Patents by Inventor Stefan Pinter

Stefan Pinter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110007376
    Abstract: A micromechanical component having a base part, a swiveling part, which has an electrically conductive material, and a swiveling part insulation which electrically insulates a first and a second section of the swiveling part from each other. A first flexible, electrically conductive connecting element connects the base part to the first swiveling part section, and a second flexible, electrically conductive connecting element connects the base part to the second swiveling part section.
    Type: Application
    Filed: November 21, 2008
    Publication date: January 13, 2011
    Inventors: Stefan Pinter, Joachim Fritz
  • Publication number: 20110006866
    Abstract: The present invention relates to a magnetic yoke (300) having a yoke core that has a magnet (202), on which a first yoke arm (210) and a second yoke arm (210) are developed in such a way that the magnet (202) and the two yoke arms (210) open up a yoke opening, and having a first pair of pole pieces (212), which extend into the yoke opening and are positioned at a distance to each other in a first direction in such a way that a first gap (214) is developed between the first pair of pole pieces (212) and having a second pair of pole pieces (254), which extend into the yoke opening and are positioned in a second direction, that is aligned perpendicular to the first direction, at a distance from each other in such a way that a second gap (256) is developed between the second pair of pole pieces (254). The present invention also relates to a micromechanical component having such a magnetic yoke (300).
    Type: Application
    Filed: December 4, 2008
    Publication date: January 13, 2011
    Inventors: Stefan Pinter, Joerg Muchow, Juergen Kober
  • Patent number: 7843620
    Abstract: A micromirror system having at least two micromirrors, each suspended on a substrate wafer via at least one torsion spring. The axes of rotation of the micromirrors are disposed essentially perpendicular to each other in order to permit deflection of an optical beam in two directions essentially perpendicular to each other. The micromirrors and the torsion springs are patterned out of the substrate wafer and lie essentially in one plane.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: November 30, 2010
    Assignee: Robert Bosch GmbH
    Inventor: Stefan Pinter
  • Publication number: 20100283147
    Abstract: A production method for chips, in which as many method steps as possible are carried out in the wafer composite, that is, in parallel for a plurality of chips disposed on a wafer. This is a method for producing a plurality of chips whose functionality is implemented on the basis of the surface layer of a substrate. In this method, the surface layer is patterned and at least one cavity is produced below the surface layer, so that the individual chip regions are connected to each other and/or to the rest of the substrate by suspension webs only, and/or so that the individual chip regions are connected to the substrate layer below the cavity via supporting elements in the region of the cavity. The suspension webs and/or supporting elements are cut when the chips are separated. The patterned and undercut surface layer of the substrate is embedded in a plastic mass before the chips are separated.
    Type: Application
    Filed: July 24, 2008
    Publication date: November 11, 2010
    Inventors: Torsten Kramer, Matthias Boehringer, Stefan Pinter, Hubert Benzel, Matthias Illing, Frieder Haag, Simon Ambruster
  • Patent number: 7740459
    Abstract: A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: June 22, 2010
    Assignee: Robert Bosch GmbH
    Inventors: Matthias Fuertsch, Hubert Benzel, Stefan Finkbeiner, Stefan Pinter, Frank Fischer, Heiko Stahl, Tjalf Pirk
  • Publication number: 20100109105
    Abstract: A method for reducing microcrack formation and crack growth in the glass carrier of a component having a micromechanical sensor element that is bonded to the glass carrier. The upper side of the glass carrier acts as a bonding surface for the sensor element. The rear side of the glass carrier, situated opposite the upper side, acts as a mounting surface for the component, and the glass carrier has side surfaces that connect the upper side and the rear side. In particular, the glass carrier is formed by a segment of a glass wafer into which at least the contours of the glass carrier have been stamped, so that at least the areas produced in this way of the side surfaces of the glass carrier and the rear side of the glass carrier form a surface that is largely closed and free of microcracks.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 6, 2010
    Inventor: Stefan PINTER
  • Publication number: 20100014147
    Abstract: A production method for a micromechanical component and a micromechanical component apparatus are provided encompassing the steps of: forming a housing having an incident light window, forming a multitude of optically active surfaces on a wafer, subdividing the wafer into a multitude of chips having at least one optically active surface in each case, which surface is designed in such a way that, at least in a deactivated operating mode of the chip, the optically active surface is situated in an initial position with respect to the chip, and affixing at least one of the chips inside the housing, the optically active surface of the chip in its initial position being aligned at an angle of inclination that is not equal to 0° and not equal to 180° with respect to the incident light window.
    Type: Application
    Filed: July 20, 2009
    Publication date: January 21, 2010
    Inventors: Stefan Pinter, Christoph Friese
  • Publication number: 20090307906
    Abstract: A method for producing a micromechanical component for controlling a fluid flow and a component produced according to this method are described. The method for producing a micromechanical component for controlling a fluid flow includes: producing an oscillatory diaphragm on a surface of a substrate by forming an underlying cavity from the same side of the surface, covering the substrate with an intermediate layer, patterning the intermediate layer, and covering the intermediate layer with a covering layer sealing the micromechanical component. It is characterized by the fact that the intermediate layer is patterned in such a way that a sealing element of a fluid valve forms on the diaphragm, which element seals and/or surrounds a valve opening formed in the covering layer.
    Type: Application
    Filed: July 10, 2007
    Publication date: December 17, 2009
    Applicant: NISSAN MOTOR CO., LTD
    Inventors: Tjalf Pirk, Stefan Pinter
  • Publication number: 20080254635
    Abstract: A method for the plasma-free etching of silicon using the etching gas ClF3 or XeF2 and its use are provided. The silicon is provided having one or more areas to be etched as a layer on the substrate or as the substrate material itself. The silicon is converted into the mixed semiconductor SiGe by introducing germanium and is etched by supplying the etching gas ClF3 or XeF2. The introduction of germanium and the supply of the etching gas ClF3 or XeF2 may be performed at the same time or alternatingly. In particular, it is provided that the introduction of germanium be performed by implanting germanium ions in silicon.
    Type: Application
    Filed: September 18, 2006
    Publication date: October 16, 2008
    Inventors: Hubert Benzel, Stefan Pinter, Christoph Schelling, Tjalf Pirk, Julian Gonska, Frank Klopf, Christina Leinenbach
  • Publication number: 20080144149
    Abstract: A micromirror system having at least two micromirrors, each suspended on a substrate wafer via at least one torsion spring. The axes of rotation of the micromirrors are disposed essentially perpendicular to each other in order to permit deflection of an optical beam in two directions essentially perpendicular to each other. The micromirrors and the torsion springs are patterned out of the substrate wafer and lie essentially in one plane.
    Type: Application
    Filed: December 7, 2007
    Publication date: June 19, 2008
    Inventor: Stefan Pinter
  • Patent number: 7299818
    Abstract: An integrated microvalve has a substrate, a first function layer applied to the substrate, and a second function layer applied to the first function layer, the first function layer being designed as a diaphragm in at least one valve area, the second function layer being removed in the valve area and in a fluid discharge area, and an anvil connected essentially only to the diaphragm being exposed from the substrate in the valve area, a plate being applied to the second function area to form a valve space.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: November 27, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Stefan Pinter, Tjalf Pirk
  • Patent number: 7273764
    Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: September 25, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink
  • Patent number: 7148077
    Abstract: A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.
    Type: Grant
    Filed: October 19, 2004
    Date of Patent: December 12, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Matthias Fuertsch, Stefan Pinter, Heribert Weber, Frank Fischer, Lars Metzger, Christoph Schelling, Frieder Sundermeier
  • Publication number: 20060186085
    Abstract: A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer.
    Type: Application
    Filed: July 7, 2004
    Publication date: August 24, 2006
    Inventors: Matthias Fuertsch, Hubert Benzel, Stefan Finkbeiner, Stefan Pinter, Frank Fischer, Heiko Stahl, Tjalf Pirk
  • Patent number: 7073400
    Abstract: A sensor for measuring a force is provided, which sensor includes a first sealed volume, a second sealed volume, a pressure diaphragm and a force diaphragm. The pressure diaphragm has a first side and a second side, with a pressure of the first sealed volume acting on the first side, and a pressure of the second sealed volume acting on the second side. The force diaphragm is exposed to a force, and the pressure of the first volume is dependent on the force acting on the force diaphragm.
    Type: Grant
    Filed: September 9, 2003
    Date of Patent: July 11, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Stefan Pinter, Helmut Grutzeck
  • Patent number: 7059186
    Abstract: An integrated flow sensor for determining a fluid flow is described.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: June 13, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Stefan Pinter, Tjalf Pirk
  • Publication number: 20050230708
    Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.
    Type: Application
    Filed: January 3, 2005
    Publication date: October 20, 2005
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink
  • Patent number: 6936902
    Abstract: A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: August 30, 2005
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink
  • Publication number: 20050186703
    Abstract: A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.
    Type: Application
    Filed: January 21, 2005
    Publication date: August 25, 2005
    Inventors: Kurt Weiblen, Hubert Benzel, Stefan Pinter, Roland Guenschel, Frieder Haag
  • Publication number: 20050178195
    Abstract: An integrated flow sensor for determining a fluid flow is described.
    Type: Application
    Filed: December 23, 2004
    Publication date: August 18, 2005
    Inventors: Stefan Pinter, Tjalf Pirk