Abstract: An apparatus fixes ink on a substrate, such as in ink-jet printing. A leveling member is positioned to contact an ink-bearing side of the substrate at a nip. A radiation source is positioned to direct radiation to the ink-bearing side of the substrate at the nip, the radiation suitable for curing the ink on the substrate.

Abstract: An apparatus fixes ink on a substrate, such as in ink-jet printing. A leveling member is positioned to contact an ink-bearing side of the substrate at a nip. A radiation source is positioned to direct radiation to the ink-bearing side of the substrate at the nip, the radiation suitable for curing the ink on the substrate.

Abstract: A method for forming tactile images or a combination of tactile images and regular images, on a flexible packaging substrate comprising depositing an ultraviolet curable phase change ink composition comprising an optional colorant and a phase change ink vehicle comprising a radiation curable monomer or prepolymer; a photoinitiator; a reactive wax; and a gellant directly onto a flexible packaging substrate or depositing the ink onto an intermediate transfer member, in an image area to form a tactile image area or a combination of tactile image area and regular image; forming the tactile image by depositing multiple layers of the ink in locations of the tactile image or portion thereof; when an intermediate transfer member is used, transferring the deposited ink from the intermediate transfer member to the flexible packaging substrate; and curing the ink.

Abstract: Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features. By printing each design layer in a printing direction aligned with the parallel layout features, the individual print solution droplets deposited onto the substrate do not dry before adjacent droplets are deposited. Therefore, printed patterns having accurate geometries and consistent electrical properties can be printed.

Abstract: A digital lithography system including a droplet source (printhead) for selectively ejecting liquid droplets of a phase-change masking material, and an imaging system for capturing (generating) image data representing printed features formed by the ejected liquid droplets. The system also includes a digital control system that detects defects in the printed features, for example, by comparing the image data with stored image data. The digital control system then modifies the printed feature to correct the defect, for example, by moving the printhead over the defect and causing the printhead to eject droplets onto the defect's location. In one embodiment, a single-printhead secondary printer operates in conjunction with a multi-printhead main printer to correct defects.

Abstract: Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features. By printing each design layer in a printing direction aligned with the parallel layout features, the individual print solution droplets deposited onto the substrate do not dry before adjacent droplets are deposited. Therefore, printed patterns having accurate geometries and consistent electrical properties can be printed.

Abstract: An improved method of forming a display is described. The method includes the operation of forming a cell in an array of cells. Walls of the cell are used to confine both a color filter and a display material prior to sealing the cell. The method is particularly useful when jet printing particulate display materials and filter materials to form pixels in a display.

Abstract: A method of printing electronic circuits uses pattern recognition to detect locations of interconnects on electronic components oriented on a substrate such that the interconnects face away from the substrate, the interconnects having ramps between the interconnects and the substrate, adjusts routing paths as needed based upon a difference between an intended placement and an actual placement of the electronic components, and generates a new image file for printing with adjusted routing paths. A device has at least one electronic component having interconnects, a ramp from a surface of the substrate to the interconnects, wherein the ramp is formed of one of either a polymer or an adhesive, a printed, conductive path on the ramp providing electrical connection to at least one of the interconnects.

Abstract: A method of jet-printing smooth micro-scale features is presented. The desired feature prior to being printed is masked by various decimation filters and the decimation is performed at various pitches. The subsequently printed image is then scanned and analyzed to determine the roughness of the lines. The optimum decimation pitch is determined by the feature that exhibits the least amount of droplet spreading and has the lowest edge roughness. The optimum decimation pitch may also be calculated from the material properties and the dynamics of fluids.

Abstract: A digital lithography system prints a large-area electronic device by dividing the overall device printing process into a series of discrete feature printing sub-processes, where each feature printing sub-process involves printing both a predetermined portion (feature) of the device in a designated substrate area, and an associated test pattern in a designated test area that is remote from the feature. At the end of each feature printing sub-process, the test pattern is analyzed, e.g., using a camera and associated imaging system, to verify that the test pattern has been successfully printed. A primary ejector is used until an unsuccessfully printed test pattern is detected, at which time a secondary (reserve) ejector replaces the primary ejector and reprints the feature associated with the defective test pattern. When multiple printheads are used in parallel, analysis of the test pattern is used to efficiently identify the location of a defective ejector.

Abstract: Black matrix (BM) material is deposited on glass and patterned to form walls that define an array of wells. Various surface treatments and masking schemes are utilized to achieve surface energy control of the BM glass. The surface treatments include one or more of chemically treating the BM walls by depositing hydrophobic self-assembled monolayers on the uppermost wall surfaces, and plasma treatments to control the surface energy of the various BM glass surfaces. Masking processes include backside exposure and development of photoresist, and maskless, self-aligned photo-patterning of the monolayers. Color filter ink is then injected into each well from an ink jet print head. The high surface energy of the lower and side wall surfaces facilitates wetting of the ink, and the low surface energy of the monolayers prevents intermixing of ink between adjacent wells. The ink then dries to form a color filter in each well.

Abstract: Methods and devices for forming, such as by printing, high quality, high throughput, ultraviolet curable gel ink images on flexible substrates for packaging applications are disclosed. The methods and devices have excellent image quality and do not require pinning of the ink during color printing or nitrogen inerting during curing.

Abstract: Methods and devices for forming, such as by printing, high quality, high throughput, ultraviolet curable gel ink images on corrugated substrates for packaging applications are disclosed. The methods and devices have excellent edge acuity and do not require precoating of the substrate prior to printing or nitrogen inerting during curing.

Abstract: A method of jet-printing smooth micro-scale features is presented. The desired feature prior to being printed is masked by various decimation filters and the decimation is performed at various pitches. The subsequently printed image is then scanned and analyzed to determine the roughness of the lines. The optimum decimation pitch is determined by the feature that exhibits the least amount of droplet spreading and has the lowest edge roughness. The optimum decimation pitch may also be calculated from the material properties and the dynamics of fluids.

Abstract: A method of printing spots with high spot placement accuracy using print heads with random/unevenly spaced ejector locations and coarse alignment of the multiple print heads. This is performed by accurately determining the spot positions from all the print heads using a vision system and printing at high addressability. The spot placement accuracy will be determined by the addressability as long as the ejected drop position is reproducible and other system errors are negligible.

Abstract: A method for performing a liftoff operation involves printing a liftoff pattern using low-resolution patterning techniques to form fine feature patterns. The resulting feature size is defined by the spacing between printed patterns rather than the printed pattern size. By controlling the cross-sectional profile of the printed liftoff pattern, mask structures may be formed from the liftoff operation having beneficial etch-mask aperture profiles. For example, a multi-layer printed liftoff pattern can be used to create converging aperture profiles in a patterned layer. The patterned layer can then be used as an etch mask, where the converging aperture profiles result in desirable diverging etched features.

Abstract: Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features. By printing each design layer in a printing direction aligned with the parallel layout features, the individual print solution droplets deposited onto the substrate do not dry before adjacent droplets are deposited. Therefore, printed patterns having accurate geometries and consistent electrical properties can be printed.

Abstract: A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.

Abstract: A method of forming an integrated microelectronic device and a micro channel is provided. The method offers an inexpensive way of integrating devices that are usually incompatible during fabrication, a microchannel and a microelectronic structure such as an electro-optic light source, a detector or a MEMs device into a single integrated structure.

Abstract: A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.