Abstract: In one embodiment, an in-rush limiter is configured to control an output voltage to increase at a rate that is independent of the load that is powered by the in-rush limiter.

Abstract: In one embodiment, a vertical N-channel transistor is coupled in a high side configuration to control a current through an LED.

Abstract: In one embodiment, a transistor is formed to conduct current in both directions through the transistor.

Abstract: In one embodiment, a power switch device (33) includes a first MOSFET device 41 and a second MOSFET device (42). A split gate structure (84) including a first gate electrode (48,87) controls the first MOSFET device (41). A second gate electrode (49,92) controls the second MOSFET device (42). A current limit device (38) is coupled to the first gate electrode (48,97) to turn on the first MOSFET device during a current limit mode. A comparator device (36) is coupled to the second gate electrode (49,92) to turn on the second MOSFET device (42) when the power switch device (33) is no longer in current limit mode.

Abstract: A method of providing a Transient Voltage Suppression (TVS) device is described utilizing a Metal Oxide Semiconductor (MOS) structure and an Insulated Gate Bipolar Transistor (IGBT) structure. The MOS based TVS devices offer reduced leakage current with reduced clamp voltages between 0.5 and 5 volts. Trench MOS based TVS device (72) provides an enhanced gain operation, while device (88) provides a top side drain contact. The high gain MOS based TVS devices provide increased control over clamp voltage variation.

Abstract: A method of providing a Transient Voltage Suppression (TVS) device is described utilizing a Metal Oxide Semiconductor (MOS) structure and an Insulated Gate Bipolar Transistor (IGBT) structure. The MOS based TVS devices offer reduced leakage current with reduced clamp voltages between 0.5 and 5 volts. Trench MOS based TVS device (72) provides an enhanced gain operation, while device (88) provides a top side drain contact. The high gain MOS based TVS devices provide increased control over clamp voltage variation.

Abstract: In one embodiment, a power switch device (33) includes a first MOSFET device 41 and a second MOSFET device (42). A split gate structure (84) including a first gate electrode (48,87) controls the first MOSFET device (41). A second gate electrode (49,92) controls the second MOSFET device (42). A current limit device (38) is coupled to the first gate electrode (48,97) to turn on the first MOSFET device during a current limit mode. A comparator device (36) is coupled to the second gate electrode (49,92) to turn on the second MOSFET device (42) when the power switch device (33) is no longer in current limit mode.

Abstract: A method of forming medium breakdown voltage vertical transistors (11) and lateral transistors (12, 13) on the same substrate (14) provides for optimizing the epitaxial layer (16) for the lateral transistors (12, 13). The vertical transistor (11) is formed in a well (18) that has a lower resistivity than the epitaxial layer (16) to provide the required low on-resistance for the vertical power transistor (11).

Abstract: A method of forming medium breakdown voltage vertical transistors (11) and lateral transistors (12, 13) on the same substrate (14) provides for optimizing the epitaxial layer (16) for the lateral transistors (12, 13). The vertical transistor (11) is formed in a well (18) that has a lower resistivity than the epitaxial layer (16) to provide the required low on-resistance for the vertical power transistor (11).

Abstract: A protection circuit (10) is formed to protected a load (11) when a short circuit develops during operation of the load (11). A load transistor (18) is formed to couple the load to a voltage return terminal. A disable transistor (19) is formed to disable the load transistor (18) when a short circuit occurs.

Abstract: A method of providing a Transient Voltage Suppression (TVS) device is described utilizing a Metal Oxide Semiconductor (MOS) structure and an Insulated Gate Bipolar Transistor (IGBT) structure. The MOS based TVS devices offer reduced leakage current with reduced clamp voltages between 0.5 and 5 volts. Trench MOS based TVS device (72) provides an enhanced gain operation, while device (88) provides a top side drain contact. The high gain MOS based TVS devices provide increased control over clamp voltage variation.

Abstract: A method of providing a Transient Voltage Suppression (TVS) device is described utilizing a Metal Oxide Semiconductor (MOS) structure and an Insulated Gate Bipolar Transistor (IGBT) structure. The MOS based TVS devices offer reduced leakage current with reduced clamp voltages between 0.5 and 5 volts. Trench MOS based TVS device (72) provides an enhanced gain operation, while device (88) provides a top side drain contact. The high gain MOS based TVS devices provide increased control over clamp voltage variation.

Abstract: A method of providing a Transient Voltage Suppression (TVS) device is described utilizing a Metal Oxide Semiconductor (MOS) structure and an Insulated Gate Bipolar Transistor (IGBT) structure. The MOS based TVS devices offer reduced leakage current with reduced clamp voltages between 0.5 and 5 volts. Trench MOS based TVS device (72) provides an enhanced gain operation, while device (88) provides a top side drain contact. The high gain MOS based TVS devices provide increased control over clamp voltage variation.

Abstract: A semiconductor device (10) is formed that is bi-lateral and has a voltage blocking capability that is well suited to applications involving portable electronics. The semiconductor device has an epitaxial layer (14) that is formed on a semiconductor substrate (11). A doped region (24) is formed that extends from a top surface (16) of the epitaxial layer (14) to the underlying semiconductor substrate (11). The semiconductor device (10) has a source region (31) that is separated from the doped region (24) to provide a channel region (29). The channel region (29) is modulated by a gate structure (20) to determine if a current flow should be allowed through semiconductor device (10) or if semiconductor device (10) is to provide voltage blocking capability.

Abstract: Depletion mode pass transistor (38) accepts input voltage Vin and provides regulated output voltage Vout. The regulated output voltage is referenced to the threshold voltage of MOSFET (40) and is directly proportional to the ratio of resistors (50 and 52). MOSFET (58) provides enabling and disabling of voltage regulator (54). Multiple voltage regulators (FIG. 5) having multiple output potentials are realized on the same semiconductor die producing the same threshold potential for MOSFET's (40), whereby the output potentials are selectable using the ratio of resistors 50 and 52. Constant current source (56) reduces output voltage variation due to input voltage variation.

Abstract: A method of providing a Transient Voltage Suppression (TVS) device is described utilizing a Metal Oxide Semiconductor (MOS) structure and an Insulated Gate Bipolar Transistor (IGBT) structure. The MOS based TVS devices offer reduced leakage current with reduced clamp voltages between 0.5 and 5 volts. Trench MOS based TVS device (72) provides an enhanced gain operation, while device (88) provides a top side drain contact. The high gain MOS based TVS devices provide increased control over clamp voltage variation.

Abstract: An integrated circuit (10) for driving an ignition coil (14) has a first transistor (30) providing a coil current (ICOIL) at a first lead (22) of the integrated circuit. A second transistor (32) has a collector coupled to the first lead and an emitter coupled to a gate electrode of the first transistor. A gate electrode of the second transistor is coupled to a second lead (23) of the integrated circuit for receiving a control signal (VENABLE).

Abstract: A semiconductor device (10) having a termination structure (25) and a reduced on-resistance. The termination structure (25) is fabricated using the same processing steps that were used for manufacturing an active device region (21). The termination structure (25) and the active device region (21) are formed by etching trenches (22, 23) into a drift layer (14). The trenches (22, 23) are filled with a doped polysilicon trench fill material (24), which is subsequently planarized. The semiconductor device (10) is formed in the trenches (22) filled with the polysilicon trench fill material (24) that are in the active region. The trenches (23) filled with the polysilicon trench fill material (24) in a termination region serve as termination structures.

Abstract: A load driver circuit (10) includes an output driver (11) suitable for driving an inductive load (13). An output clamp circuit (15) clamps the output (12) to a high voltage during turn-off of the output driver (11). An open load detect circuit (26) clamps the output (12) to a lower voltage when the load (13) has an open circuit fault. A power fault voltage detect circuit (28) clamps the output (12) to another low voltage during a power fault condition.

Abstract: A load driver circuit (10) includes an output driver (11) suitable for driving an inductive load (13). An output clamp circuit (15) clamps the output (12) to a high voltage during turn-off of the output driver (11). An open load detect circuit (26) clamps the output (12) to a lower voltage when the load (13) has an open circuit fault. A power fault voltage detect circuit (28) clamps the output (12) to another low voltage during a power fault condition.