Abstract: The disclosure relates to a method of manufacturing vertical gate transistors in a semiconductor substrate, comprising implanting, in the depth of the substrate, a doped isolation layer, to form a source region of the transistors; forming, in the substrate, parallel trench isolations and second trenches perpendicular to the trench isolations, reaching the isolation layer, and isolated from the substrate by a first dielectric layer; depositing a first conductive layer on the surface of the substrate and in the second trenches; etching the first conductive layer to form the vertical gates of the transistors, and vertical gate connection pads between the extremity of the vertical gates and an edge of the substrate, while keeping a continuity zone in the first conductive layer between each connection pad and a vertical gate; and implanting doped regions on each side of the second trenches, to form drain regions of the transistors.

Abstract: The disclosure relates to an integrated circuit comprising at least two memory cells formed in a semiconductor substrate, and a buried gate common to the selection transistors of the memory cells. The buried gate has a first section of a first depth extending in front of vertical channel regions of the selection transistors, and at least a second section of a second depth greater than the first depth penetrating into a buried source line. The lower side of the buried gate is bordered by a doped region forming a source region of the selection transistors and reaching the buried source line at the level where the second section of the buried gate penetrates into the buried source line, whereby the source region is coupled to the buried source line.

Abstract: The disclosure relates to a method of reading and writing memory cells, each including a charge accumulation transistor in series with selection transistor, including applying a selection voltage to a gate of the selection transistor of the memory cell; applying a read voltage to a control gate of the charge accumulation transistor of the memory cell; applying the selection voltage to a gate of the selection transistor of a second memory cell coupled to the same bitline; and applying an inhibition voltage to a control gate of the charge accumulation transistor of the second memory cell, to maintain the transistor in a blocked state.

Abstract: An integrated circuit is formed on a semiconductor substrate and includes a trench conductor and a first transistor formed on the surface of the substrate. The transistor includes: a transistor gate structure, a first doped region extending in the substrate between a first edge of the gate structure and an upper edge of the trench conductor, and a first spacer formed on the first edge of the gate structure and above the first doped region. The first spacer completely covers the first doped region and a silicide is present on the trench conductor but is not present on the surface of the first doped region.

Abstract: The disclosure relates to a method of manufacturing vertical gate transistors in a semiconductor substrate, comprising implanting, in the depth of the substrate, a doped isolation layer, to form a source region of the transistors; forming, in the substrate, parallel trench isolations and second trenches perpendicular to the trench isolations, reaching the isolation layer, and isolated from the substrate by a first dielectric layer; depositing a first conductive layer on the surface of the substrate and in the second trenches; etching the first conductive layer to form the vertical gates of the transistors, and vertical gate connection pads between the extremity of the vertical gates and an edge of the substrate, while keeping a continuity zone in the first conductive layer between each connection pad and a vertical gate; and implanting doped regions on each side of the second trenches, to form drain regions of the transistors.

Abstract: The present disclosure relates to a method for manufacturing a non-volatile memory on a semiconductive substrate, comprising the steps of implanting in the depth of the substrate a first doped region forming a source region of selection transistors, forming in the substrate a buried gate comprising deep parts extending between an upper face of the substrate and the first doped region, implanting between two adjacent deep parts of the buried gate, a second doped region forming a common drain region of common selection transistors of a pair of memory cells, the selection transistors of the pair of memory cells thus having channel regions extending between the first doped region and the second doped region, along faces opposite the two buried gate adjacent deep parts, and implanting along opposite upper edges of the buried gate, third doped regions forming source regions of charge accumulation transistors.

Abstract: The disclosure relates to an integrated circuit comprising at least two memory cells formed in a semiconductor substrate, and a buried gate common to the selection transistors of the memory cells. The buried gate has a first section of a first depth extending in front of vertical channel regions of the selection transistors, and at least a second section of a second depth greater than the first depth penetrating into a buried source line. The lower side of the buried gate is bordered by a doped region forming a source region of the selection transistors and reaching the buried source line at the level where the second section of the buried gate penetrates into the buried source line, whereby the source region is coupled to the buried source line.

Abstract: The disclosure relates to a method of reading and writing memory cells, each including a charge accumulation transistor in series with selection transistor, including applying a selection voltage to a gate of the selection transistor of the memory cell; applying a read voltage to a control gate of the charge accumulation transistor of the memory cell; applying the selection voltage to a gate of the selection transistor of a second memory cell coupled to the same bitline; and applying an inhibition voltage to a control gate of the charge accumulation transistor of the second memory cell, to maintain the transistor in a blocked state.

Abstract: An integrated circuit including an insulating layer having first and second opposite surfaces. The circuit includes, in a first area, first conductive portions of a first conductive material, located in the insulating layer, flush with the first surface and continued by first vias of the first conductive material, of smaller cross-section and connecting the first conductive portions to the second surface. The circuit further includes, in a second area, second conductive portions of a second material different from the first conductive material and arranged on the first surface and second vias of the first conductive material, in contact with the second conductive portions and extending from the first surface to the second surface.

Abstract: A method for manufacturing an EEPROM cell including a dual-gate MOS transistor. The method includes the steps of providing a semiconductor substrate covered with a stack of first and second layers, forming at least one first opening in the second layer, forming, in the first layer, a second opening continuing the first opening, enlarging the first opening by isotropic etching, forming a first doped region in the substrate by implantation through the first enlarged opening, the first doped region taking part in the forming of the transistor drain or source, forming, in the third opening, a thinned-down insulating portion thinner than the first layer, and forming the gates of the MOS transistor at least partially extending over the thinned-down insulating portion.

Abstract: An integrated circuit including an insulating layer having first and second opposite surfaces. The circuit includes, in a first area, first conductive portions of a first conductive material, located in the insulating layer, flush with the first surface and continued by first vias of the first conductive material, of smaller cross-section and connecting the first conductive portions to the second surface. The circuit further includes, in a second area, second conductive portions of a second material different from the first conductive material and arranged on the first surface and second vias of the first conductive material, in contact with the second conductive portions and extending from the first surface to the second surface.

Abstract: A method for manufacturing an EEPROM cell including a dual-gate MOS transistor. The method includes the steps of providing a semiconductor substrate covered with a stack of first and second layers, forming at least one first opening in the second layer, forming, in the first layer, a second opening continuing the first opening, enlarging the first opening by isotropic etching, forming a first doped region in the substrate by implantation through the first enlarged opening, the first doped region taking part in the forming of the transistor drain or source, forming, in the third opening, a thinned-down insulating portion thinner than the first layer, and forming the gates of the MOS transistor at least partially extending over the thinned-down insulating portion.