Abstract: Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Abstract: An electronic device for providing tactile feedback is provided. The electronic device may provide tactile feedback using any suitable approach, including for example vibration, heat, electrical, visual, or any other type of feedback. The electronic device may provide tactile feedback in response to detecting any particular status of the electronic device, receiving any particular input, or detecting any suitable communication received by the electronic device. For example, the electronic device may provide tactile feedback in response to identifying the current network of the device, the status of a particular electronic device component, or any other electronic device status. As another example, the electronic device may provide tactile feedback in response to receiving a particular type of communication, or in response to receiving a communication from a particular contact.

Abstract: An electronic device may have a rigid support structure to which electrical components are mounted. The rigid support structure may be an electronic device housing structure such as a housing wall having openings that receive the electrical components. The electrical components may have electrical component connectors. A printed circuit board may be used to convey signals for the electrical components. Connectors may be mounted to the printed circuit board. Lateral shift accommodation structures may be formed between the electrical component connectors and the electrical components or in the vicinity of the connectors on the printed circuit to allow the connectors on the printed circuit to mate with the electrical component connectors of the rigidly mounted electrical components.

Abstract: An electronic device. The electronic device may include a battery, and a charging system in electronic communication with the battery. The charging system may be configured to charge at least a partially-depleted battery to a threshold charge value, discontinue the charging in response to the battery being charged to the threshold charge value, and monitor the function of the electronic device to detect at least one of an anticipated event, and an unanticipated event of the electronic device. Additionally the charging system may be configured to recharge the battery in response to detecting one of: the anticipated event occurring a predetermined time subsequent to the recharging of the battery, or the unanticipated event occurring immediately before the recharging of the battery.

Abstract: A device having one or more an acoustic modules. The acoustic module includes an acoustic element and a cavity that is acoustically coupled to the acoustic element. The module also includes a first conductive element that is configured to generate a first surface charge on a first region of an interior surface of the cavity. A second conductive element is configured to generate a second surface charge on a second region of the interior surface of the cavity. The first and second charge on the first and second regions of the interior surfaces of the cavity may be selectively applied to facilitate movement of a liquid held within the cavity.

Abstract: An electronic device. The electronic device may include a battery, and a charging system in electronic communication with the battery. The charging system may be configured to charge at least a partially-depleted battery to a threshold charge value, discontinue the charging in response to the battery being charged to the threshold charge value, and monitor the function of the electronic device to detect at least one of an anticipated event, and an unanticipated event of the electronic device. Additionally the charging system may be configured to recharge the battery in response to detecting one of: the anticipated event occurring a predetermined time subsequent to the recharging of the battery, or the unanticipated event occurring immediately before the recharging of the battery.

Abstract: Pressure sensing systems comprising bulk-solidifying amorphous alloys and pressure-sensitive switches containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloys are capable of repeated deformation upon application of pressure, and change their electrical resistivity upon deformation, thereby enabling measurement of the change in resistivity and consequently, measuring the deformation and amount of pressure applied.

Abstract: Touch sensing systems comprising bulk-solidifying amorphous alloys and methods of making touch sensing arrays and electronic devices containing touch sensitive screens that include arrays containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloy substrates have select areas of crystalline and amorphous alloy providing for discrete areas of conductivity and resistivity.

Abstract: A sealed acoustic port in the housing of an electronic device facilitating the elimination of liquid within the port. The acoustic port may include a heating element that when actuated can expedite the evaporation process of liquids accumulated within the port.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: Methods and apparatus for applying internal features or complex mechanical structures to a surface of a metal part are disclosed. According to one aspect of the present invention, a method for creating an assembly that includes a substrate and a molded piece involves obtaining the substrate, and forming at least one binding feature on a surface of the substrate. The method also includes molding on a surface of the binding feature and the surface of the substrate. Molding on the surface of the binding feature and the surface of the substrate mechanically binds the molded piece to the substrate.

Abstract: Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

Abstract: Provided in an embodiment is a method for molding, including: providing a molten alloy in a space between a mold cavity and an etchable block shaped to form an undercut on a part formed in the space, cooling the molten alloy to form the part with the undercut, and etching the etchable block. An undercut is a beveled edge caused by an etchant attacking an etchable block laterally and optionally vertically. The formed part can be made of a bulk amorphous alloy. In some cases, the etchable block can also be used to form at least one threaded portion in the part.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: An electronic device. The electronic device may include a battery, and a charging system in electronic communication with the battery. The charging system may be configured to charge at least a partially-depleted battery to a threshold charge value, discontinue the charging in response to the battery being charged to the threshold charge value, and monitor the function of the electronic device to detect at least one of an anticipated event, and an unanticipated event of the electronic device. Additionally the charging system may be configured to recharge the battery in response to detecting one of: the anticipated event occurring a predetermined time subsequent to the recharging of the battery, or the unanticipated event occurring immediately before the recharging of the battery.

Abstract: Pressure sensing systems comprising bulk-solidifying amorphous alloys and pressure-sensitive switches containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloys are capable of repeated deformation upon application of pressure, and change their electrical resistivity upon deformation, thereby enabling measurement of the change in resistivity and consequently, measuring the deformation and amount of pressure applied.

Abstract: Examples of portable electronic devices including a piezo actuated vibrator for providing tactile feedback to the user are described. Portable electronic devices according to the present disclosure may include tactile feedback devices, which may be driven by a piezoelectric actuator/vibrator that is operatively coupled to or embedded into the housing of a portable electronic device. In some examples, the housing of the electronic device itself can be made of piezoelectric ceramic material. The piezoelectric element may be coupled to the housing of the product to cause the housing to deflect and/or vibrate. In some examples, the housing of the portable electronic device, which may be a portable media player device, may be configured for placement directly or indirectly in contact with the user's skin such that vibrations of the housing may be felt directly (without audible feedback) by the user.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: A device having one or more an acoustic modules. The acoustic module includes an acoustic element and a cavity that is acoustically coupled to the acoustic element. The module also includes a first conductive element that is configured to generate a first surface charge on a first region of an interior surface of the cavity. A second conductive element is configured to generate a second surface charge on a second region of the interior surface of the cavity. The first and second charge on the first and second regions of the interior surfaces of the cavity may be selectively applied to facilitate movement of a liquid held within the cavity.

Abstract: Systems and methods for positioning a component on a surface or substrate including the steps of applying a coating to a selected deposit area of the surface, each deposit area defining at least a portion of a perimeter of an alignment area, depositing an fluid on the coating, and depositing, dropping, or otherwise positioning the component above the alignment area are disclosed.