Patents by Inventor Steven Swier

Steven Swier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11139419
    Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: October 5, 2021
    Assignees: DuPont Toray Specialty Materials Kabushiki Kaisha, Dow Silicones Corporation
    Inventors: Eiji Kitaura, Masaaki Amako, Steven Swier
  • Publication number: 20210238444
    Abstract: A moisture curable polyorganosiloxane composition is disclosed. The composition comprises: (A) a polyorganosiloxane endblocked with alkoxysilyl-containing groups at both molecular terminals; (B) a polyorganosiloxane resin having a content of OZ in a range of from about 50 mol % to about 150 mol %, wherein each Z is H or an alkyl group such that OZ represents a silanol group and/or a silicon atom-bonded alkoxy group; and (C) a polyorganosiloxane resin having an alkoxysilyl-containing group. The composition exhibits good to excellent coating performance without using a solvent. In addition, the composition can cure by contacting moisture in air to form a cured product exhibiting good to excellent mechanical properties.
    Type: Application
    Filed: June 5, 2019
    Publication date: August 5, 2021
    Inventors: David R. DINGMAN, John B. HORSTMAN, Steven SWIER
  • Patent number: 11078335
    Abstract: A method for preparing a graft copolymer having a polyolefin backbone and polyorganosiloxane pendant groups can be catalyzed by a Lewis Acid catalyst, Piers-Rubenstzjan catalyst, or hydrosilylation reaction catalyst. The graft copolymer prepared by the method is useful as a thermoplastic elastomer or as a compatibilizer in compositions containing both a polyolefin and a polyorganosiloxane.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: August 3, 2021
    Assignee: Dow Silicones Corporation
    Inventors: Steven Swier, Zachary Kean, John B. Horstman
  • Publication number: 20210230372
    Abstract: A polysiloxane resin—polyolefin copolymer may be prepared using either a hydrosilylation catalyst or a Lewis Acid catalyst. The copolymer may have polyorganosilicate or silsesquioxane resin blocks. The copolymer may have polyethylene or poly(ethylene/octene) blocks.
    Type: Application
    Filed: April 8, 2019
    Publication date: July 29, 2021
    Inventors: Steven Swier, John Horstman
  • Publication number: 20210198450
    Abstract: A composition contains an aryl-functionalized polysiloxane and quaternary ammonium compound, where the quaternary ammonium compound has an anion selected from a group consisting of: halides, salicylate, octanoate, acetate, dihydrogen citrate, maleate, hydrogenglutaric acid anion, and bistartaric acid anion.
    Type: Application
    Filed: August 19, 2019
    Publication date: July 1, 2021
    Inventors: Shengqing Xu, Steven Swier, Martijn A. Beukema
  • Patent number: 11028231
    Abstract: A polysiloxane comprising: (a) from 40 to 90 mole % units of formula R1R2SiO2/2, (b) from 10 to 60 mole % units of formula R3SiO3/2, and (c) from 0 to 5 mole % units of formula R1R4SiO2/2; wherein R1 and R2 independently are phenyl or C1-C6 alkyl; R3 represents at least one C1-C30 hydrocarbyl group; R4 is —Ar1-X—Ar2, where Ar1 and Ar2 independently are C6-C12 aryl and X is O CH2; provided that the polysiloxane comprises at least one —Ar1-X—Ar2 group.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: June 8, 2021
    Assignee: Dow Silicone Corporation
    Inventors: Steven Swier, John B. Horstman
  • Patent number: 11015025
    Abstract: A composition comprising: (a) a component comprising units of Ar1SiO3/2, wherein Ar1 is C6-C20 aryl and units of PhCH3SiO2/2, and having Mw from 20,000 to 90,000; and (b) an elastomeric component comprising: (i) a straight-chain organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (ii) a branched-chain organopolysiloxane having formula: (RSiO3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d(XO1/2)e where each R is the same or different C1-C20 hydrocarbyl group, 0.1 to 40 mole % of all R's are alkenyl, more than 10 mole % of all R's are C6-C20 aryl, X is a hydrogen atom or alkyl, a is 0.45 to 0.95, b is 0 to 0.25, c is 0.05 to 0.5, d is 0 to 0.1, e is 0 to 0.1, c/a is 0.1 to 0.5; (iii) an organopolysiloxane having at least two silicon-bonded hydrogen atoms; and (iv) a hydrosilylation catalyst.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: May 25, 2021
    Assignee: Dow Silicones Corporation
    Inventors: Steven Swier, Fumito Nishida
  • Publication number: 20210095125
    Abstract: A room temperature curable organopolysiloxane composition comprises: (A) an organopolysiloxane having alkoxysilyl-containing groups at both molecular terminals; (B) an organopolysiloxane resin; (C) an alkoxysilane; and (D) a condensation-reaction catalyst. The room temperature curable organopolysiloxane composition exhibits good to excellent storage stability. In addition, the room temperature curable organopolysiloxane composition can form a cured product exhibiting good to excellent mechanical properties.
    Type: Application
    Filed: March 21, 2019
    Publication date: April 1, 2021
    Inventors: Jody J. HENNING, John B. HORSTMAN, Vennesa O. JANSMA, Steven SWIER
  • Patent number: 10940105
    Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: March 9, 2021
    Assignees: Dow Silicones Corporation, Dow Toray Co., Ltd.
    Inventors: Haruhiko Furukawa, John Bernard Horstman, Tomohiro Iimura, Tadashi Okawa, Steven Swier
  • Publication number: 20210017195
    Abstract: A process to functionalize organo-zinc compounds with halosilane electrophiles employs a basic additive. The process includes combining the organo-zinc compound, a halosilanes, and a nitrogen containing heterocycle as the basic additive. The presence of the basic additive facilitates successful substitution. Functionalized silanes and silyl-terminated polyolefins can be prepared using this process. The functionalized silanes may be useful as endblockers for polyorganosiloxanes having SiH and/or silicon bonded aliphatically unsaturated groups capable of undergoing hydrosilylation.
    Type: Application
    Filed: March 18, 2019
    Publication date: January 21, 2021
    Inventors: Jordan Reddel, Robert David Grigg, Phillip Dene Hustad, Sukrit Mukhopadhyay, Steven Swier, Ken Kawamoto
  • Publication number: 20210009880
    Abstract: A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.
    Type: Application
    Filed: February 22, 2019
    Publication date: January 14, 2021
    Inventors: Steven Swier, Glenn Gordon, Zachary Kean, Michael Behr, John Bernard Horstman
  • Publication number: 20210002431
    Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.
    Type: Application
    Filed: February 22, 2019
    Publication date: January 7, 2021
    Inventors: Steven Swier, Phillip Hustad, David Devore, Zachary Kean, Liam Spencer, Jordan Reddel, Bethany Neilson, John Bernard Horstman, Ken Kawamoto, Jerzy Klosin
  • Publication number: 20200407512
    Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by Piers-Rubinsztajn reaction.
    Type: Application
    Filed: February 22, 2019
    Publication date: December 31, 2020
    Inventors: Steven Swier, Phillip Hustad, David Devore, Zachary Kean, Liam Spencer, Jordan Reddel, Bethany Neilson, John Bernard Horstman, Ken Kawamoto
  • Publication number: 20200407600
    Abstract: A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.
    Type: Application
    Filed: February 22, 2019
    Publication date: December 31, 2020
    Inventors: Steven Swier, Glenn Gordon, Zachary Kean, Michael Behr, John Bernard Horstman
  • Patent number: 10874604
    Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: December 29, 2020
    Assignees: DOW TORAY CO., LTD., DOW SILICONES CORPORATION
    Inventors: Haruhiko Furukawa, John Bernard Horstman, Tomohiro Iimura, Tadashi Okawa, Steven Swier
  • Publication number: 20200373457
    Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.
    Type: Application
    Filed: August 31, 2018
    Publication date: November 26, 2020
    Inventors: Eiji Kitaura, Masaaki Amako, Steven Swier
  • Patent number: 10793681
    Abstract: A hydrosilylation curable polysiloxane comprising at least one of units of formula (I) and units of formula (II), wherein Ar is C6-C20 aryl, R1 is C2-C20 alkenyl, and R2, R3, R4 and R5 independently are C1-C20 hydrocarbyl.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: October 6, 2020
    Assignee: Dow Silicones Corporation
    Inventors: Steven Swier, Haruhiko Furukawa, Michitaka Suto, Kazuhiro Nishijima, Atsushi Sugie
  • Publication number: 20200291190
    Abstract: A hydrosilylation curable polysiloxane comprising at least one of units of formula (I) and units of formula (II), wherein Ar is C6-C20 aryl, R1 is C2-C20 alkenyl, and R2, R3, R4 and R5 independently are C1-C20 hydrocarbyl.
    Type: Application
    Filed: April 18, 2018
    Publication date: September 17, 2020
    Inventors: Steven Swier, Haruhiko Furukawa, Michitaka Suto, Kazuhiro Nishijima, Atsushi Sugie
  • Publication number: 20200253855
    Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.
    Type: Application
    Filed: October 3, 2017
    Publication date: August 13, 2020
    Inventors: Haruhiko FURUKAWA, John Bernard HORSTMAN, Tomohiro IIMURA, Tadashi OKAWA, Steven SWIER
  • Publication number: 20200220055
    Abstract: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan ?) of 1.6 or more at the temperature T2.
    Type: Application
    Filed: August 31, 2018
    Publication date: July 9, 2020
    Inventors: Eiji Kitaura, Masaaki Amako, Steven Swier