Abstract: According to an embodiment of the invention, a package comprises a lead frame, a first passive component, a first wire bond connection, and a mold compound. The lead frame has a first pair of resilient arms. The first passive component is disposed between the first pair of resilient arms. The first wire bond connection is disposed between the die and a portion of the lead frame adjacent the first passive component. The first wire bond connection is operable for communication between the die and the first passive component. The mold compound is disposed at least partially around the lead frame, the first passive component, the first wire bond connection, and the die.

Abstract: A method (300) and apparatus (200) for fabricating a semiconductor package (100), wherein a heat spreader (118) is placed in a mold cavity (204) of a mold (202), and a leadframe (108) is placed over the heat spreader (118). A magnetic field (218) is applied to the mold cavity (204), wherein one or more of the heat spreader (118) and leadframe (108) are generally attracted to a surface (212) of the mold cavity (204), thus generally determining a position (214) of the heat spreader (118) within the mold cavity (204) and defining a contact region (120) between the heat spreader (118) and the mold (202). An encapsulation material (114) is further injected into the mold cavity (204), wherein the encapsulation material (114) is generally prevented from entering the contact region (120) due, at least in part, to the applied magnetic field (218). The encapsulation material (114) is then cured, and the semiconductor package (100) is removed from the mold cavity (204).

Abstract: According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

Abstract: According to an embodiment of the invention, a component package comprises a plurality of components and mold compound. The plurality of components are disposed on a zero plane of a removable substrate. The removal substrate is operable to hold the plurality of components in position. At least one of the plurality of components is wire bonded to at least another of the plurality of components with a wire bond. The mold compound is disposed around the plurality of components, encapsulating the plurality of components. A portion of the plurality of the components disposed upon the zero plane of the removable substrate are exposed upon removal of the substrate from the component package.

Abstract: A semiconductor stacked die package adapted to wirelessly transfer data between stacked dies. The package comprises a plurality of dies, each die adjacent another die and each die comprising an infrared transceiver. A first infrared transceiver transfers data to a second infrared transceiver by emitting a pattern of infrared light pulses representative of the data.

Abstract: An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the first package side. The die pad has at least one runner member extending therefrom, which may be bent toward the first package side. The active circuit side of the chip is attached to the die pad. The die pad is on the first package side relative to the chip. The package mold compound is formed over the die pad, at least part of the chip, and at least part of the runner member(s). At least part of the substrate side of the chip and/or at least part of the runner member(s) may not be covered by the package mold compound.