Abstract: A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.

Abstract: An integrated flow sensor for determining a fluid flow is described.

Abstract: An integrated microvalve has a substrate, a first function layer applied to the substrate, and a second function layer applied to the first function layer, the first function layer being designed as a diaphragm in at least one valve area, the second function layer being removed in the valve area and in a fluid discharge area, and an anvil connected essentially only to the diaphragm being exposed from the substrate in the valve area, a plate being applied to the second function area to form a valve space.

Abstract: A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.

Abstract: The invention creates a micromechanical component, in particular an acceleration sensor, having a flexible spring device (F1, F2, F3) for the spring mounting of a mass (3) over a substrate (4), the flexible spring device (F1, F2, F3) being on the one hand connected with the mass (3) and being on the other hand anchored in the substrate (4). The flexible spring device (F1, F2, F3) has at least one flexible spring element (F2, F3) whose movability in relation to the substrate (4) is capable of being modified in order to modify the effective spring constant of the flexible spring device (F1, F2, F3).

Abstract: An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.

Abstract: A sensor for measuring a force is provided, which sensor includes a first sealed volume, a second sealed volume, a pressure diaphragm and a force diaphragm. The pressure diaphragm has a first side and a second side, with a pressure of the first sealed volume acting on the first side, and a pressure of the second sealed volume acting on the second side. The force diaphragm is exposed to a force, and the pressure of the first volume is dependent on the force acting on the force diaphragm.

Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: A micromechanical component includes a substrate and a movable structure situated on the surface of the substrate. The movable structure is movable parallel to the surface of the substrate. The structure is surrounded by a frame having a cap attached to it. In the area of the movable element, the cap has a stop limiting the movement of the movable element in a direction perpendicular to the surface of the substrate.

Abstract: A method for processing substrates, in which a photoresist layer is applied and structured on their surface. By blasting the substrate with particles, recesses are put into the surface of the substrate in those areas not covered by photoresist.

Abstract: The invention creates a micromechanical component, in particular an acceleration sensor, having a flexible spring device (F1, F2, F3) for the spring mounting of a mass (3) over a substrate (4), the flexible spring device (F1, F2, F3) being on the one hand connected with the mass (3) and being on the other hand anchored in the substrate (4).

Abstract: A micromechanical component is described, in particular an acceleration sensor or a rotational speed sensor having functional components which are movably suspended over a substrate, opposite surfaces of the functional components being movable toward one another. The opposite surfaces of the functional components are at least partially coated with a conductive film.

Abstract: A lead frame device having a lead frame made of copper, copper alloy or copper compound having a die pad area, within which a chip is to be mounted, and having a multiplicity of leads, which are arranged around the die pad area; and having a die pad made of silicon which is mounted in the die pad area on the lead frame to accommodate the chip.

Abstract: The proposal relates to an electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.

Abstract: A micromechanical cap structure and a corresponding manufacturing method are described, the cap structure having a substrate, in particular in the form of a wafer, having a cavity made therein. The cavity includes a bottom surface and two pairs of opposite parallel side wall sections. The cavity has at least one stabilizing wall section, which connects two side wall sections. This considerably increases the stability of the cap structure.

Abstract: A micromechanical component is described, in particular an acceleration sensor or a rotational speed sensor having a seismic mass device which is flexibly mounted using at least one double U spring and can be deflected in at least one direction by an external acceleration. At least one nap stop is provided to limit the deflection of the double U spring.

Abstract: A method for processing substrates, in which a photoresist layer is applied and structured on their surface. By blasting the substrate with particles, recesses are put into the surface of the substrate in those areas not covered by photoresist.

Abstract: A micromechanical device, in particular an acceleration sensor, includes a seismic mass which is resiliently supported on a substrate via a first flexural spring device and which can be deflected in at least one direction by an acceleration, the deflection being able to be limited by a stop device. The stop device has at least one limit stop that is resiliently supported on the substrate via a second flexural spring device, the second flexural spring device having a greater flexural strength than the first flexural spring device.

Abstract: A micromechanical component, in particular an acceleration sensor, having a seismic mass which is resiliently supported on a substrate via a cantilever spring device and which can be deflected by an acceleration in at least one direction, it being possible for the deflection of the seismic mass to be limited by a first limit limit stop device and the cantilever spring device being attached at the side of the seismic mass. A second limit limit stop device for limiting a bending of the cantilever spring device is provided which prevents the cantilever spring device from sticking to adjacent parts in the case of overload accelerations.

Abstract: A wafer stack with sensor elements hermetically sealed in caverns and a method of fabricating the sensors permitting a reduction in the size of the sensors formed after cutting the wafer stack and also yielding considerable savings in chip area in the manufacture of the wafer stack. The wafer stack includes bonding strips arranged between the individual sensor elements. The wafer stack is diced to form individual sensors by sawing in the middle through the bonding strips.