Abstract: A method of creating a scan pattern test file for testing hierarchal test blocks (HTBs) of scan channels on a semiconductor chip is described. The method includes determining a maximum number of channel mask enable encodes on the semiconductor chip. A maximum number of channel mask enable encodes used for the first HTB and the second HTB are determined. A plurality of test patterns used to test the first and the second HTB into one or more mask sets dependent on the number of masks each test pattern needs are sorted. The test patterns of the mask sets of the first and second HTB to be performed in a same test pattern are combined. The number of masks per scan cycle of the combined mask sets is no more than the maximum number of channel mask enable encodes on the semiconductor chip and there is no scan slice overlap.

Abstract: A semiconductor chip includes a first mask logic. The first mask logic includes a first mask and a second mask that mask a respective first scan channel output and a second scan channel output. The first mask logic includes at least three enable pins that receive respective enable signals. The three enable signals produce a channel mask enable encode. The first mask logic includes a first memory that stores a first channel mask enable decode for the first mask and a second memory that stores a second channel mask enable decode for the second mask. The first mask logic includes a first comparator and a second comparator. The first and second comparator compare the respective channel mask enable decodes to the channel mask enable encode. The comparators signal respective masks to mask the respective scan channel when the respective channel mask enable decode matches the channel mask enable encode.

Abstract: A method of creating a scan pattern test file for testing hierarchal test blocks (HTBs) of scan channels on a semiconductor chip is described. The method includes determining a maximum number of channel mask enable encodes on the semiconductor chip. A maximum number of channel mask enable encodes used for the first HTB and the second HTB are determined. A plurality of test patterns used to test the first and the second HTB into one or more mask sets dependent on the number of masks each test pattern needs are sorted. The test patterns of the mask sets of the first and second HTB to be performed in a same test pattern are combined. The number of masks per scan cycle of the combined mask sets is no more than the maximum number of channel mask enable encodes on the semiconductor chip and there is no scan slice overlap.

Abstract: A method of creating a scan pattern test file for testing hierarchal test blocks (HTBs) of scan channels on a semiconductor chip is described. The method includes determining a maximum number of channel mask enable encodes on the semiconductor chip. A maximum number of channel mask enable encodes used for the first HTB and the second HTB are determined. A plurality of test patterns used to test the first and the second HTB into one or more mask sets dependent on the number of masks each test pattern needs are sorted. The test patterns of the mask sets of the first and second HTB to be performed in a same test pattern are combined. The number of masks per scan cycle of the combined mask sets is no more than the maximum number of channel mask enable encodes on the semiconductor chip and there is no scan slice overlap.

Abstract: A semiconductor chip includes a first mask logic. The first mask logic includes a first mask and a second mask that mask a respective first scan channel output and a second scan channel output. The first mask logic includes at least three enable pins that receive respective enable signals. The three enable signals produce a channel mask enable encode. The first mask logic includes a first memory that stores a first channel mask enable decode for the first mask and a second memory that stores a second channel mask enable decode for the second mask. The first mask logic includes a first comparator and a second comparator. The first and second comparator compare the respective channel mask enable decodes to the channel mask enable encode. The comparators signal respective masks to mask the respective scan channel when the respective channel mask enable decode matches the channel mask enable encode.

Abstract: An apparatus and method is provided for switching input pins to scan channels to increase test coverage. In one embodiment, a scan system connects a small number of input pins to several scan channels so that the input pins may be selectively switched. The input pins may transmit independent test vectors to test a large number of test areas on a semiconductor chip. The scan system may include a switching device such as a multiplexer (MUX).

Abstract: First and second scan channels each comprise a plurality of scannable latches that apply input to and receive output from logic circuits on a chip under test. First input is scanned into the first scan channel and second input is scanned into the second scan channel. Output from the first scan channel is hashed using a first XOR on the first scan channel and output from the second scan channel is hashed using a first XOR on the second scan channel. Output from the first XOR on the first scan channel is hashed using a second XOR on the first scan channel. A rotator creates adjustment data from the output from the second XOR on the first scan channel. The adjustment data and output from the first XOR on the second scan channel are hashed using a second XOR on the second scan channel.

Abstract: An apparatus and method is provided for switching input pins to scan channels to increase test coverage. In one embodiment, a scan system connects a small number of input pins to several scan channels so that the input pins may be selectively switched. The input pins may transmit independent test vectors to test a large number of test areas on a semiconductor chip. The scan system may include a switching device such as a multiplexer (MUX).

Abstract: A method and structure tests a system on a chip (SoC) or other integrated circuit having multiple cores for chip characterization to produce a partial good status. A Self Evaluation Engine (SEE) on each core creates a quality metric or partial good value for the core. The SEE executes one or more tests to create a characterization signature for the core. The SEE then compares the characterization signature of a core with a characterization signature of neighboring cores to determine the partial good value for the core. The SEE may output a result to create a full characterization map for detailed diagnostics or a partial good map with values for all cores to produce a partial good status for the entire SoC.

Abstract: A failing latch is identified on a chip including a plurality of latches with the failing latch receiving data propagated from a first set of test input latches. A diagnostic set of latches is determined which includes the failing latch and a set of related latches. The set of related latches each receives data propagated from at least one test input latch from the first set of test input latches. The set of related latches is identified from a related latches data source. One or more tests are performed on the chip and test output data is collected from the diagnostic set of latches. A related latches table may be created by tracing from a target latch.

Abstract: A system and method of a test structure for testing a chip is disclosed. The system may include a scan channel comprising a plurality of scannable latches. The scan channel may be configured to scan input data to apply to logic circuits on a chip and further configured to receive outputs from logic circuits on the chip. The system may further include, a storage configured to store unmodified a selected bit of the scan channel during a scan out of the scan channel.

Abstract: Systems and methods to test processor cores of a multi-core processor microchip are provided. Comparison circuitry may be configured to compare data output from processor cores of a microchip. An encoding module may be configured to encode received data by initially assigning binary bit values to the processor cores. Based on at least one of a number of the processor cores and a first binary bit value, a first additional binary bit may be added to the first binary bit value. The first binary bit value may be assigned to a first processor core of the plurality of processor cores.

Abstract: A method and circuits for implementing multiple input signature register (MISR) compression for test time reduction, and a design structure on which the subject circuits reside are provided. The MISR compression circuit includes a first MISR, a second MISR provided with the first MISR, and a compressor to compress MISR data positioned in one of between the first MISR and second MISR and after the second MISR.

Abstract: A method of performing a dynamic built-in self-test (BIST). The method includes performing a first test of a circuit on a semiconductor chip. The first test includes a first switch factor. The circuit during the first test is monitored with one or more sensors. A first sensor value of one or more sensors monitoring the circuit is determined. It is also determined whether the first sensor value is within a range of a programmable constant. A second switch factor is determined in response to determining that the first sensor value outside the range of the programmable constant.

Abstract: A system and method of testing a chip is disclosed. The method may include scanning input data into a first scan channel serially connected to a second scan channel. The scan channels may comprise a plurality of scannable latches, configured to scan input data to apply to logic circuits on the chip and to receive outputs from the logic circuits. The method may include outputting a data from the first scan channel to a first rotator. The method may include creating adjustment data using the data from the first scan channel by the rotator and transmitting of the adjustment data to a second XOR on the second scan channel. The method may exclusive or the adjustment data from the first rotator with an output of the first XOR of the second scan channel, wherein the first XOR hashes output data from the scannable latches of the second scan channel.

Abstract: A system and method of testing a chip is disclosed. The method may include scanning input data into a first scan channel serially connected to a second scan channel. The scan channels may comprise a plurality of scannable latches, configured to scan input data to apply to logic circuits on the chip and to receive outputs from the logic circuits. The method may include outputting a data from the first scan channel to a first rotator. The method may include creating adjustment data using the data from the first scan channel by the rotator and transmitting of the adjustment data to a second XOR on the second scan channel. The method may exclusive or the adjustment data from the first rotator with an output of the first XOR of the second scan channel, wherein the first XOR hashes output data from the scannable latches of the second scan channel.

Abstract: A method of performing a dynamic built-in self-test (BIST). The method includes performing a first test of a circuit on a semiconductor chip. The first test includes a first switch factor. The circuit during the first test is monitored with one or more sensors. A first sensor value of one or more sensors monitoring the circuit is determined. It is also determined whether the first sensor value is within a range of a programmable constant. A second switch factor is determined in response to determining that the first sensor value outside the range of the programmable constant.

Abstract: A method of performing a dynamic built-in self-test (BIST). The method includes performing a first test of a circuit on a semiconductor chip. The first test includes a first switch factor. The circuit during the first test is monitored with one or more sensors. A first sensor value of one or more sensors monitoring the circuit is determined. It is also determined whether the first sensor value is within a range of a programmable constant. A second switch factor is determined in response to determining that the first sensor value outside the range of the programmable constant.

Abstract: An IO structure, method, and apparatus are disclosed for using an IEEE™ 1149.1 boundary scan latch to reroute a functional path. The method for a chip using IEEE™ 1149.1 boundary scan latches may include using the IEEE™ 1149.1 boundary scan latches for testing IO on the chip in a test mode. The method may also include using information stored in the IEEE™ 1149.1 boundary scan latches to route signals around a failing path in a functional mode.

Abstract: A method of locating faulty logic on a semiconductor chip is disclosed. The method may include determining failure rates for the semiconductor chip, which contain one or more logic elements. The method also may include determining a masking pattern using failure rates. The masking pattern may mask less than all of the logic elements using a determination method. The method may also include applying a test vector to a selected logic element, wherein the result from a test vector is compared to a reference.