Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.

Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

Abstract: Systems and methods described herein make previously stranded power capacity (power that is provisioned for a data center according to a computing system's nameplate power consumption but is currently not useable) available to the data center. Systems described herein generate empirical power profiles that specify expected upper bounds for the power consumption levels that applications trigger. Using the upper bounds for application power-consumption levels, a computing system described herein can reliably release part of its provisioned nameplate power for other systems or data center consumers, reducing the amount of stranded power in a data center. The method described herein avoids performance penalties for most jobs by using sensor measurements made at a rapid rate explained herein to ensure that a system power cap based on running application's measured peak power consumption is reliable with reference to the power capacitance inherent in the computing system.

Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.

Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.

Abstract: A blow molded basketball goal having an inner post, an outer post, a rim, and a backboard. The inner post having a top end, a bottom end, a length measured from the top end to the bottom end, and a plurality of protrusions positioned near the bottom end. The outer post having a bottom end, a hollow interior defined by an interior wall, an open top end adapted to receive the inner post, and at least one protuberance on the interior wall. When the inner post is received in the outer post, the plurality of protrusions of the inner post bear against the interior wall of the outer post and the at least one protuberance of the outer post bears against the inner post. The rim is securable to the inner post, and the backboard is securable to the rim. The components are easily removable for disassembly.

Abstract: A net securing system and method of securing the net including a blow molded part with a plurality of holes, channels, and vertically tapered clips. Each of the plurality of vertically tapered clips is spaced apart from a central vertical axis of the holes at a distance greater than the hole width. In many embodiments, the net securing system has at least one protrusion on the inner surface of the vertically tapered clip. The net securing system secures a sports net when part of a net is inserted through the hole, around the vertically tapered clip and pinched within the channels. The net securing system may also include a backboard, a base connected to the backboard by a support rod, an attachment support connected to the support rod, a rim, and a net. Also disclosed is a method of forming the net securing system.

Abstract: A flexible input/output (I/O) expansion card connection and communication technique are provided. The flexible I/O expansion card is, in some examples, a mezzanine expansion card that may be a single width mezzanine expansion card, a double width expansion card, or a quad width expansion card. Multiple connectors on a mainboard provide a slot to receive plug in (insertion) of an expansion card. A slot is associated with a communication bus (e.g., Peripheral Component Interconnect (PCI)) established between the expansion card and an associated processor. The expansion card (or more than one expansion card) may be inserted in multiple orientations with respect to the multiple connectors. Automatic adjustment of communication on the communication bus may be implemented via one or more hardware level and/or software assisted translations to allow the mezzanine expansion card to function in a normal or a reverse (180 degrees relative to normal) orientation.

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

Abstract: Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.

Abstract: An example electrical and liquid coolant midplane includes an electrical midplane having a ring bus bar assembly, a liquid coolant manifold, and a heat transfer device. The ring bus bar assembly is to receive power from power supply units of the computing system and provide the power to computing components installed in the computing system. The liquid coolant manifold includes four segments connected together as a rectangular ring, the liquid coolant manifold including first liquid connectors facing in a first direction and second liquid connectors facing in a second direction opposite the first direction. The heat transfer device is in contact with the ring bus bar assembly and one of the segments of the liquid coolant manifold, to thermally couple the ring bus bar assembly with the manifold to provide liquid cooling to the ring bus bar assembly.

Abstract: Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.

Abstract: A blow molded basketball goal having an inner post, an outer post, a rim, and a backboard. The inner post having a top end, a bottom end, a length measured from the top end to the bottom end, and a plurality of protrusions positioned near the bottom end. The outer post having a bottom end, a hollow interior defined by an interior wall, an open top end adapted to receive the inner post, and at least one protuberance on the interior wall. When the inner post is received in the outer post, the plurality of protrusions of the inner post bear against the interior wall of the outer post and the at least one protuberance of the outer post bears against the inner post. The rim is securable to the inner post, and the backboard is securable to the rim. The components are easily removable for disassembly.

Abstract: Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.

Abstract: A blow molded basketball goal having an inner post, an outer post, a rim, and a backboard. The inner post having a top end, a bottom end, a length measured from the top end to the bottom end, and a plurality of protrusions positioned near the bottom end. The outer post having a bottom end, a hollow interior defined by an interior wall, an open top end adapted to receive the inner post, and at least one protuberance on the interior wall. When the inner post is received in the outer post, the plurality of protrusions of the inner post bear against the interior wall of the outer post and the at least one protuberance of the outer post bears against the inner post. The rim is securable to the inner post, and the backboard is securable to the rim.

Abstract: A blow molded basketball goal having an inner post, an outer post, a rim, and a backboard. The inner post having a top end, a bottom end, a length measured from the top end to the bottom end, and a plurality of protrusions positioned near the bottom end. The outer post having a bottom end, a hollow interior defined by an interior wall, an open top end adapted to receive the inner post, and at least one protuberance on the interior wall. When the inner post is received in the outer post, the plurality of protrusions of the inner post bear against the interior wall of the outer post and the at least one protuberance of the outer post bears against the inner post. The rim is securable to the inner post, and the backboard is securable to the rim.

Abstract: A net securing system, kit and method including a blow molded part with a plurality of holes and clips, the clips configured to secure a flexible elongate member which is part of a net when the flexible elongate member is formed into a loop, inserted through the hole and around the clip.

Abstract: Example implementations relate to pumps with pre-charged fluid. In some examples, a pump may comprise a first valve connected to an inlet of the pump by a first clip, a second valve connected to an outlet of the pump by a second clip, and a compression release mechanism to relieve compression forces generated on a fluid included in the pump in response to the pump being connected to a manifold, where the pump is pre-charged with the fluid.

Abstract: A mobile communication device has a processor, a radio, a near field communication (NFC) device, a battery, and memory for storing data. The power level of the battery is measured. When the measured power level is above a first predetermined level, power is provided to the radio to allow communication. Sufficient power is provided to operate the NFC device as a reader and a tag. When the measured power level of the battery falls below the first predetermined level, battery power to the radio is shut off. Sufficient power is maintained to the NFC device to allow it to operate only as a tag. Sufficient power is maintained to the memory to retain the data stored in the memory. When the measured power level of the battery falls below a second predetermined level, the NFC device is required to harvest all of its power from the field.