Abstract: Disclosed is a conformable, stretchable and electrical conductive structure, which includes an auxetic structure, and a plurality of electrical conductors. The plurality of electrical conductors being incorporated within the auxetic structure, to form conformable, stretchable electrical interconnects, configured based on a design of the auxetic structure and placement of the electrical conductors incorporated with the auxetic structure.

Abstract: A printing apparatus includes a liquid ejector configured to eject liquid droplets towards a medium. A particle delivery device is configured to deliver particles to the medium. The particles are configured to combine with at least some of the liquid droplets and change at least one property of the liquid droplets. The particle delivery device is configured to deliver the particles after or substantially simultaneously as the liquid droplets are ejected. A curing device is configured to cure the combination of the liquid droplets and the particles onto the medium. A controller is configured to independently control the liquid ejector and the particle delivery device.

Abstract: Provided is a method and system which uses a 3D additive manufacturing system having more than a single 3D additive manufacturing subsystem. The operation employs a set of control files including a first control file with part names and method names which correspond to particular ones of the part names. Additional files in the set of control files include a plurality of method control files, describing the methods named in the first control file. The method control files are configured to include (i) control parameter names, and (ii) values associated with the parameter names.

Abstract: A printing apparatus includes a liquid ejector configured to eject liquid droplets towards a medium. A particle delivery device is configured to deliver particles to the medium. The particles are configured to combine with at least some of the liquid droplets and change at least one property of the liquid droplets. The particle delivery device is configured to deliver the particles after or substantially simultaneously as the liquid droplets are ejected. A curing device is configured to cure the combination of the liquid droplets and the particles onto the medium. A controller is configured to independently control the liquid ejector and the particle delivery device.

Abstract: A dampening fluid useful in offset ink printing applications contains water and a surfactant whose structure can be altered. The alteration in structure aids in reducing accumulation of the surfactant on the surface of an imaging member. The surfactant can be decomposed, switched between cis-trans states, or polymerizable with ink that is subsequently placed on the surface.

Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed.

Abstract: A structure can include a first layer of a polymer material and a second layer of the polymer material on the first layer, the first and second layers of the polymer material defining a hollow space that was formed by way of a temporary sacrificial structure that was made of a sublimable material.

Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed.

Abstract: Development of smart objects with electronic functions requires integration of printed components with IC chips or dies. Conventional chip or die bonding including wire bonding, flip chip bonding, and soldering may not be applicable to chip or die attachment on low temperature plastic surfaces used in physical objects. Printing conductive connection traces requires a smooth interface between contact pads of a chip and the surface of the physical object. In order to address this issue of chip/die attachment to a physical object, this disclosure provides embodiments to construct a fixture on a chip or die for attachment and electrical connection onto a physical object by printing operations and/or ACF bonding methods.

Abstract: A method and system utilizes ink jetting or printing of surface work function modification material or solution to form modified p-type and/or n-type electrodes. The proposed method is suitable for making complementary OTFT circuits in roll-to-roll fabrication environment.

Abstract: A printed resistive gas detector configuration that is simple, inexpensive and compact, fabricated for incorporation into an electronic device, such as an electronic computing and/or communication device, the printed resistive gas detector configuration designed to continuously monitor for predetermined types of gasses. The printed resistive gas detector configuration manufactured by the use of printing technology to print on a flexible substrate.

Abstract: The level sensor system includes a level sensor label configured to be associated with a container containing a material whose level is to be sensed, the level sensor label arrangement having a circuit which includes an inductive element electrically connected to a capacitive structure configured to be associated with the container.

Abstract: The level sensor system includes a level sensor label configured to be associated with a container containing a material whose level is to be sensed, the level sensor label arrangement having a circuit which includes an inductive element electrically connected to a capacitive structure configured to be associated with the container.

Abstract: A dampening fluid useful in offset ink printing applications contains water and a surfactant whose structure can be altered. The alteration in structure aids in reducing accumulation of the surfactant on the surface of an imaging member. The surfactant can be decomposed, switched between cis-trans states, or polymerizable with ink that is subsequently placed on the surface.

Abstract: Disclosed is a conformable, stretchable and electrical conductive structure, which includes an auxetic structure, and a plurality of electrical conductors. The plurality of electrical conductors being incorporated within the auxetic structure, to form conformable, stretchable electrical interconnects, configured based on a design of the auxetic structure and placement of the electrical conductors incorporated with the auxetic structure.

Abstract: A dampening fluid useful in offset ink printing applications contains water and a surfactant whose structure can be altered. The alteration in structure aids in reducing accumulation of the surfactant on the surface of an imaging member. The surfactant can be decomposed, switched between cis-trans states, or polymerizable with ink that is subsequently placed on the surface.

Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed.

Abstract: A structure can include a first layer of a polymer material and a second layer of the polymer material on the first layer, the first and second layers of the polymer material defining a hollow space that was formed by way of a temporary sacrificial structure that was made of a sublimable material.

Abstract: Provided is a method and system which uses a 3D additive manufacturing system having more than a single 3D additive manufacturing subsystem. The operation employs a set of control files including a first control file with part names and method names which correspond to particular ones of the part names. Additional files in the set of control files include a plurality of method control files, describing the methods named in the first control file. The method control files are configured to include (i) control parameter names, and (ii) values associated with the parameter names.

Abstract: Systems and methods for sensing degradation of a piezoelectric actuator in a print head. One or more electrical pulses may be transmitted to the piezoelectric actuator that cause the piezoelectric actuator to bend, thereby creating a pressure wave. The pressure wave may be sensed and converted into an electrical signal. The electrical signal may be compared to a reference signal.