Abstract: Disclosed are quality control methods used in fabrication processes to make bulk-solidifying amorphous alloy parts. The quality control methods include forming a test plaque together with bulk-solidifying amorphous alloy part where the test plaque is formed on the alloy part at a location having a predetermined likelihood of failure, and testing the plaque to determine the quality of the product.

Abstract: Disclosed is a method of coating a substrate with a bulk-solidifying amorphous alloy using a thermal spraying technique to provide a coating that is substantially amorphous. Some embodiments include using a substrate having a thickness greater than the critical casting thickness of the bulk-solidifying amorphous alloy, and using a brazing material to assist in adhering the coating to the surface.

Abstract: Touch sensing systems comprising bulk-solidifying amorphous alloys and methods of making touch sensing arrays and electronic devices containing touch sensitive screens that include arrays containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloy substrates have select areas of crystalline and amorphous alloy providing for discrete areas of conductivity and resistivity.

Abstract: Pressure sensing systems comprising bulk-solidifying amorphous alloys and pressure-sensitive switches containing bulk-solidifying amorphous alloys. The bulk-solidifying amorphous alloys are capable of repeated deformation upon application of pressure, and change their electrical resistivity upon deformation, thereby enabling measurement of the change in resistivity and consequently, measuring the deformation and amount of pressure applied.

Abstract: The embodiments described herein relate to BMG articles with high bulk having all dimensions greater than the critical dimension. Exemplary BMG article can include at least one bulk component and/or one or more fixation elements configured on surface of the bulk component or inserted into the bulk component. Other embodiments relate to methods of making the BMG articles by thermo-plastic-formation of BMG alloy materials.

Abstract: Provided in an embodiment is a method for molding, including: providing a molten alloy in a space between a mold cavity and an etchable block shaped to form an undercut on a part formed in the space, cooling the molten alloy to form the part with the undercut, and etching the etchable block. An undercut is a beveled edge caused by an etchant attacking an etchable block laterally and optionally vertically. The formed part can be made of a bulk amorphous alloy. In some cases, the etchable block can also be used to form at least one threaded portion in the part.

Abstract: Provided in one embodiment is a method of making use of foams as a processing aid or to improve the properties of bulk-solidifying amorphous alloy materials. Other embodiments include the bulk-solidifying amorphous alloy/foam composite materials made in accordance with the methods.

Abstract: Embodiments relates to a fastener having a head portion and an interlock portion comprising a bulk solidifying amorphous alloy comprising a metal alloy. The fastener could further have a screw portion. Other embodiments relate to methods of making and using the fasteners.

Abstract: Provided in one embodiment is a method, comprising: forming a part comprising a bulk amorphous alloy, wherein the part comprises a sampling portion; determining a parameter related to the part by detecting by imaging on a surface of the sampling portion presence of crystals of the alloy; and evaluating the part based on the parameter.

Abstract: An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.

Abstract: A metal enclosure has a surface region which is coated with cladding material using a laser cladding process. The metal enclosure can form at least a portion of an electronic device housing. All or part of one or more surfaces of the enclosure can be coated with cladding material. The coating of cladding material can be varied at selective regions of the enclosure to provide different structural properties at these regions. The coating of cladding material can be varied at selective regions to provide contrast in cosmetic appearance.

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a structural frame within the portable electronic device and an amorphous diamond-like carbon (DLC) coating deposited on the surfaces and the edges of the structural frame, wherein the amorphous DLC coating increases a thermal conductivity of the structural frame.

Abstract: A media device for storing and playing media such as audio, video or images, includes a memory device configured to store a plurality of media items in a digital format. The media device also includes a display configured to present a group of media items from the plurality of stored media items and to present a visual indicator that is capable of scrolling through the displayed group of media items in order to designate a specific media item from the group of media items. The media device further includes a touch pad configured to receive input from a sliding motion or a tapping motion of a finger. The sliding motion of the finger controls the movement of the visual indicator through the group of media items. The tapping motion of the finger selects the specific media item that is designated by the visual indicator.

Abstract: Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.

Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.

Abstract: A cold worked stainless steel bezel for a portable electronic device. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring. The bezel is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints. The portable electronic device may include a personal media device, a mobile telephone, or any other suitable device or combination thereof.

Abstract: This application is directed to a shock sensor mounted in an electronic device. The shock sensor includes both active and passive shock detection methods that allow a technician to determine whether the electronic device was subjected to a shock event that exceeded an impact threshold level. The shock sensor may include shock detection contacts that form an electrical circuit that remains open in the absence of a shock event that exceeds an impact threshold level. In response to a significant shock event, a movable component or substance of the shock sensor may move from a first position to a second position, thereby closing the electrical circuit formed by the shock detection contacts. The change in circuit may be detected and used to provide active indication of whether the electronic device has been subjected to a substantial shock event. In addition, the shock sensor may be observed to passively determine whether the electronic device has been subjected to a substantial shock event.

Abstract: Connectors for electronic devices are provided with embedded antennas. The connectors may be 30-pin connectors. A 30-pin connector may have a conductive shell structure that defines a cavity and a planar dielectric member that extends into the cavity and that has contact pins. An antenna may be formed from an antenna resonating element on the planar dielectric member and an antenna ground formed from the conductive shell structure. An antenna may be formed from a slot in the conductive shell. The antenna and the pins may be electrically coupled to an electronic device using a cable.

Abstract: A media player comprising a display screen is provided. The media player can include a housing having an opening and an area of reduced thickness around the opening. The media player can also include a transparent wall having a flange. Alternatively, the transparent wall may not require a flange but rather can be a flat, substantially transparent piece of material such as plexiglass or glass. The flange can be adhered to a surface of the area of reduced thickness in order to form a transparent protective cover for the display screen.

Abstract: Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.