Abstract: A method of forming a window cap wafer (WCW) structure for semiconductor devices includes machining a plurality of cavities into a front side of a first substrate; bonding the first substrate to a second substrate, at the front side of the first substrate; removing a back side of the first substrate so as to expose the plurality of cavities, thereby defining the WCW structure comprising the second substrate and a plurality of vertical supports comprised of material of the first substrate.

Abstract: A pixel structure, which may be used for infrared bolometers or other microelectromechanical systems (MEMS) devices, configured to increase immunity of the pixel to molecular heat transfer and reduce the vacuum requirements for a wafer level packaged device incorporating the pixel or an array thereof. In one example, the pixel has a perforated body or discontinuous surface structure.

Abstract: A receiver chip for use in an imaging system includes a plurality of receiver dies, each of the receiver dies comprising one or more receiver circuits; a die interconnection layer located on top of the plurality of receiver dies; a quarter wave dielectric layer located on top of the die interconnection layer; and a plurality of antennae located on the quarter wave dielectric layer, each of the plurality of antennae corresponding to a respective receiver circuit, wherein the plurality of antennae are connected to the one or more receiver circuits through the quarter wave dielectric layer and the die interconnection layer by respective vias, such that a distance between a topmost layer of the die interconnection layer and the plurality of antennae is determined by a thickness of the quarter wave dielectric layer.

Abstract: A method for manufacturing a wafer level packaged focal plane array, in accordance with certain embodiments, includes forming a detector wafer, which may include forming detector arrays and read-out circuits. The method may also include forming a lid wafer. Forming the lid wafer may include polishing a surface of a magnetically confined Czochralski (MCZ) wafer, bonding a Czochralski wafer to the MCZ wafer, and forming pockets in the Czochralski wafer. Each pocked may expose a portion of the polished surface of the MCZ wafer. The method may further include bonding the lid wafer and the detector wafer together such that the each detector array and read-out circuit are sealed within a different pocket, thereby forming a plurality of wafer level packaged focal plane arrays. The method may additionally include separating at least one wafer level packaged focal plan array from the plurality of wafer level packaged focal plane arrays.

Abstract: An infrared thermal imaging system includes a focal plane array (FPA) of infrared detectors, read out integrated circuitry (ROIC) operatively coupled to the FPA, and a microcontroller having at least one video display interface operatively coupled to the ROIC. The FPA is configured to generate an output signal in response to infrared radiation impinging upon the infrared detectors. The microcontroller is configured to send data to the ROIC via the at least one video display interface, the data including non-uniformity correction terms for correcting non-uniformities of the FPA.

Abstract: According one embodiment, a non-heterodyne radiation imager includes a substrate having a ground plane layer. The radiation imager also includes a plurality of antenna elements operable to receive radiative input. Each support element of a plurality of support elements mechanically couples an antenna element of the plurality of antenna elements to the substrate. A plurality of energy detectors is operable to measure the radiative input received by the plurality of antenna elements.

Abstract: According to certain embodiments, foveal array elements of a foveal region of a focal plane array are sampled at a faster sampling rate to yield foveal array data. Peripheral array elements of a peripheral region of the focal plane array are sampled at a slower sampling rate or sparser sampling density to yield peripheral array data. The foveal array data is processed to yield foveal image data for a foveal region of a display. The peripheral array data is processed to yield peripheral image data for a peripheral region of the display.

Abstract: According one embodiment, a non-heterodyne radiation imager includes a substrate having a ground plane layer. The radiation imager also includes a plurality of antenna elements operable to receive radiative input. Each support element of a plurality of support elements mechanically couples an antenna element of the plurality of antenna elements to the substrate. A plurality of energy detectors is operable to measure the radiative input received by the plurality of antenna elements.

Abstract: According one embodiment, a millimeter-wave radiation imaging array includes a plurality of antenna elements configured to receive millimeter-wave radiative input. Each lenslet of a plurality of lenslets are coupled to one of the plurality of antenna elements such that no air exists between each lenslet and the one of the plurality of antenna elements. Each lenslet has a spherical portion being operable to direct the radiative input towards the one of the plurality of antenna elements. An energy detector is coupled to the plurality of antenna elements opposite the plurality of lenslets and operable to measure the radiative input received by the plurality of antenna elements.

Abstract: According to some embodiments, a camera includes a multi-chip system in a package (MCSiP). The MCSiP comprising a set of electronics, an encapsulate, and a plurality of interconnects. The set of electronics includes a plurality of bare integrated circuit dies and other passive or active electronic components. Each die is operable to provide a functional component of a computing system operable to receive a signal describing electromagnetic radiation detected by an imaging sensor and facilitate generating an image according to the signal. The encapsulate comprises an adhesive molding compound deposited outwardly from the set of electronics in order to hold the set of electronics in position. The interconnects communicatively couple each die to other dies, the other electronic components, or components external to the MCSiP.

Abstract: According to one embodiment of the present invention, a system for viewing an area includes a dewar and an optical system positioned within the dewar. The dewar permits operation of the flux detector at cryogenic temperatures, in some embodiments. The optical system includes an infrared radiation system capable of focusing one or more light beams. The inclusion of the optical system within the cryogenic space of the dewar allows reduction of the overall system length and weight, if desired.

Abstract: A method for manufacturing a wafer level packaged focal plane array, in accordance with certain embodiments, includes forming a detector wafer, which may include forming detector arrays and read-out circuits. The method may also include forming a lid wafer. Forming the lid wafer may include polishing a surface of a magnetically confined Czochralski (MCZ) wafer, bonding a Czochralski wafer to the MCZ wafer, and forming pockets in the Czochralski wafer. Each pocked may expose a portion of the polished surface of the MCZ wafer. The method may further include bonding the lid wafer and the detector wafer together such that the each detector array and read-out circuit are sealed within a different pocket, thereby forming a plurality of wafer level packaged focal plane arrays. The method may additionally include separating at least one wafer level packaged focal plan array from the plurality of wafer level packaged focal plane arrays.

Abstract: According to one embodiment, a method includes receiving a light beam at an anti-reflective layer of optically transmissive material. The anti-reflective layer has an outer surface disposed within a recess of a protective layer of optically transmissive material, such that the outer surface is protected by the recess and the protective layer from being contacted. The outer surface is further disposed along an optical path of an optical device disposed inwardly from the outer surface. The anti-reflective layer has an average cross-sectional thickness that is less than an average cross-sectional thickness of the protective layer. The method further includes modulating the light beam using the anti-reflective layer.

Abstract: In accordance with particular embodiments, a method for packaging an incident radiation detector includes depositing an opaque solder resistant material on a first surface of a transparent lid substrate configured to cover at least one detector. The method also includes forming at least one cavity in the lid substrate. The method further includes forming a first portion of at least one hermetic seal ring on the opaque solder resistant material. The first portion of each hermetic seal ring surrounds a perimeter of a corresponding cavity in the lid substrate. The method also includes aligning the first portion of the at least one hermetic seal ring with a second portion of the at least one hermetic seal ring. The method additionally includes bonding the first portion of the at least one hermetic seal ring with the second portion of the at least one hermetic seal ring with solder.

Abstract: According to one embodiment of the present invention, a system for viewing an area includes a dewar and an optical system positioned within the dewar. The dewar permits operation of the flux detector at cryogenic temperatures, in some embodiments. The optical system includes an infrared radiation system capable of focusing one or more light beams. The inclusion of the optical system within the cryogenic space of the dewar allows reduction of the overall system length and weight, if desired.

Abstract: According to one embodiment of the present invention, a system for viewing an area includes a dewar and an optical system positioned within the dewar. The dewar permits operation of the flux detector at cryogenic temperatures, in some embodiments. The optical system includes an infrared radiation system capable of focusing one or more light beams. The inclusion of the optical system within the cryogenic space of the dewar allows reduction of the overall system length and weight, if desired.

Abstract: According to certain embodiments, foveal array elements of a foveal region of a focal plane array are sampled at a faster sampling rate to yield foveal array data. Peripheral array elements of a peripheral region of the focal plane array are sampled at a slower sampling rate or sparser sampling density to yield peripheral array data. The foveal array data is processed to yield foveal image data for a foveal region of a display. The peripheral array data is processed to yield peripheral image data for a peripheral region of the display.

Abstract: According to one embodiment of the present invention, a system for viewing an area includes a dewar and an optical system positioned within the dewar. The dewar permits operation of the flux detector at cryogenic temperatures, in some embodiments. The optical system includes an infrared radiation system capable of focusing one or more light beams. The inclusion of the optical system within the cryogenic space of the dewar allows reduction of the overall system length and weight, if desired.

Abstract: In one aspect, a method is provided to track performance of a strategy to perform an analysis on a product using a global portal system. The method includes providing the strategy to customers and obtaining, from the customers, customer input relating to the performance of at least some products and corresponding components. For each customer who provides customer input, the method further includes providing the customer input to the system to perform a relative analysis on the components of the corresponding product and using the results of the relative analysis to determine whether a specific analysis is to be performed and on which of the components. If a specific analysis is to be performed, the specific analysis is performed on the determined components using the system and using results of the specific analysis to provide service and/or operational recommendations for the corresponding product to the customer.

Abstract: A unit cell (10) of a readout integrated circuit is constructed and operated so as to temporally align an image obtained in a first spectral band with a an image obtained in a second spectral band. A method operates, during a frame period, to sub-frame average a first signal detected in the first spectral band by a multi-spectral detector (12), to sub-frame average a first signal detected in the second spectral band by the multi-spectral detector, and to sub-frame average a second signal detected in the first spectral band by the multi-spectral detector. The method then reads out the sub-frame averaged signals for each spectral band. The sub-frame averaged may be read out simultaneously from the unit cell.