Abstract: A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

Abstract: A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the electronic component. The spray manifold is sealed over the opening to define a spray area over a back surface of the electronic component. The spray manifold sprays a cooling fluid on the back surface. The sealing member seals the annular region so that input/output connectors on the component carrier are isolated from the cooling fluid.

Abstract: A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.

Abstract: A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.

Abstract: An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.

Abstract: A redundant configurable VCSEL laser array optical light source which provides for integrating optical communications capabilities into manufacturing processes for a substrate or submount such as a silicon or ceramic substrate, a multi-chip module, a package board, backplane or similar component. Multiple, spatially proximate lasers and photodetectors are provided as part of an optical transmitter or receiver module to simplify assembly of the module, particularly alignment of a laser or photodetector to an optical fiber or waveguide. A feedback loop and control logic select those laser(s) or photodiodes(s) which are most strongly coupled to the transmission medium to produce the best signals. This approach greatly simplifies optical alignment, to improve yield and relax mechanical tolerances, leading to lower assembly costs and higher manufacturing yields.

Abstract: An apparatus for integrating optical devices between a module and a circuit board comprising a carrier having optical waveguides, a module having optical ports on a surface of the module, the surface of the module connected to the carrier such that the optical waveguides are in communication with the optical ports; and a circuit board having optical ports on a surface of the circuit board, the surface of the circuit board connected to the carrier such that the optical waveguides are in communication with the optical ports. The apparatus may also integrate electrical ports on the surface of the module, the surface of the circuit board, and electrical connections on the carrier. The apparatus may also integrate circuit chips having optical ports for communication with the optical waveguides.

Abstract: An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.

Abstract: An apparatus for integrating optical devices between a module and a circuit board comprising a carrier having optical waveguides, a module having optical ports on a surface of the module, the surface of the module connected to the carrier such that the optical waveguides are in communication with the optical ports; and a circuit board having optical ports on a surface of the circuit board, the surface of the circuit board connected to the carrier such that the optical waveguides are in communication with the optical ports. The apparatus may also integrate electrical ports on the surface of the module, the surface of the circuit board, and electrical connections on the carrier. The apparatus may also integrate circuit chips having optical ports for communication with the optical waveguides.

Abstract: A redundant configurable VCSEL laser array optical light source which provides for integrating optical communications capabilities into manufacturing processes for a substrate or submount such as a silicon or ceramic substrate, a multi-chip module, a package board, backplane or similar component. Multiple, spatially proximate lasers and photodetectors are provided as part of an optical transmitter or receiver module to simplify assembly of the module, particularly alignment of a laser or photodetector to an optical fiber or waveguide. A feedback loop and control logic select those laser(s) or photodiodes(s) which are most strongly coupled to the transmission medium to produce the best signals. This approach greatly simplifies optical alignment, to improve yield and relax mechanical tolerances, leading to lower assembly costs and higher manufacturing yields.

Abstract: A process for producing ultra-fine particles of calcia-stabilized zirconia in which a precursor mixture (which contains from about 80 to about 96 mole percent of zirconium ion, from about 20 to about 4 mole percent of calcium ion, a nitrogen-containing fuel, and a solvent) is dried and then subjected to a temperature of from about 275 to about 750 degrees centigrade and an atmosphere with a relative humidity of less than about 60 percent, thereby causing the dried particles to react in a vigorous manner and to form a combusted powder.

Abstract: A process for producing ultra-fine yttrium-iron-garnet particles. In the first step of this process, a ceramic precursor material containing yettrium and ferric cations, a nitrogen-containing material, a solvent, and an anion capable of participating in an anionic oxidation-reduction reaction with the nitrogen-containing material, is provided. In the second step of the process, droplets of such ceramic precursor material are formed. In the third step of the process, the droplets are dried until particles which contain less than about 15 weight percent of solvent are produced. In the fourth step of this process, such particles are ignited in an atmosphere which contains substantially less than about 60 weight percent of the solvent's saturation value in such atmosphere.

Abstract: A process for producing ultra-fine barium hexaferrite particles. In the first step of this process, a ceramic precursor material containing barium and trivalent ferric cations, a nitrogen-containing material, a solvent, and an anion capable of participating in an anionic oxidation-reduction reaction with the nitrogen-containing material, is provided. In the second step of the process, droplets of such ceramic precursor material are formed. In the third step of the process, the droplets are dried until particles which contain less than about 15 weight percent of solvent are produced. In the fourth step of this process, such particles are ignited in an atmosphere which contains substantially less than about 60 weight percent of the solvent's saturation value in such atmosphere.

Abstract: A process for producing a sintered body from untra-fine superconductive particles. In the first step of this process, a ceramic precursor material containing yttrium, barium and copper cations, a nitrogen-containing material, a solvent, and an anion capable of participating in an anionic oxidation-reduction reaction with the nitrogen-containing material, is provided; the nitrogen-containing material contains at least three nitrogen atoms, at least one oxygen atom, and at least one carbon atom. In the second step of the process, droplets of such ceramic precursor material are formed. In the third step of the process, the droplets are dried until particles which contain less than about 15 weight percent of solvent are produced. In the fourth step of this process, such particles are ignited in an atmosphere which contains substantially less than about 60 weight percent of the solvent's saturation value in such atmosphere.

Abstract: The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Abstract: A process for producing ultra-fine barium titanate particles. In the first step of this process, a ceramic precursor material containing a metal cation, a nitrogen-containing material, a solvent, and an anion capable of participating in an anionic oxidation-reduction reaction with the nitrogen-containing material, is provided; the nitrogen-containing material contains at least three nitrogen atoms, at least one oxygen atom, and at least one carbon atom. In the second step of the process, droplets of such ceramic precursor material are formed. In the third step of the process, the droplets are dried until particles which contain less than about 15 weight percent of solvent are produced. In the fourth step of this process, such particles are ignited in an atmosphere which contains substantially less than about 60 weight percent of the solvent's saturation value in such atmosphere.

Abstract: A process for producing ultra-fine ceramic particles in which droplets are formed from a ceramic precursor mixture containing a metal cation, a nitrogen-containing fuel, a solvent, and an anion capable of participating in an anionic oxidation-reduction reaction with the nitrogen containing fuel. The nitrogen-containing fuel contains at least three nitrogen atoms, at least one oxygen atom, and at least one carbon atom. The ceramic precursor mixture is dried to remove at least 85 weight percent of the solvent, and the dried mixture is then ignited to form a combusted powder.