Abstract: A current mirror multi-channel leakage monitor circuit and method measures die leakage and generates digital keeper control bits to control a process compensated dynamic circuit. The leakage monitor enables high resolution on-chip leakage measurements in multiple locations on a die, thereby saving test time and enabling both die to die and within die process compensation.

Abstract: A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. Thereafter, a low-power laser beam (10) is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer (120) is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer (130) is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.

Abstract: A register file includes a multi-level multiplexer output circuit coupled to a global bit trace and keeper circuitry coupled to said global bit trace and a driving signal trace. The register file also has decoder circuitry coupled to said keeper circuitry to selectively decouple the driving signal trace from said global bit trace.

Abstract: A register file contains a local bit trace and a driving signal trace as well as a plurality of data cells coupled to the local bit trace. A device is coupled to the driving signal trace and the local bit trace to intelligently charge and float the local bit trace. The intelligent charging and floating is facilitated by determination of a selection of one of the data cells.

Abstract: A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. Thereafter, a low-power laser beam (10) is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer (120) is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer (130) is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.

Abstract: A card connector (200) with a reinforcing structure (230) is provided for used in a handheld device. The card connector can mate with an elongated expansion card (10) which when inserted into the card connector has a portion located outside the handheld device. The card connector comprises an insulated main body (210) and a plurality of terminals (220) fixed to the main body. The terminals are used for electrically connecting the elongated expansion card with a printed circuit board (20) on which the card connector is mounted. The reinforcing structure (230) is formed from highly rigid material or high molecular weight polymer. The reinforcing structure strengthens the card connector against any external force resulting from subjecting the elongated expansion card to an external force, whereby the electrical connection between the terminals and printed circuit board will not break due to the external force.