Patents by Inventor Steven P. Ostrander
Steven P. Ostrander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140331792Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.Type: ApplicationFiled: July 24, 2014Publication date: November 13, 2014Inventors: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Patent number: 8794079Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.Type: GrantFiled: November 4, 2011Date of Patent: August 5, 2014Assignee: International Business Machines CorporationInventors: Paul F. Bodenweber, Virendra R. Jadhav, Steven P. Ostrander, Kamal Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Publication number: 20130320069Abstract: A method for shaping a laminate substrate includes characterizing the laminate substrate for warpage characteristics. The laminate substrate is placed into a fixture with a correction to shape the laminate substrate based on the warpage characteristics. The laminate substrate is fluxed. A chip is placed onto the laminate substrate. The fixture is placed into a reflow furnace to join the chip and the laminate substrate. The fixture is removed from the reflow furnace. A warpage measurement is performed on the joined chip and laminate substrate. The correction may be modified if shorts are observed at the chip site.Type: ApplicationFiled: June 5, 2012Publication date: December 5, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Edmund Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Publication number: 20130323345Abstract: A fixture for shaping a laminate substrate includes a trap ring, a base plate and a center button. The base plate includes a recess adapted to receive the laminate substrate. The center button is disposed in an opening in the base plate. The center button may be adjusted to shape the laminate substrate.Type: ApplicationFiled: June 5, 2012Publication date: December 5, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Edmund D. Blackshear, Thomas E. Lombardi, Donald A. Merte, Steven P. Ostrander, Thomas Weiss, Jiantao Zheng
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Patent number: 8492199Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.Type: GrantFiled: October 4, 2011Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Jeffrey T. Coffin, Steven P. Ostrander, Frank L. Pompeo, Jiali Wu
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Publication number: 20130112006Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.Type: ApplicationFiled: November 4, 2011Publication date: May 9, 2013Applicant: International Business Machines CorporationInventors: PAUL F. BODENWEBER, Virendra R. Jadhav, Steven P. Ostrander, Kamal Sikka, Jiantao Zheng, Jeffrey A. Zitz
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Patent number: 8363404Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.Type: GrantFiled: December 14, 2010Date of Patent: January 29, 2013Assignee: International Business Machines CorporationInventors: John L. Colbert, Jason R. Eagle, Roger D. Hamilton, Kenneth C. Marston, Steven P. Ostrander
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Publication number: 20120276375Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.Type: ApplicationFiled: July 11, 2012Publication date: November 1, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan George Colgan, Paul W. Coteus, Michael Anthony Gaynes, Kenneth Charles Marston, Steven P. Ostrander
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Publication number: 20120241944Abstract: A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.Type: ApplicationFiled: June 7, 2012Publication date: September 27, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Patent number: 8268389Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.Type: GrantFiled: January 8, 2010Date of Patent: September 18, 2012Assignee: International Business Machines CorporationInventors: Evan G. Colgan, Paul W. Coteus, Michael A. Gaynes, Kenneth C. Marston, Steven P. Ostrander
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Publication number: 20120217986Abstract: A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements.Type: ApplicationFiled: February 24, 2011Publication date: August 30, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan F. Benner, Kenneth Y. Chan, Yvan Cossette, Eric E. Dube, Benjamin V. Fasano, Michael J. Fisher, Gilles Labbe, Pierre Laroche, Stephen P. Mroz, Steven P. Ostrander, Justin C. Rogers, Etienne St-Pierre
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Publication number: 20120147563Abstract: A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip.Type: ApplicationFiled: December 14, 2010Publication date: June 14, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: John L. Colbert, Jason R. Eagle, Roger D. Hamilton, Kenneth C. Marston, Steven P. Ostrander
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Publication number: 20120039046Abstract: A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.Type: ApplicationFiled: August 16, 2010Publication date: February 16, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin M. BEAUMIER, Steven P. OSTRANDER, Kamal K. SIKKA, Hilton T. TOY, Jeffrey A. ZITZ
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Publication number: 20120021567Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.Type: ApplicationFiled: October 4, 2011Publication date: January 26, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jeffrey T. Coffin, Steven P. Ostrander, Frank L. Pompeo, Jiali Wu
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Publication number: 20110171466Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.Type: ApplicationFiled: January 8, 2010Publication date: July 14, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Evan George Colgan, Paul W. Coteus, Michael Authony Gaynes, Kenneth Charles Marston, Steven P. Ostrander
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Patent number: 7816785Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.Type: GrantFiled: January 22, 2009Date of Patent: October 19, 2010Assignee: International Business Machines CorporationInventors: Sushumna Iruvanti, Randall G. Kemink, Rajneesh Kumar, Steven P. Ostrander, Prabjit Singh
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Patent number: 7786579Abstract: A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.Type: GrantFiled: May 23, 2007Date of Patent: August 31, 2010Assignee: International Business Machines CorporationInventors: Jean Audet, Anson J. Call, Steven P. Ostrander, Douglas O. Powell, Roger D. Weekly
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Publication number: 20100181663Abstract: An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.Type: ApplicationFiled: January 22, 2009Publication date: July 22, 2010Applicant: International Business Machines CorporationInventors: SUSHUMNA IRUVANTI, RANDALL G. KEMINK, RAJNEESH KUMAR, STEVEN P. OSTRANDER, PRABJIT SINGH
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Publication number: 20080311381Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.Type: ApplicationFiled: August 22, 2008Publication date: December 18, 2008Applicant: International Business Machines CorporationInventors: Rajneesh Kumar, Steven P. Ostrander
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Patent number: 7462294Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.Type: GrantFiled: April 25, 2007Date of Patent: December 9, 2008Assignee: International Business Machines CorporationInventors: Rajneesh Kumar, Steven P Ostrander