Patents by Inventor Steven P. Ostrander
Steven P. Ostrander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11228124Abstract: In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.Type: GrantFiled: January 4, 2021Date of Patent: January 18, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mark K. Hoffmeyer, Steven P. Ostrander, Thomas Weiss, Thomas E. Lombardi
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Patent number: 11211262Abstract: An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.Type: GrantFiled: January 16, 2020Date of Patent: December 28, 2021Assignee: International Business Machines CorporationInventors: Tuhin Sinha, Steven P. Ostrander, Bhupender Singh, Sylvain Ouimet
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Publication number: 20210233824Abstract: An integrated circuit (IC) package, and a method for fabricating an IC package is described. A set of semiconductor chips, a set of corner guard structures and a chip carrier are provided. The set of semiconductor chips and the set of corner guard structure placed and bonded to a first surface of the chip carrier. The set of semiconductor chips are in electrical contact with the chip carrier. Respective corner guard structures are placed proximate to the corners of respective semiconductor chips. The coefficient of thermal expansion (CTE) of the set of corner guard structures is selected to ameliorate chip-package interaction (CPI) related failures due to differences between a CTE of the set of semiconductor chips and a CTE of the chip carrier.Type: ApplicationFiled: January 23, 2020Publication date: July 29, 2021Inventors: Shidong Li, Kamal K. Sikka, Charles L. Arvin, Steven P. Ostrander
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Publication number: 20210225665Abstract: An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.Type: ApplicationFiled: January 16, 2020Publication date: July 22, 2021Inventors: TUHIN SINHA, Steven P. Ostrander, Bhupender Singh, Sylvain Ouimet
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Patent number: 10777482Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.Type: GrantFiled: May 7, 2019Date of Patent: September 15, 2020Assignee: ELPIS TECHNOLOGIES INC.Inventors: Charles L. Arvin, Steven P. Ostrander, Krishna R. Tunga
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Publication number: 20190259683Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.Type: ApplicationFiled: May 7, 2019Publication date: August 22, 2019Inventors: CHARLES L. ARVIN, STEVEN P. OSTRANDER, KRISHNA R. TUNGA
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Patent number: 10325830Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.Type: GrantFiled: November 30, 2017Date of Patent: June 18, 2019Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Steven P. Ostrander, Krishna R. Tunga
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Publication number: 20190164864Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.Type: ApplicationFiled: November 30, 2017Publication date: May 30, 2019Inventors: CHARLES L. ARVIN, STEVEN P. OSTRANDER, KRISHNA R. TUNGA
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Patent number: 9947598Abstract: A methodology and associated wafer level assembly of testing crackstop structure designs. The wafer level semiconductor assembly includes: a substrate structure shaped to define a set of horizontal directions; a metallization layer located on top of the substrate structure, with the metallization layer including a crackstop structure formed therein in accordance with a crackstop structure design; and a tensioned layer located on top of the metallization layer, with the tensioned layer being made of material having internal tensile forces oriented in the horizontal directions. The tensile forces promote horizontal direction crack propagation in the metallization layer so that the crackstop structure design can be tested more rigorously and reliably before deciding on the crackstop design structure to put into mass production (which mass produced product would typically not include the tensioned layer).Type: GrantFiled: June 27, 2017Date of Patent: April 17, 2018Assignee: International Business Machines CorporationInventors: Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander, Christopher D. Muzzy, Thomas A. Wassick
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Patent number: 9601423Abstract: A laminate includes a buildup layer having a top and a bottom and a solder mask contacting the top. The laminate also includes a circuit element disposed on the top of the buildup layer and at least partially covered by the solder mask, the circuit element including a first via formed therein that allows for a power signal provided to an underside of the circuit element to be provided to a first connection on a top of the circuit element.Type: GrantFiled: December 18, 2015Date of Patent: March 21, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Jon A. Casey, Brian M. Erwin, Steven P. Ostrander, Brian W. Quinlan
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Patent number: 9543253Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.Type: GrantFiled: January 16, 2015Date of Patent: January 10, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Patent number: 9366591Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.Type: GrantFiled: July 24, 2014Date of Patent: June 14, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Patent number: 9272498Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.Type: GrantFiled: July 11, 2012Date of Patent: March 1, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Evan George Colgan, Paul W. Coteus, Michael Anthony Gaynes, Kenneth Charles Marston, Steven P. Ostrander
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Patent number: 9219051Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.Type: GrantFiled: June 5, 2013Date of Patent: December 22, 2015Assignee: GLOBALFOUNDRIES INC.Inventors: Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander, Sylvain Ouimet
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Patent number: 9059240Abstract: A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.Type: GrantFiled: June 5, 2012Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: Edmund D. Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Patent number: 9048245Abstract: A method including providing a fixture comprising a trap ring, a base plate having a recess adapted to receive a laminate substrate, the base plate including an opening and an adjustable height center button disposed in the opening, the opening being located within the recess and located in a center of the laminate substrate, characterizing the laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into the fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by the adjustable height center button, wherein the adjustable height center button contacts the laminate substrate. The method further includes fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.Type: GrantFiled: June 5, 2012Date of Patent: June 2, 2015Assignee: International Business Machines CorporationInventors: Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Publication number: 20150136838Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.Type: ApplicationFiled: January 16, 2015Publication date: May 21, 2015Inventors: Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Publication number: 20140359996Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.Type: ApplicationFiled: June 5, 2013Publication date: December 11, 2014Inventors: Stephanie Allard, Martin Beaumier, Jean-Francois Drapeau, Jean Labonte, Steven P. Ostrander, Sylvain Ouimet
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Patent number: 8906809Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.Type: GrantFiled: June 7, 2012Date of Patent: December 9, 2014Assignee: International Business Machines CorporationInventors: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz
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Patent number: 8900927Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.Type: GrantFiled: August 16, 2010Date of Patent: December 2, 2014Assignee: International Business Machines CorporationInventors: Martin M. Beaumier, Steven P. Ostrander, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz