Abstract: Numerous embodiments for performing tuning of a page or a word of non-volatile memory cells in an analog neural memory are disclosed. High voltage circuits used to generate high voltages applied to terminals of the non-volatile memory cells during the precision tuning process are also disclosed. Programming sequences for the application of the voltages to the terminals to minimize the occurrence of disturbances during tuning are also disclosed.

Abstract: Testing circuitry and methods are disclosed for use with analog neural memory in deep learning artificial neural networks. In one example, a method comprises programming an analog neural non-volatile memory cell in an array to a target value representing one of N different values, where N is an integer; verifying that a value stored in the analog neural non-volatile memory cell is within an acceptable window of values around the target value; repeating the programming and verifying for each of the N values; and identifying the analog neural non-volatile memory cell as bad if any of the verifying indicates a value stored in the cell outside of the acceptable window of values around the target value.

Abstract: Numerous embodiments are disclosed for providing temperature compensation in an analog memory array. A method and related system are disclosed for compensating for temperature changes in an array of memory cells by measuring an operating temperature within the array of memory cells and changing a threshold voltage of a selected memory cell in the array of memory cells to compensate for a change in the operating temperature.

Abstract: Numerous examples of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. In one example, a method for performing a read or verify operation in a vector-by-matrix multiplication system comprising an input function circuit, a memory array, and an output circuit block is disclosed, the method comprising receiving, by the input function circuit, digital bit input values; converting the digital input values into an input signal; applying the input signal to control gate terminals of selected cells in the memory array; and generating, by the output circuit block, an output value in response to currents received from the memory array.

Abstract: Numerous examples of a precision programming apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. In one example, a neuron output circuit for providing a current to program as a weight value in a selected memory cell in a vector-by-matrix multiplication array is disclosed, the neuron output circuit comprising a first adjustable current source to generate a scaled current in response to a neuron current to implement a positive weight, and a second adjustable current source to generate a scaled current in response to a neuron current to implement a negative weight.

Abstract: Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

Abstract: Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

Abstract: Examples for ultra-precise tuning of a selected memory cell are disclosed. In one example, a method of programming a first memory cell in a neural memory to a target value is disclosed, the method comprising programming a second memory cell by applying programming voltages to terminals of the second memory cell; and determining if an output of the first memory cell has reached the target value.

Abstract: Numerous examples for performing tuning of a page or a word of non-volatile memory cells in an analog neural memory are disclosed. In one example, a method comprises programming a word or page of non-volatile memory cells in an analog neural memory system; and identifying any fast bits in the word or page of non-volatile memory cells.

Abstract: Numerous examples for performing tuning of a page or a word of non-volatile memory cells in an analog neural memory are disclosed. In one example, an analog neural memory system comprises an array of non-volatile memory cells arranged into rows and columns, each non-volatile memory cell comprising a word line terminal, a bit line terminal, and an erase gate terminal; a plurality of word lines, each word line coupled to word line terminals of a row of non-volatile memory cells; a plurality of bit lines, each bit line coupled to bit line terminals of a column of non-volatile memory cells; and a plurality of erase gate enable transistors, each erase gate enable transistor coupled to erase gate terminals of a word of non-volatile memory cells.

Abstract: Circuitry and methods are disclosed for compensating for leakage in analog neural memory in deep learning artificial neural networks. In one example, a method is disclosed of compensating for leakage in an array of analog neural non-volatile memory cells, wherein the array is arranged in rows and columns, wherein each row is coupled to a word line and each column is coupled to a bitline, the method comprising measuring leakage for a column of analog neural non-volatile memory cells coupled to a bitline; storing the measured leakage value; and applying the measured leakage value during a read operation of the column of analog neural non-volatile memory cells to compensate for the leakage.

Abstract: Testing circuitry and methods are disclosed for use with analog neural memory in deep learning artificial neural networks. In one example, a method is disclosed of testing a plurality of non-volatile memory cells in an array of non-volatile memory cells, wherein the array is arranged in rows and columns, wherein each row is coupled to a word line and each column is coupled to a bit line, and wherein each word line is selectively coupled to a row decoder and each bit line is selectively coupled to a column decoder, the method comprising asserting, by the row decoder, all word lines in the array; asserting, by the column decoder, all bit lines in the array; performing a deep programming operation on the array of non-volatile memory cells; and measuring a total current received from the bit lines.

Abstract: Testing circuitry and methods are disclosed for use with analog neural memory in deep learning artificial neural networks. The analog neural memory comprises one or more arrays of non-volatile memory cells. The testing circuitry and methods can be utilized during sort tests, qualification tests, and other tests to verify programming operations of one or more cells.

Abstract: Embodiments for ultra-precise tuning of a selected memory cell are disclosed. The selected memory cell optionally is first programmed using coarse programming and fine programming methods. The selected memory cell then undergoes ultra-precise programming through the programming of an adjacent memory cell. As the adjacent memory cell is programmed, capacitive coupling between the floating gate of the adjacent memory cell and the floating gate of the selected memory cell will cause the voltage of the floating gate of the selected memory cell to increase, but in smaller increments than could be achieved by programming the selected memory cell directly. In this manner, the selected memory cell can be programmed with ultra-precise gradations.

Abstract: Testing circuitry and methods are disclosed for use with analog neural memory in deep learning artificial neural networks. The analog neural memory comprises one or more arrays of non-volatile memory cells. The testing circuitry and methods can be utilized during sort tests, qualification tests, and other tests to verify programming operations of one or more cells.

Abstract: Memory cells formed on upwardly extending fins of a semiconductor substrate, each including source and drain regions with a channel region therebetween, a floating gate extending along the channel region and wrapping around the fin, a word line gate extending along the channel region and wrapping around the fin, a control gate over the floating gate, and an erase gate over the source region. The control gates are a continuous conductive strip of material. First and second fins are spaced apart by a first distance. Third and fourth fins are spaced apart by a second distance. The second and third fins are spaced apart by a third distance greater than the first and second distances. The continuous strip includes a portion disposed between the second and third fins, but no portion of the continuous strip is disposed between the first and second fins nor between the third and fourth fins.

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell columns, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first or second lines, and provide a first plurality of outputs as electrical currents on the third or fourth lines.

Abstract: A neural network device with synapses having memory cells each having source and drain regions in a semiconductor substrate with a channel region extending there between, a floating gate over an entirety of the channel region, and a first gate over the floating gate. First lines each electrically connect together the first gates in one of the memory cell rows, second lines each electrically connect together the source regions in one of the memory cell rows, and third lines each electrically connect together the drain regions in one of the memory cell columns. The synapses are configured to receive a first plurality of inputs as electrical voltages on the first lines or on the second lines, and to provide a first plurality of outputs as electrical currents on the third lines.

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell columns, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first or second lines, and provide a first plurality of outputs as electrical currents on the third or fourth lines.

Abstract: A method of forming a semiconductor device where memory cells and some logic devices are formed on bulk silicon while other logic devices are formed on a thin silicon layer over insulation over the bulk silicon of the same substrate. The memory cell stacks, select gate poly, and source regions for the memory devices are formed in the memory area before the logic devices are formed in the logic areas. The various oxide, nitride and poly layers used to form the gate stacks in the memory area are formed in the logic areas as well. Only after the memory cell stacks and select gate poly are formed, and the memory area protected by one or more protective layers, are the oxide, nitride and poly layers used to form the memory cell stacks removed from the logic areas, and the logic devices are then formed.