Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract: Techniques are provided for establishing a Unified Communications (UC) session between a client endpoint device and remote endpoint devices, the client endpoint device managing the session using a first-party call control protocol in response to commands from a third-party control protocol and user input. A hosted virtual desktop (HVD) generates an HVD image and communicates it to the client endpoint device for display, via a virtual desktop interface (VDI) protocol. The HVD image comprises a UC user interface generated by a UC application on the HVD, the user interface comprising at least one user interface element and at least one placeholder where a client-provided user interface element may be inserted. A client UC application receives the HVD image and inserts client-provided user interface elements over the placeholders before sending the integrated image to a client operating system to be rendered on the display of client endpoint device.

Abstract: Techniques are provided for establishing a Unified Communications (UC) session between a client endpoint device and remote endpoint devices, the client endpoint device managing the session using a first-party call control protocol in response to commands from a third-party control protocol and user input. A hosted virtual desktop (HVD) generates an HVD image and communicates it to the client endpoint device for display, via a virtual desktop interface (VDI) protocol. The HVD image comprises a UC user interface generated by a UC application on the HVD, the user interface comprising at least one user interface element and at least one placeholder where a client-provided user interface element may be inserted. A client UC application receives the HVD image and inserts client-provided user interface elements over the placeholders before sending the integrated image to a client operating system to be rendered on the display of client endpoint device.

Abstract: Techniques are provided for establishing a Virtual Desktop Interface (VDI) connection at a virtual desktop thin client (VDTC) device, between a VDI client in the VDTC device and a VDI server in a hosted virtual desktop server (HVDS). A unified communications (UC) control connection is established between a UC protocol stack on the VDTC device and a primary call agent, where the UC control connection is configured to allow the UC protocol stack to register with the primary call agent, and to send or receive commands from the primary call agent that are based on signals from a UC control application running on the HVDS. A UC control backup application is started on the virtual desktop thin client device in a standby mode that is configured to switch to an active mode in response to a failure to establish or maintain the UC control connection, or a failure to establish or maintain the VDI connection.

Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract: Systems and techniques relating to interactive gaming are described. A described system includes one or more site servers providing game instances to one or more devices in communication with the one or more site servers via a wired network, a wireless network, or both. The system includes a server system in communication with the one or more site servers; and one or more wireless mobile devices in communication with the server system. The server system can be configured to provide information about one or more of the gaming instances at one or more sites to the one or more mobile devices; receive, from the one or more mobile devices, an indication of a selected gaming instance of the gaming instances; relay gaming information between the one or more site servers and the one or more mobile devices; and provide gaming content and one or more gaming functions to the site servers.

Abstract: An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.

Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract: An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.