actuator.

Abstract: The disclosure relates to an optical system, such as a projection exposure apparatus for semiconductor lithography, including a manipulable correction arrangement for reducing image aberrations. In some embodiments, the system includes at least one manipulator configured to reduce image aberrations. The manipulator can include at least one optical element which can be manipulated by at least one actuator. The manipulator can be formed in changeable fashion together with an actuator.

Abstract: A device for adjustably positioning an optical component includes a holding unit, which is which at least partly composed of a magnetostrictive material, and a mechanism for generating a magnetic field having a predetermined directional and amplitude distribution in the region of the holding unit. The holding unit has, in a predefined direction, an expansion which can be varied by a specific absolute value by the effect of the magnetic field.

Abstract: An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

Abstract: The disclosure relates to optical arrangements in a microlithographic projection exposure apparatus. In accordance with one aspect, an optical arrangement has at least one mirror segment arrangement including a plurality of separate mirror segments. The mirror segments are connected to a carrying structure of the projection exposure apparatus via mounting elements. At least one of the mounting elements, which is assigned to a first one of the mirror segments, extends, on the opposite side to the optically active surface of the mirror segment arrangement, at least partly into the region of a second mirror segment of the mirror segment arrangement. The second mirror segment is adjacent to the first mirror segment.

Abstract: An actuator includes a housing, a movable part, and an advancing unit that is at least temporarily connected to the movable part. The advancing unit includes a deformation unit and a deformer configured to deform the deformation unit with a vector component perpendicular to an effective direction of the actuator so that a total length of the deformation unit changes in the effective direction of the actuator as a result of the deformation. The movable part is configured to move in the effective direction of the actuator upon a removal of the vector component on the deformation unit and the deformation unit is disposed along the effective direction of the actuator upon the removal of the vector component on the deformation unit.

Abstract: The disclosure relates to an optical apparatus including a light source that emits light in the form of light pulses having a pulse frequency, and including at least one optical element. The disclosure also relates to a projection exposure machine including a pulsed light source and a projection objective, and to a method for modifying the imaging behavior of such an apparatus, such as in a projection exposure machine.

Abstract: There is provided an optical imaging device, in particular for microlithography, comprising at least one optical element and at least one holding device associated to the optical element (109), wherein the holding device holds the optical element and a first part (109.1) of the optical element contacts a first atmosphere and a second part (109.2) of the optical element at least temporarily contacts a second atmosphere. There is provided a reduction device at least reducing dynamic fluctuations in the pressure difference between the first atmosphere and the second atmosphere.

Abstract: There is provided an optical imaging device, in particular for microlithography, comprising at least one optical element and at least one holding device associated to the optical element (109), wherein the holding device holds the optical element and a first part (109.1) of the optical element contacts a first atmosphere and a second part (109.2) of the optical element at least temporarily contacts a second atmosphere. There is provided a reduction device at least reducing dynamic fluctuations in the pressure difference between the first atmosphere and the second atmosphere.

Abstract: An actuator includes a housing and a rotor that can be moved in relation to the housing in the effective direction of the actuator, wherein the actuator includes an advancing unit that is connected to the rotor at least part of the time. The advancing unit includes at least one deformation unit and at least one deformer for deforming the deformation unit. The at least one deformer is suited to deform the deformation unit perpendicular to the effective direction of the actuator such that the total length of the deformation unit changes in the effective direction as a result of the deformation. The actuator can be used in a projection exposure system for semiconductor lithography.

Abstract: In order to clean optical components (35) inside an EUV lithography device in a gentle manner, a cleaning module for an EUV lithography device includes a supply line for molecular hydrogen and a heating filament for producing atomic hydrogen and hydrogen ions for cleaning purposes. The cleaning module also has an element, (33) arranged to apply an electric and/or magnetic field, downstream of the heating filament (29) in the direction of flow of the hydrogen (31, 32). The element can be designed as a deflection unit, as a filter unit and/or as an acceleration unit for the ion beam (32).

Abstract: A device or the operation of a device for the holding, especially sealing support of an optical element, especially an optical lens with at least one holding element for mounting the optical element and preferably at least one sealing element for sealing contact at at least a part of the optical element and/or the holding element, wherein the sealing element or at least a part thereof is displaceable between a first position, in which the sealing element rests against the optical element and a second position, in which the sealing element is spaced apart from the optical element, or wherein the sealing element is switchable such that it rests against the optical element under different contact pressure or adjustable contact force. The holding element can either take on the holding function alone and independently of the sealing element or work together with the sealing element in this regard.

Abstract: The disclosure relates to an optical system, such as a projection exposure apparatus for semiconductor lithography, including a manipulable correction arrangement for reducing image aberrations. In some embodiments, the system includes at least one manipulator configured to reduce image aberrations. The manipulator can include at least one optical element which can be manipulated by at least one actuator. The manipulator can be formed in changeable fashion together with an actuator.

Abstract: The disclosure relates to an optical apparatus including a light source that emits light in the form of light pulses having a pulse frequency, and including at least one optical element. The disclosure also relates to a projection exposure machine including a pulsed light source and a projection objective, and to a method for modifying the imaging behavior of such an apparatus, such as in a projection exposure machine.

Abstract: An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.