Abstract: An apparatus with a vessel (20), a first induction source (30), and a second induction source (32) in the melt zone (12). The first induction source (30) is used to melt the material received in the vessel (20). The second induction source (32) is used to contain the material in a meltable form within the vessel (20) during melting. The coils (26) of each of the first and second induction sources (30, 32) can be arranged such that they intertwine in an alternate fashion or that they are in sets in a series. The coils (26) of the sources (30, 32) can also sequentially receive power such that the material is moved through the ejection path after melting and into an adjacent mold. The vessel (20) can be positioned along a horizontal axis (X). The apparatus can be used to melt and mold amorphous alloys; for example.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: One embodiment provides a method comprising: providing a sample comprising a bulk amorphous alloy; scanning ultrasonically at least a portion of the sample to determine a parameter of the sample in the portion; and comparing the parameter to a predetermined standard to derive a property related to the sample.

Abstract: An electronic device for providing tactile feedback is provided. The electronic device may provide tactile feedback using any suitable approach, including for example vibration, heat, electrical, visual, or any other type of feedback. The electronic device may provide tactile feedback in response to detecting any particular status of the electronic device, receiving any particular input, or detecting any suitable communication received by the electronic device. For example, the electronic device may provide tactile feedback in response to identifying the current network of the device, the status of a particular electronic device component, or any other electronic device status. As another example, the electronic device may provide tactile feedback in response to receiving a particular type of communication, or in response to receiving a communication from a particular contact.

Abstract: Provided in one embodiment is a method of making use of foams as a processing aid or to improve the properties of bulk-solidifying amorphous alloy materials. Other embodiments include the bulk-solidifying amorphous alloy/foam composite materials made in accordance with the methods.

Abstract: An electronic device. The electronic device may include a battery, and a charging system in electronic communication with the battery. The charging system may be configured to charge at least a partially-depleted battery to a threshold charge value, discontinue the charging in response to the battery being charged to the threshold charge value, and monitor the function of the electronic device to detect at least one of an anticipated event, and an unanticipated event of the electronic device. Additionally the charging system may be configured to recharge the battery in response to detecting one of: the anticipated event occurring a predetermined time subsequent to the recharging of the battery, or the unanticipated event occurring immediately before the recharging of the battery.

Abstract: Provided in one embodiment is a method of forming a connection mechanism in or on a bulk-solidifying amorphous alloy by casting in or on, or forming with the bulk-solidifying amorphous alloy, a machinable metal. The connection mechanism can be formed by machining the machinable metal.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a structural frame within the portable electronic device and an amorphous diamond-like carbon (DLC) coating deposited on the surfaces and the edges of the structural frame, wherein the amorphous DLC coating increases a thermal conductivity of the structural frame.

Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.

Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

Abstract: An electronic device for providing tactile feedback is provided. The electronic device may provide tactile feedback using any suitable approach, including for example vibration, heat, electrical, visual, or any other type of feedback. The electronic device may provide tactile feedback in response to detecting any particular status of the electronic device, receiving any particular input, or detecting any suitable communication received by the electronic device. For example, the electronic device may provide tactile feedback in response to identifying the current network of the device, the status of a particular electronic device component, or any other electronic device status. As another example, the electronic device may provide tactile feedback in response to receiving a particular type of communication, or in response to receiving a communication from a particular contact.

Abstract: A method comprising: constructing a master curve plot comprising a plurality of reference curves, each reference curve representing a relationship between volume and temperature for one of a plurality of reference alloy samples having a chemical composition and various predetermined degrees of crystallinity; for an alloy specimen having the chemical composition and an unknown degree of crystallinity, obtaining a curve representing a relationship between volume and temperature thereof; and determining the unknown degree of crystallinity by comparing the curve to the master curve plot.

Abstract: Provided in one embodiment is a method of making use of foams as a processing aid or to improve the properties of bulk-solidifying amorphous alloy materials. Other embodiments include the bulk-solidifying amorphous alloy/foam composite materials made in accordance with the methods.

Abstract: Provided in one embodiment is a method of forming a connection mechanism in or on a bulk-solidifying amorphous alloy by casting in or on, or forming with the bulk-solidifying amorphous alloy, a machinable metal. The connection mechanism can be formed by machining the machinable metal.

Abstract: Disclosed herein are consumer electronics housings made from bulk-solidifying amorphous alloy materials having a ductile coating applied to all or a portion of the bulk-solidifying amorphous alloy. Also disclosed are methods of making consumer electronic housings from bulk-solidifying amorphous alloy materials such that at least a portion of the bulk-solidifying amorphous alloy housing is coated with a ductile cladding material.

Abstract: Methods and apparatus for creating an integral assembly formed from a transparent member and a housing formed at least in part of a bulk-solidifying amorphous alloy. The methods and systems create integral transparent member and amorphous metal alloy-containing parts using thermoplastic molding techniques in which the amorphous metal is molded to the transparent member in a thermoplastic, not liquid, state.

Abstract: Provided in one embodiment is a method, comprising: providing a first part comprising a protruding portion, wherein the protruding portion comprises an alloy that is at least partially amorphous; providing a second part comprising an opening; disposing the second part in proximity of the first part such that the protruding portion traversed through the opening; and mating the protruding portion and the opening at a first temperature to shape the protruding portion into an interlock joining the first part and the second part.

Abstract: Accessories such as headsets for electronic devices are provided. A headset may be provided with a button controller assembly that has user-actuated buttons. The button controller assembly may be formed of housing portions that float with respect to each other. Plastic engagement structures may limit the amount of unimpeded travel that is exhibited by the housing portions. The housing portions may be formed from first and second housings. A rigid frame may be mounted within the second housing. The first housing may flex along its length when the user squeezes the first and second housings together to actuate a desired button. Housings may be formed as double-shot plastic parts having first and second plastics with different properties. Integrated circuits and a microphone may be mounted within the button controller assembly. A nonoperational microphone port may be provided as a visual indicator that the button controller contains a microphone.

Abstract: This invention is directed to mechanical and electromagnetic shielding features of an electronic device case. An electronic device case is formed of two housings, each housing having integrated snaps, channels, or other retaining features used to secure the housings together. The housings additionally include integrated retaining features used to secure electronic components within the device case. The housings and retaining features are formed of amorphous metals or other materials with high elasticities. Because the retaining features necessary to assemble the case and secure the electronic components to the case form integral parts of the housings, no external retaining features are required to assemble the electronic device in the case.