Abstract: A micromechanical component having a base part, a swiveling part, which has an electrically conductive material, and a swiveling part insulation which electrically insulates a first and a second section of the swiveling part from each other. A first flexible, electrically conductive connecting element connects the base part to the first swiveling part section, and a second flexible, electrically conductive connecting element connects the base part to the second swiveling part section.

Abstract: A micromirror system having at least two micromirrors, each suspended on a substrate wafer via at least one torsion spring. The axes of rotation of the micromirrors are disposed essentially perpendicular to each other in order to permit deflection of an optical beam in two directions essentially perpendicular to each other. The micromirrors and the torsion springs are patterned out of the substrate wafer and lie essentially in one plane.

Abstract: A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated.

Abstract: A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer.

Abstract: A method for reducing microcrack formation and crack growth in the glass carrier of a component having a micromechanical sensor element that is bonded to the glass carrier. The upper side of the glass carrier acts as a bonding surface for the sensor element. The rear side of the glass carrier, situated opposite the upper side, acts as a mounting surface for the component, and the glass carrier has side surfaces that connect the upper side and the rear side. In particular, the glass carrier is formed by a segment of a glass wafer into which at least the contours of the glass carrier have been stamped, so that at least the areas produced in this way of the side surfaces of the glass carrier and the rear side of the glass carrier form a surface that is largely closed and free of microcracks.

Abstract: A production method for a micromechanical component and a micromechanical component apparatus are provided encompassing the steps of: forming a housing having an incident light window, forming a multitude of optically active surfaces on a wafer, subdividing the wafer into a multitude of chips having at least one optically active surface in each case, which surface is designed in such a way that, at least in a deactivated operating mode of the chip, the optically active surface is situated in an initial position with respect to the chip, and affixing at least one of the chips inside the housing, the optically active surface of the chip in its initial position being aligned at an angle of inclination that is not equal to 0° and not equal to 180° with respect to the incident light window.

Abstract: A method for producing a micromechanical component for controlling a fluid flow and a component produced according to this method are described. The method for producing a micromechanical component for controlling a fluid flow includes: producing an oscillatory diaphragm on a surface of a substrate by forming an underlying cavity from the same side of the surface, covering the substrate with an intermediate layer, patterning the intermediate layer, and covering the intermediate layer with a covering layer sealing the micromechanical component. It is characterized by the fact that the intermediate layer is patterned in such a way that a sealing element of a fluid valve forms on the diaphragm, which element seals and/or surrounds a valve opening formed in the covering layer.

Abstract: A method for the plasma-free etching of silicon using the etching gas ClF3 or XeF2 and its use are provided. The silicon is provided having one or more areas to be etched as a layer on the substrate or as the substrate material itself. The silicon is converted into the mixed semiconductor SiGe by introducing germanium and is etched by supplying the etching gas ClF3 or XeF2. The introduction of germanium and the supply of the etching gas ClF3 or XeF2 may be performed at the same time or alternatingly. In particular, it is provided that the introduction of germanium be performed by implanting germanium ions in silicon.

Abstract: A micromirror system having at least two micromirrors, each suspended on a substrate wafer via at least one torsion spring. The axes of rotation of the micromirrors are disposed essentially perpendicular to each other in order to permit deflection of an optical beam in two directions essentially perpendicular to each other. The micromirrors and the torsion springs are patterned out of the substrate wafer and lie essentially in one plane.

Abstract: An integrated microvalve has a substrate, a first function layer applied to the substrate, and a second function layer applied to the first function layer, the first function layer being designed as a diaphragm in at least one valve area, the second function layer being removed in the valve area and in a fluid discharge area, and an anvil connected essentially only to the diaphragm being exposed from the substrate in the valve area, a plate being applied to the second function area to form a valve space.

Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.

Abstract: A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer.

Abstract: A sensor for measuring a force is provided, which sensor includes a first sealed volume, a second sealed volume, a pressure diaphragm and a force diaphragm. The pressure diaphragm has a first side and a second side, with a pressure of the first sealed volume acting on the first side, and a pressure of the second sealed volume acting on the second side. The force diaphragm is exposed to a force, and the pressure of the first volume is dependent on the force acting on the force diaphragm.

Abstract: An integrated flow sensor for determining a fluid flow is described.

Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.

Abstract: A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.

Abstract: An integrated flow sensor for determining a fluid flow is described.

Abstract: An integrated microvalve has a substrate, a first function layer applied to the substrate, and a second function layer applied to the first function layer, the first function layer being designed as a diaphragm in at least one valve area, the second function layer being removed in the valve area and in a fluid discharge area, and an anvil connected essentially only to the diaphragm being exposed from the substrate in the valve area, a plate being applied to the second function area to form a valve space.