Patents by Inventor Steven Kummerl

Steven Kummerl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170196090
    Abstract: An apparatus includes an electrical device having a surface. The electrical device includes a first surface conductor spaced apart from a second surface conductor on the surface to provide circuit contacts to the device. A first standoff connector is bonded to the first surface conductor. The first standoff connector includes a leg having a proximal end bonded to the first surface conductor. The leg of the first standoff connector extends outwardly from the first surface conductor to a bend that is spaced apart from the surface of the electrical device. A second standoff connector is bonded to the second surface conductor. The second standoff connector includes a leg having a proximal end bonded to the second surface conductor. The leg of the second standoff connector extends outwardly from the second surface conductor to a bend that is spaced apart from the surface of the electrical device.
    Type: Application
    Filed: December 31, 2015
    Publication date: July 6, 2017
    Inventor: Steven KUMMERL
  • Publication number: 20170194233
    Abstract: An integrated circuit (IC) chip can include a die with an interconnect conductively coupled to a leadframe, wherein the leadframe forms a portion of a given surface of the IC chip. The IC chip can also include an encapsulating material molded over the die and the leadframe. The encapsulating material can form another surface of the IC chip. The other surface of the IC chip opposes the given surface of the IC chip. The IC chip can further include a vertical wire extending through the encapsulating material in a direction that is substantially perpendicular to the given surface of the IC chip and the vertical wire protruding through the other surface of the IC chip to form a vertical connector for the IC chip. The vertical connector can be coupled to the interconnect on the die.
    Type: Application
    Filed: December 31, 2015
    Publication date: July 6, 2017
    Inventors: Abram M. Castro, Steven Kummerl
  • Publication number: 20160268023
    Abstract: A transfer mold compound mixture for use in a transfer mold device to encapsulate electronic components. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound.
    Type: Application
    Filed: May 26, 2016
    Publication date: September 15, 2016
    Inventors: Steven Kummerl, Richard J. Saye
  • Patent number: 9378882
    Abstract: Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: June 28, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Steven Kummerl, Richard J. Saye
  • Publication number: 20160163630
    Abstract: A semiconductor device comprises an interposer with extruded feed-through vias and a semiconductor die. The interposers includes a substrate having a plurality of through-vias. A dielectric liner lining said through-vias. A plurality of feed-thru electrically conducting features provided by a plurality of extruded metal wires within said dielectric liner. A semiconductor die attached to said interposer.
    Type: Application
    Filed: January 19, 2016
    Publication date: June 9, 2016
    Inventor: STEVEN KUMMERL
  • Patent number: 9241405
    Abstract: A method of forming interposers includes positioning a plurality of extruded metal wires across a first platten and second platten, which secures the extruded metal wires. A sealing material is added to sidewalls of a volume having the plurality of extruded metal wires within, with the first and second plattens as end plates to form a holding volume. The holding volume is filled with a filling material. The filling material is heated to a sufficient temperature to form a heat treated filled volume. After removing the sealing material, the heat treated filled volume is sawed into a plurality of slices having a predetermined thickness to form a plurality of interposer substrates having a plurality of feed-thru conducting features provided by the plurality of extruded metal wires.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: January 19, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Steven Kummerl
  • Publication number: 20130233609
    Abstract: A method of forming interposers includes positioning a plurality of extruded metal wires across a first platten and second platten, which secures the extruded metal wires. A sealing material is added to sidewalls of a volume having the plurality of extruded metal wires within, with the first and second plattens as end plates to form a holding volume. The holding volume is filled with a filling material. The filling material is heated to a sufficient temperature to form a heat treated filled volume. After removing the sealing material, the heat treated filled volume is sawed into a plurality of slices having a predetermined thickness to form a plurality of interposer substrates having a plurality of feed-thru conducting features provided by the plurality of extruded metal wires.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 12, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: STEVEN KUMMERL
  • Publication number: 20130154148
    Abstract: Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Steven Kummerl, Richard J. Saye
  • Publication number: 20120199951
    Abstract: An integrated circuit package that comprises a lead frame 105, an integrated circuit located on the lead frame and a shunt resistor coupled to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
    Type: Application
    Filed: March 5, 2012
    Publication date: August 9, 2012
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ubol Udompanyavit, Steven Kummerl
  • Patent number: 8129228
    Abstract: An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 6, 2012
    Assignee: Texas Instruments Incorporated
    Inventors: Ubol Udompanyavit, Sreenivasan K Koduri, Gerald W Steele, Jason M Cole, Steven Kummerl
  • Publication number: 20110033985
    Abstract: An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
    Type: Application
    Filed: October 25, 2010
    Publication date: February 10, 2011
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ubol Udompanyavit, Sreenivasan K. Koduri, Gerald W. Steele, Jason Marc Cole, Steven Kummerl
  • Patent number: 7847391
    Abstract: An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: December 7, 2010
    Assignee: Texas Instruments Incorporated
    Inventors: Ubol Udompanyavit, Sreenivasan K. Koduri, Gerald William Steele, Jason Marc Cole, Steven Kummerl
  • Patent number: 7741704
    Abstract: An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular and adjacent to the recessed wall. The step wall is partially undercut by etching. During the molding step, the recessed wall and the step wall are both contacted by and embedded in the molding compound.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: June 22, 2010
    Assignees: Texas Instruments Incorporated, Texas Instruments Deutschland GmbH
    Inventors: Bernhard Lange, Steven Kummerl
  • Publication number: 20100001382
    Abstract: An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
    Type: Application
    Filed: July 1, 2008
    Publication date: January 7, 2010
    Applicant: Texas Instruments Incorporated
    Inventors: Ubol Udompanyavit, Sreenivasan K. Koduri, Gerald William Steele, Jason Marc Cole, Steven Kummerl
  • Publication number: 20080093715
    Abstract: An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular and adjacent to the recessed wall. The step wall is partially undercut by etching. During the molding step, the recessed wall and the step wall are both contacted by and embedded in the molding compound.
    Type: Application
    Filed: October 18, 2007
    Publication date: April 24, 2008
    Applicant: TEXAS INSTRUMENTS DEUTSCHLAND GMBH
    Inventors: Bernhard Lange, Steven Kummerl
  • Publication number: 20080094082
    Abstract: A semiconductor wafer adapted to wirelessly transfer data to a testing system. The wafer comprises a plurality of dies, each die adjacent another die and each die comprising an infrared transceiver. A first infrared transceiver transfers data to a second infrared transceiver by emitting a pattern of infrared light pulses representative of the data.
    Type: Application
    Filed: December 18, 2007
    Publication date: April 24, 2008
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Steven Kummerl
  • Publication number: 20080020517
    Abstract: According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.
    Type: Application
    Filed: July 31, 2007
    Publication date: January 24, 2008
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Steven Kummerl, Bernhard Lange, Anthony Coyle
  • Publication number: 20070259484
    Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.
    Type: Application
    Filed: July 9, 2007
    Publication date: November 8, 2007
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Steven Kummerl, Anthony Coyle, Bernhard Lange
  • Publication number: 20070181652
    Abstract: A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.
    Type: Application
    Filed: April 11, 2007
    Publication date: August 9, 2007
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Bernhard Lange, Steven Kummerl
  • Publication number: 20060289971
    Abstract: A semiconductor device comprising a leadframe (903), which has first (903a) and second (903b) surfaces, a planar pad (910) of a certain size, and a plurality of non-coplanar members (913) adjoining the pad. The device further has a heat spreader (920) with first (920a) and second (920b) surfaces, a planar pad of a size matching the leadframe pad size, and contours (922), into which the leadframe members are inserted so that the first spreader pad surface touches the second leadframe pad surface across the pad size. A semiconductor chip (904) is mounted on the first leadframe pad surface. Encapsulation material (930), preferably molding compound, covers the chip, but leaves the second spreader surface uncovered.
    Type: Application
    Filed: June 27, 2005
    Publication date: December 28, 2006
    Inventors: Bernhard Lange, Steven Kummerl