Abstract: A composition contains: (a) a silicon-free mercapto compound comprising 2 or more mercapto groups; (b) a linear polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group, 40 mole-percent or more phenyl groups relative to moles of silicon atoms and at least one alkoxysilyl group per molecule; (c) a resinous polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group and 20 mole-percent or more phenyl groups relative to moles of silicon atoms; (d) a photoinitiator; and (e) a moisture cure catalyst; and wherein the molar ratio of mercapto groups to terminally unsaturated alkenyl groups in the composition is in a range of 0.3 to 2.0.

Abstract: A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan ?) of 1.6 or more at the temperature T2.

Abstract: An aqueous dispersion containing (meth)acrylate polymer particles and substituted silsesquioxane-based particles dispersed in an aqueous carrier, wherein: (a) the substituted silsesquioxane-based particles have an volume-average size of 5 nanometers or more and at the same time less than 500 nanometers as determined by dynamic light scattering; and (b) the substituted silsesquioxane-based particles are substituted only with one or more than one moiety selected from a group consisting of alkyl, aryl, hydroxyl, trace amounts of alkoxy and combinations thereof and contain 50 mole-percent or less hydroxyl substitution in the form silanol functionalities relative to moles of substituted silsesquioxane-based particle as determined by infrared spectroscopy.

Abstract: A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.

Abstract: A moisture curable polyorganosiloxane composition is disclosed. The composition comprises: (A) a polyorganosiloxane endblocked with alkoxysilyl-containing groups at both molecular terminals; (B) a polyorganosiloxane resin having a content of OZ in a range of from about 50 mol % to about 150 mol %, wherein each Z is H or an alkyl group such that OZ represents a silanol group and/or a silicon atom-bonded alkoxy group; and (C) a polyorganosiloxane resin having an alkoxysilyl-containing group. The composition exhibits good to excellent coating performance without using a solvent. In addition, the composition can cure by contacting moisture in air to form a cured product exhibiting good to excellent mechanical properties.

Abstract: A method for preparing a graft copolymer having a polyolefin backbone and polyorganosiloxane pendant groups can be catalyzed by a Lewis Acid catalyst, Piers-Rubenstzjan catalyst, or hydrosilylation reaction catalyst. The graft copolymer prepared by the method is useful as a thermoplastic elastomer or as a compatibilizer in compositions containing both a polyolefin and a polyorganosiloxane.

Abstract: A polysiloxane resin—polyolefin copolymer may be prepared using either a hydrosilylation catalyst or a Lewis Acid catalyst. The copolymer may have polyorganosilicate or silsesquioxane resin blocks. The copolymer may have polyethylene or poly(ethylene/octene) blocks.

Abstract: A composition contains an aryl-functionalized polysiloxane and quaternary ammonium compound, where the quaternary ammonium compound has an anion selected from a group consisting of: halides, salicylate, octanoate, acetate, dihydrogen citrate, maleate, hydrogenglutaric acid anion, and bistartaric acid anion.

Abstract: A polysiloxane comprising: (a) from 40 to 90 mole % units of formula R1R2SiO2/2, (b) from 10 to 60 mole % units of formula R3SiO3/2, and (c) from 0 to 5 mole % units of formula R1R4SiO2/2; wherein R1 and R2 independently are phenyl or C1-C6 alkyl; R3 represents at least one C1-C30 hydrocarbyl group; R4 is —Ar1-X—Ar2, where Ar1 and Ar2 independently are C6-C12 aryl and X is O CH2; provided that the polysiloxane comprises at least one —Ar1-X—Ar2 group.

Abstract: A composition comprising: (a) a component comprising units of Ar1SiO3/2, wherein Ar1 is C6-C20 aryl and units of PhCH3SiO2/2, and having Mw from 20,000 to 90,000; and (b) an elastomeric component comprising: (i) a straight-chain organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (ii) a branched-chain organopolysiloxane having formula: (RSiO3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d(XO1/2)e where each R is the same or different C1-C20 hydrocarbyl group, 0.1 to 40 mole % of all R's are alkenyl, more than 10 mole % of all R's are C6-C20 aryl, X is a hydrogen atom or alkyl, a is 0.45 to 0.95, b is 0 to 0.25, c is 0.05 to 0.5, d is 0 to 0.1, e is 0 to 0.1, c/a is 0.1 to 0.5; (iii) an organopolysiloxane having at least two silicon-bonded hydrogen atoms; and (iv) a hydrosilylation catalyst.

Abstract: A room temperature curable organopolysiloxane composition comprises: (A) an organopolysiloxane having alkoxysilyl-containing groups at both molecular terminals; (B) an organopolysiloxane resin; (C) an alkoxysilane; and (D) a condensation-reaction catalyst. The room temperature curable organopolysiloxane composition exhibits good to excellent storage stability. In addition, the room temperature curable organopolysiloxane composition can form a cured product exhibiting good to excellent mechanical properties.

Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.

Abstract: A process to functionalize organo-zinc compounds with halosilane electrophiles employs a basic additive. The process includes combining the organo-zinc compound, a halosilanes, and a nitrogen containing heterocycle as the basic additive. The presence of the basic additive facilitates successful substitution. Functionalized silanes and silyl-terminated polyolefins can be prepared using this process. The functionalized silanes may be useful as endblockers for polyorganosiloxanes having SiH and/or silicon bonded aliphatically unsaturated groups capable of undergoing hydrosilylation.

Abstract: A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.

Abstract: A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

Abstract: A polyolefin-polydiorganosiloxane block copolymer may be prepared by Piers-Rubinsztajn reaction.

Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.

Abstract: A method for producing a sealed optical semiconductor device makes it possible to seal an optical semiconductor element using a sealing film. The method includes: placing a sealing film on an optical semiconductor element substrate on which an optical semiconductor element is placed within a pressure reduction chamber, and the pressure within the chamber is reduced; heating the film where at least the periphery of the film is thermally fused to the surface of the optical semiconductor element placement substrate; and a step in which the reduction of pressure within the chamber is released and the optical semiconductor element placement substrate is sealed by the film. The temperature T2 of the optical semiconductor element placement substrate when the reduction of pressure within the chamber is released is a temperature at which the film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 150-450%.