Abstract: A memory device includes a first state transistor and a second state transistor having a common control gate. A first selection transistor is buried in the semiconductor body and coupled to the first state transistor so that current paths of the first selection transistor and first state transistor are coupled in series. A second selection transistor is buried in the semiconductor body and coupled to the second state transistor so that current paths of the second selection transistor and second state transistor are coupled in series. The first and second selection transistors have a common buried selection gate. A dielectric region is located between the common control gate and the semiconductor body. A first bit line is coupled to the first state transistor and a second bit line is coupled to the second state transistor.

Abstract: An integrated circuit includes a semiconductor substrate with an electrically isolated semiconductor well. An upper trench isolation extends from a front face of the semiconductor well to a depth located a distance from the bottom of the well. Two additional isolating zones are electrically insulated from the semiconductor well and extending inside the semiconductor well in a first direction and vertically from the front face to the bottom of the semiconductor well. At least one hemmed resistive region is bounded by the two additional isolating zones, the upper trench isolation and the bottom of the semiconductor well. Electrical contacts are electrically coupled to the hemmed resistive region.

Abstract: In accordance with an embodiment, a physically unclonable function device includes a set of transistor pairs, transistors of the set of transistor pairs having a randomly distributed effective threshold voltage belonging to a common random distribution; a differential read circuit configured to measure a threshold difference between the effective threshold voltages of transistors of transistor pairs of the set of transistor pairs, and to identify a transistor pair in which the measured threshold difference is smaller than a margin value as being an unreliable transistor pair; and a write circuit configured to shift the effective threshold voltage of a transistor of the unreliable transistor pair to be inside the common random distribution.

Abstract: The present disclosure relates to a memory cell comprising a vertical selection gate extending in a trench made in a substrate, a floating gate extending above the substrate, and a horizontal control gate extending above the floating gate, wherein the floating gate also extends above a portion of the vertical selection gate over a non-zero overlap distance. Application mainly to the production of a split gate memory cell programmable by hot-electron injection.

Abstract: The array of diodes comprises a matrix plane of diodes arranged according to columns in a first direction and according to rows in a second direction orthogonal to the first direction. The said diodes comprise a cathode region of a first type of conductivity and an anode region of a second type of conductivity, the said cathode and anode regions being superposed and disposed on an insulating layer situated on top of a semiconductor substrate.

Abstract: A memory device includes a first state transistor and a second state transistor having a common control gate. A first selection transistor is buried in the semiconductor body and coupled to the first state transistor so that current paths of the first selection transistor and first state transistor are coupled in series. A second selection transistor is buried in the semiconductor body and coupled to the second state transistor so that current paths of the second selection transistor and second state transistor are coupled in series. The first and second selection transistors have a common buried selection gate. A dielectric region is located between the common control gate and the semiconductor body. A first bit line is coupled to the first state transistor and a second bit line is coupled to the second state transistor.

Abstract: The present disclosure relates to a memory cell comprising a vertical selection gate extending in a trench made in a substrate, a floating gate extending above the substrate, and a horizontal control gate extending above the floating gate, wherein the floating gate also extends above a portion of the vertical selection gate over a non-zero overlap distance. Application mainly to the production of a split gate memory cell programmable by hot-electron injection.

Abstract: Each memory cell is of the type with charge trapping in a dielectric interface and includes a state transistor selectable by a vertical selection transistor buried in a substrate and comprising a buried selection gate. The columns of memory cells include pairs of twin memory cells. The two selection transistors of a pair of twin memory cells have a common selection gate and the two state transistors of a pair of twin memory cells have a common control gate. The device also includes, for each pair of twin memory cells, a dielectric region situated between the control gate and the substrate and overlapping the common selection gate so as to form on either side of the selection gate the two charge-trapping dielectric interfaces respectively dedicated to the two twin memory cells.

Abstract: An integrated circuit includes a semiconductor substrate with an electrically isolated semiconductor well. An upper trench isolation extends from a front face of the semiconductor well to a depth located a distance from the bottom of the well. Two additional isolating zones are electrically insulated from the semiconductor well and extending inside the semiconductor well in a first direction and vertically from the front face to the bottom of the semiconductor well. At least one hemmed resistive region is bounded by the two additional isolating zones, the upper trench isolation and the bottom of the semiconductor well. Electrical contacts are electrically coupled to the hemmed resistive region.

Abstract: The present disclosure relates to a memory cell comprising a vertical selection gate extending in a trench made in a substrate, a floating gate extending above the substrate, and a horizontal control gate extending above the floating gate, wherein the floating gate also extends above a portion of the vertical selection gate over a non-zero overlap distance. Application mainly to the production of a split gate memory cell programmable by hot-electron injection.

Abstract: A split-gate memory cell includes a state transistor possessing a control gate and a floating gate and a selection transistor possessing a selection gate. The split-gate memory cell is programmed by applying, during a programming duration, a first voltage to the control gate, a second voltage to a drain of the state transistor and a third voltage to the selection gate of the selection transistor. The third voltage is transitioned during the programming duration between a first value and a second value greater than the first value.

Abstract: An integrated circuit includes a semiconductor substrate with an electrically isolated semiconductor well. An upper trench isolation extends from a front face of the semiconductor well to a depth located a distance from the bottom of the well. Two additional isolating zones are electrically insulated from the semiconductor well and extending inside the semiconductor well in a first direction and vertically from the front face to the bottom of the semiconductor well. At least one hemmed resistive region is bounded by the two additional isolating zones, the upper trench isolation and the bottom of the semiconductor well. Electrical contacts are electrically coupled to the hemmed resistive region.

Abstract: A semiconductor region includes an isolating region which delimits a working area of the semiconductor region. A trench is located in the working area and further extends into the isolating region. The trench is filled by an electrically conductive central portion that is insulated from the working area by an isolating enclosure. A cover region is positioned to cover at least a first part of the filled trench, wherein the first part is located in the working area. A dielectric layer is in contact with the filled trench. A metal silicide layer is located at least on the electrically conductive central portion of a second part of the filled trench, wherein the second part is not covered by the cover region.

Abstract: A method of manufacturing first, second, and third transistors of different types inside and on top of first, second, and third semiconductor areas of an integrated circuit, including the steps of: a) depositing a first dielectric layer and a first polysilicon layer on the third areas; b) depositing a second dielectric layer on the second areas; c) depositing an interface layer on the first areas; d) depositing a layer of a material of high permittivity and then a layer of a metallic material on the first and second areas; e) depositing a second polysilicon layer on the first, second, and third areas; f) defining the gates of the transistors in the third areas; and g) defining the gates of the transistors in the first and second areas.

Abstract: A capacitive element includes a trench extending vertically into a well from a first side. The trench is filled with a conductive central section clad with an insulating cladding. The capacitive element further includes a first conductive layer covering a first insulating layer that is located on the first side and a second conductive layer covering a second insulating layer that is located on the first conductive layer. The conductive central section and the first conductive layer are electrically connected to form a first electrode of the capacitive element. The second conductive layer and the well are electrically connected to form a second electrode of the capacitive element. The insulating cladding, the first insulating layer and the second insulating layer form a dielectric region of the capacitive element.

Abstract: An integrated circuit includes an insulating layer overlying a semiconductor substrate. A semiconductor layer of a first conductivity type overlies the insulating layer. A plurality of projecting regions that are spaced apart from each other overly the semiconductor layer. A sequence of PN junctions are in the semiconductor layer. Each PN junction is located at an edge of an associated projecting region. Each PN junction also extends vertically from an upper surface of the semiconductor layer to the insulating layer.

Abstract: Various embodiments provide a memory cell that includes a vertical selection gate, a floating gate extending above the substrate, wherein the floating gate also extends above a portion of the vertical selection gate, over a non-zero overlap distance, the memory cell comprising a doped region implanted at the intersection of a vertical channel region extending opposite the selection gate and a horizontal channel region extending opposite the floating gate.

Abstract: A method can be used to make a semiconductor device. A number of projecting regions are formed over a first semiconductor layer that has a first conductivity type. The first semiconductor layer is located on an insulating layer that overlies a semiconductor substrate. The projecting regions are spaced apart from each other. Using the projecting regions as an implantation mask, dopants having a second conductivity type are implanted into the first semiconductor layer, so as to form a sequence of PN junctions forming diodes in the first semiconductor layer. The diodes vertically extend from an upper surface of the first semiconductor layer to the insulating layer.

Abstract: The array of diodes comprises a matrix plane of diodes arranged according to columns in a first direction and according to rows in a second direction orthogonal to the first direction. The said diodes comprise a cathode region of a first type of conductivity and an anode region of a second type of conductivity, the said cathode and anode regions being superposed and disposed on an insulating layer situated on top of a semiconductor substrate.

Abstract: A method of manufacturing first, second, and third transistors of different types inside and on top of first, second, and third semiconductor areas of an integrated circuit, including the steps of: a) depositing a first dielectric layer and a first polysilicon layer on the third areas; b) depositing a second dielectric layer on the second areas; c) depositing an interface layer on the first areas; d) depositing a layer of a material of high permittivity and then a layer of a metallic material on the first and second areas; e) depositing a second polysilicon layer on the first, second, and third areas; f) defining the gates of the transistors in the third areas; and g) defining the gates of the transistors in the first and second areas.