Patents by Inventor Steven S. Nasiri

Steven S. Nasiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080283990
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Application
    Filed: July 31, 2008
    Publication date: November 20, 2008
    Applicant: InvenSense Inc.
    Inventors: Steven S. Nasiri, Anthony Francis Flannery, JR.
  • Patent number: 7442570
    Abstract: A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between two substrates; (3) it can be patterned so that this conduction path is localized; (4) the bond can be made with the aluminum that is available as standard foundry CMOS process. This has the significant advantage of allowing for wafer-level bonding or packaging without the addition of any additional process layers to the CMOS wafer.
    Type: Grant
    Filed: March 18, 2005
    Date of Patent: October 28, 2008
    Assignee: Invensence Inc.
    Inventors: Steven S. Nasiri, Anthony Francis Flannery, Jr.
  • Publication number: 20080166115
    Abstract: Methods and apparatus for electronically stabilizing an image captured by a device including a motion detection unit are provided. In one implementation, the method includes capturing a first exposure of the image, and capturing a second exposure of the image including using the motion detection unit to ensure that the second exposure of the image has a pre-determined blur property. The second exposure is longer than the first exposure. The method further includes combining the second exposure of the image having the pre-determined blur property and the first exposure of the image to electronically stabilize the image captured by the device.
    Type: Application
    Filed: January 5, 2007
    Publication date: July 10, 2008
    Inventors: David Sachs, Jianbo Shi, Steven S. Nasiri, Kishore Moturi
  • Patent number: 7267260
    Abstract: Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end during its insertion. The funnel sections terminate in narrow hole sections that tightly hold the inserted fiber ends. Having top and bottom plate spaced apart provides for high angular precision of the bonded fiber ends with minimal fabrication effort of the insert. Optical fibers may be combined in linear arrays and simultaneously inserted significantly reducing assembly efforts. The insert is attached to a fiber housing and hermetically sealed within an external housing, which features a glass plate to provide beam propagation to and from the fiber ends. An optical gel fills the gap between the insert's output face and the glass plate.
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: September 11, 2007
    Assignee: Intel Corporation
    Inventors: Steven S. Nasiri, Janusz Liberkowski, Zhenfang Chen, Jeff Jarfa
  • Patent number: 7258011
    Abstract: A sensor for measuring acceleration in three mutually orthogonal axes, X, Y and Z is disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to move substantially in the X, Y, and Z, about by at least one linkage and is responsive to accelerations in the X, Y and Z directions. The sensor includes at least one paddle disposed in the sensing plane; and at least one pivot on the linkage. Finally, the sensor includes at least one electrode at the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the acceleration.
    Type: Grant
    Filed: November 21, 2005
    Date of Patent: August 21, 2007
    Assignee: InvenSense Inc.
    Inventors: Steven S. Nasiri, Joseph Seeger
  • Patent number: 7250112
    Abstract: A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame is provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: July 31, 2007
    Assignee: InvenSense Inc
    Inventors: Steven S. Nasiri, Anthony Francis Flannery, Jr.
  • Patent number: 7250353
    Abstract: A MEMs (microelectromechanical systems) structure is provided. In one implementation, the MEMs structure includes a substrate wafer including a MEMs device formed on a surface of the substrate wafer, and a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer. The MEMs cover structure comprises a first wafer bonded to a second wafer, in which only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: July 31, 2007
    Assignee: InvenSense, Inc.
    Inventors: Steven S. Nasiri, Anthony Francis Flannery, Jr., Martin Lim
  • Patent number: 7247246
    Abstract: A wafer-scale fabrication method for providing MEMS assemblies having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided. Fabrication cost is greatly reduced by wafer scale integration.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: July 24, 2007
    Assignee: Atmel Corporation
    Inventors: Steven S. Nasiri, Anthony Francis Flannery, Jr.
  • Patent number: 7104129
    Abstract: A MEMS assembly having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: September 12, 2006
    Assignee: InvenSense Inc.
    Inventors: Steven S. Nasiri, Anthony Francis Flannery, Jr.
  • Patent number: 6939473
    Abstract: A method for making an angular velocity sensor having two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame provided. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly wafers provides a hermetic barrier between the masses and an ambient environment.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: September 6, 2005
    Assignee: Invensense Inc.
    Inventors: Steven S. Nasiri, Anthony Francis Flannery, Jr.
  • Patent number: 6892575
    Abstract: An angular velocity sensor has two masses which are laterally disposed in an X-Y plane and indirectly connected to a frame. The two masses are linked together by a linkage such that they necessarily move in opposite directions along Z. Angular velocity of the sensor about the Y axis can be sensed by driving the two masses into Z-directed antiphase oscillation and measuring the angular oscillation amplitude thereby imparted to the frame. In a preferred embodiment, the angular velocity sensor is fabricated from a bulk MEMS gyroscope wafer, a cap wafer and a reference wafer. In a further preferred embodiment, this assembly of wafers provides a hermetic barrier between the masses and an ambient environment.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: May 17, 2005
    Assignee: Invensense Inc.
    Inventors: Steven S. Nasiri, Joseph Seeger
  • Patent number: 6843574
    Abstract: The present invention is directed towards apparatuses for rotating a gimbaled platform with rotatable actuators. Gimbal springs comprised of component springs with compliant axes that intersect at a nonzero angle are coupled to the gimbaled platform. Preferably, the compliant axes of the component springs are oriented at an approximately 45 degree angle relative to the actuator rotation axes. Wraparound lever arms coupling the rotatable actuators with the gimbal springs serve to increase the leverage ratio, thereby permitting greater platform rotation for a given actuator rotation.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: January 18, 2005
    Assignee: Intel Corporation
    Inventors: James Starr, Mitchell J. Novack, Haesung Kwon, James H. Smith, Steven S. Nasiri
  • Patent number: 6823127
    Abstract: Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end during its insertion. The funnel sections terminate in narrow hole sections that tightly hold the inserted fiber ends. Having top and bottom plate spaced apart provides for high angular precision of the bonded fiber ends with minimal fabrication effort of the insert. Optical fibers may be combined in linear arrays and simultaneously inserted significantly reducing assembly efforts. The insert is attached to a fiber housing and hermetically sealed within an external housing, which features a glass plate to provide beam propagation to and from the fiber ends. An optical gel fills the gap between the insert's output face and the glass plate.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: November 23, 2004
    Assignee: Intel Corporation
    Inventors: Steven S. Nasiri, Janusz Liberkowski, Zhenfang Chen, Jeff Jarfa
  • Publication number: 20040081420
    Abstract: Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end during its insertion. The funnel sections terminate in narrow hole sections that tightly hold the inserted fiber ends. Having top and bottom plate spaced apart provides for high angular precision of the bonded fiber ends with minimal fabrication effort of the insert. Optical fibers may be combined in linear arrays and simultaneously inserted significantly reducing assembly efforts. The insert is attached to a fiber housing and hermetically sealed within an external housing, which features a glass plate to provide beam propagation to and from the fiber ends. An optical gel fills the gap between the insert's output face and the glass plate.
    Type: Application
    Filed: October 15, 2003
    Publication date: April 29, 2004
    Applicant: Intel Corporation
    Inventors: Steven S. Nasiri, Janusz Liberkowski, Zhenfang Chen, Jeff Jarfa
  • Publication number: 20040047582
    Abstract: Optical fibers are inserted and bonded in a two dimensional array of feedthroughs provided by an insert having a top plate, a bottom plate and a sandwiched spacer plate. Top and bottom plate feature funnel shaped hole sections that capture the approaching fiber end during its insertion. The funnel sections terminate in narrow hole sections that tightly hold the inserted fiber ends. Having top and bottom plate spaced apart provides for high angular precision of the bonded fiber ends with minimal fabrication effort of the insert. Optical fibers may be combined in linear arrays and simultaneously inserted significantly reducing assembly efforts. The insert is attached to a fiber housing and hermetically sealed within an external housing, which features a glass plate to provide beam propagation to and from the fiber ends. An optical gel fills the gap between the insert's output face and the glass plate.
    Type: Application
    Filed: September 5, 2002
    Publication date: March 11, 2004
    Inventors: Steven S. Nasiri, Janusz Liberkowski, Zhenfang Chen, Jeff Jarfa
  • Publication number: 20040037492
    Abstract: The present invention is directed towards apparatuses for rotating a gimbaled platform with rotatable actuators. Gimbal springs comprised of component springs with compliant axes that intersect at a nonzero angle are coupled to the gimbaled platform. Preferably, the compliant axes of the component springs are oriented at an approximately 45 degree angle relative to the actuator rotation axes. Wraparound lever arms coupling the rotatable actuators with the gimbal springs serve to increase the leverage ratio, thereby permitting greater platform rotation for a given actuator rotation.
    Type: Application
    Filed: August 20, 2002
    Publication date: February 26, 2004
    Inventors: James Starr, Mitchell J. Novack, Haesung Kwon, James H. Smith, Steven S. Nasiri
  • Patent number: 6636656
    Abstract: An optical switching fabric enables an optical signal entering the device on any one of multiple input ports to be directed to any one of multiple output ports. The present optical switching fabrics include sensing and monitoring devices that permit precise initial calibration and continuous switch connection status monitoring and control. Light entering the switching fabric on an input port is reflected by one of a first set of individually controllable mirrors to one of a second set of individually controllable mirrors and then to a corresponding output port. The switching fabrics include control lasers and position sensing devices which provide output signals corresponding to the orientations of the mirrors. In addition, a subset of the input ports and output ports can be attached to monitor light sources and detectors for recalibration and control.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: October 21, 2003
    Assignee: Transparent Networks, Inc.
    Inventors: Cheng-Chung Huang, Steven S. Nasiri, Alex Harwit, Dmitry Vasily Bakin, Randall Brian Sprague, Janusz Bryzek
  • Publication number: 20030174928
    Abstract: An optical switching fabric enables an optical signal entering the device on any one of multiple input ports to be directed to any one of multiple output ports. The present optical switching fabrics include sensing and monitoring devices that permit precise initial calibration and continuous switch connection status monitoring and control. Light entering the switching fabric on an input port is reflected by one of a first set of individually controllable mirrors to one of a second set of individually controllable mirrors and then to a corresponding output port. The switching fabrics include control lasers and position sensing devices which provide output signals corresponding to the orientations of the mirrors. In addition, a subset of the input ports and output ports can be attached to monitor light sources and detectors for recalibration and control.
    Type: Application
    Filed: October 24, 2001
    Publication date: September 18, 2003
    Inventors: Cheng-Chung Huang, Steven S. Nasiri, Alex Harwit, Dmitry Vasily Bakin, Randall Brian Sprague, Janusz Bryzek
  • Patent number: 6480320
    Abstract: A freely rotatable microelectromechanical mirror and mirror array. Each mirror is connected to a plate flexibly suspended from a plurality of actuators by a plurality of plate flexures. The actuators are flexibly suspended from a support structure by a plurality of actuator flexures. The support structure is held above and electrically isolated from a reference layer by a plurality of standoff posts. The reference layer contains a plurality of actuation means such as control electrodes to move the actuators in first and second directions when actuated. Control voltages can be selectively applied to selective control electrodes to selectively move the actuators, and extend the plurality of plate flexures. The extended plate flexures create a net restoring force or torque to translate or rotate the freely movable plate. The plate and attached mirror are thereby translated or rotated about an arbitrary axis of rotation without stress.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: November 12, 2002
    Assignee: Transparent Optical, Inc.
    Inventor: Steven S. Nasiri
  • Publication number: 20020149069
    Abstract: A semiconductor sensor with epi-pocket isolation is described. In one embodiment, the semiconductor sensor comprises a deformable member which includes a first silicon region of a first conductivity type and a second silicon region of a second conductivity type surrounding the first silicon region. The semiconductor sensor further comprises a stress-sensitive diffused resistive element disposed on the deformable member in the first silicon region.
    Type: Application
    Filed: June 28, 2002
    Publication date: October 17, 2002
    Inventors: Janusz Bryzek, David W. Burns, Steven S. Nasiri