Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract: Techniques are provided for establishing a Unified Communications (UC) session between a client endpoint device and remote endpoint devices, the client endpoint device managing the session using a first-party call control protocol in response to commands from a third-party control protocol and user input. A hosted virtual desktop (HVD) generates an HVD image and communicates it to the client endpoint device for display, via a virtual desktop interface (VDI) protocol. The HVD image comprises a UC user interface generated by a UC application on the HVD, the user interface comprising at least one user interface element and at least one placeholder where a client-provided user interface element may be inserted. A client UC application receives the HVD image and inserts client-provided user interface elements over the placeholders before sending the integrated image to a client operating system to be rendered on the display of client endpoint device.