Patents by Inventor Steven S. Nasiri

Steven S. Nasiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190226848
    Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Inventors: Steven S. Nasiri, David Sachs, Babak Taheri
  • Patent number: 10288427
    Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: May 14, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Steven S. Nasiri, David Sachs, Babak Taheri
  • Patent number: 9846175
    Abstract: A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: December 19, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Steven S. Nasiri, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
  • Publication number: 20170355597
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Application
    Filed: August 28, 2017
    Publication date: December 14, 2017
    Inventors: Steven S. NASIRI, Anthony F. Flannery, JR.
  • Patent number: 9811174
    Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: November 7, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Steven S. Nasiri, Joseph Jiang, David Sachs
  • Patent number: 9751752
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: September 5, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Steven S. Nasiri, Anthony F. Flannery, Jr.
  • Publication number: 20170073223
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Application
    Filed: November 30, 2016
    Publication date: March 16, 2017
    Inventors: Steven S. NASIRI, Anthony F. Flannery, JR.
  • Patent number: 9533880
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: January 3, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Steven S. Nasiri, Anthony F. Flannery, Jr.
  • Publication number: 20160363490
    Abstract: An example MEMS force sensor is described herein. The MEMS force sensor can include a cap for receiving an applied force and a sensor bonded to the cap. A trench and a cavity can be formed in the sensor. The trench can be formed along at least a portion of a peripheral edge of the sensor. The cavity can define an outer wall and a flexible sensing element, and the outer wall can be arranged between the trench and the cavity. The cavity can be sealed between the cap and the sensor. The sensor can also include a sensor element formed on the flexible sensing element. The sensor element can change an electrical characteristic in response to deflection of the flexible sensing element.
    Type: Application
    Filed: June 10, 2016
    Publication date: December 15, 2016
    Inventors: Ian Campbell, Ryan Diestelhorst, Dan Benjamin, Steven S. Nasiri
  • Patent number: 9342154
    Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: May 17, 2016
    Assignee: InvenSense, Inc.
    Inventors: Steven S. Nasiri, Joseph Jiang, David Sachs
  • Patent number: 9292102
    Abstract: Handheld electronic devices including motion sensing and processing. In one aspect, a handheld electronic device includes a set of motion sensors provided on a single sensor wafer, including at least one gyroscope sensing rotational rate of the device around at least three axes and at least one accelerometer sensing gravity and linear acceleration of the device along the at least three axes. Memory stores sensor data derived from the at least one gyroscope and accelerometer, where the sensor data describes movement of the device including a rotation of the device around at least one of the three axes of the device, the rotation causing interaction with the device. The memory is provided on an electronics wafer positioned vertically with respect to the sensor wafer and substantially parallel to the sensor wafer. The electronics wafer is vertically bonded to and electrically connected to the sensor wafer.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: March 22, 2016
    Assignee: INVENSENSE, INC.
    Inventors: Steven S. Nasiri, David Sachs
  • Publication number: 20160002029
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Application
    Filed: September 14, 2015
    Publication date: January 7, 2016
    Inventors: Steven S. NASIRI, Anthony F. Flannery, JR.
  • Patent number: 9139428
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: September 22, 2015
    Assignee: INVENSENSE, INC.
    Inventors: Steven S. Nasiri, Anthony F. Flannery, Jr.
  • Publication number: 20150234481
    Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.
    Type: Application
    Filed: April 28, 2015
    Publication date: August 20, 2015
    Inventors: Steven S. NASIRI, Joseph JIANG, David SACHS
  • Publication number: 20150192416
    Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
    Type: Application
    Filed: March 19, 2015
    Publication date: July 9, 2015
    Inventors: Steven S. NASIRI, David SACHS, Babak TAHERI
  • Publication number: 20150193006
    Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.
    Type: Application
    Filed: January 6, 2015
    Publication date: July 9, 2015
    Inventors: Steven S. NASIRI, Joseph JIANG, David SACHS
  • Publication number: 20150135831
    Abstract: A rotational sensor for measuring rotational acceleration is disclosed. The rotational sensor comprises a sense substrate; at least two proof masses, and a set of two transducers. Each of the at least two proof masses is anchored to the sense substrate via at least one flexure and electrically isolated from each other; and the at least two proof masses are capable of rotating in-plane about a Z-axis relative to the sense substrate, wherein the Z-axis is normal to the substrate. Each of the transducers can sense rotation of each proof mass with respect to the sense substrate in response to a rotation of the rotational sensor.
    Type: Application
    Filed: January 27, 2015
    Publication date: May 21, 2015
    Inventors: Steven S. NASIRI, Goksen G. YARALIOGLU, Joseph SEEGER, Babak TAHERI
  • Patent number: 8997564
    Abstract: A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: April 7, 2015
    Assignee: Invensense, Inc.
    Inventors: Steven S. Nasiri, David Sachs, Babak Taheri
  • Patent number: 8960002
    Abstract: Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: February 24, 2015
    Assignee: Invensense, Inc.
    Inventors: Steven S. Nasiri, Goksen G. Yaralioglu, Joseph Seeger, Babak Taheri
  • Patent number: 8952832
    Abstract: Interfacing application programs and motion sensors of a device. In one aspect, a high-level command is received from an application program running on a motion sensing device, where the application program implements one of multiple different types of applications available for use on the device. The high-level command requests high-level information derived from the output of motion sensors of the device that include rotational motion sensors and linear motion sensors. The command is translated to cause low-level processing of motion sensor data output by the motion sensors, the low-level processing following requirements of the type of application and determining the high-level information in response to the command. The application program is ignorant of the low-level processing, and the high-level information is provided to the application program.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: February 10, 2015
    Assignee: Invensense, Inc.
    Inventors: Steven S. Nasiri, Joseph Jiang, David Sachs