Abstract: The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C1 to C30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

Abstract: An optical assembly includes an optical device having an optical surface. The optical assembly further includes an encapsulant that substantially covers the optical surface. The encapsulant has a first layer (106) and a second layer (108). The first layer (106) has a first silicone-containing hot melt composition and a major surface (112). The second layer (108) has a second silicone-containing hot melt composition, the second layer (108) having a second major surface (110) in contact with the first major surface (112).

Abstract: Curable compositions of “resin-linear” organosiloxane block copolymers comprising a nanoparticulate filler are disclosed. In some instances, even at high loading levels, curable and solid compositions comprising “resin linear” organosiloxane block copolymers and a nanoparticulate filler exhibit melt flow and cure behavior. In addition, the nanoparticulate filler present in the curable and solid compositions comprising “resin linear” organosiloxane block copolymers have the effect of significantly in creasing the refractive index of the curable and solid compositions.

Abstract: Methods of making optical assemblies and electronic devices comprising, depositing a solid silicone-containing hot melt composition in powder form onto an optical surface of an optical device; and forming, from the silicone-containing hot melt composition, an encapsulant that substantially covers the optical surface of the optical device. In some embodiments, the silicone containing hot melt composition is a reactive or unreactive silicone-containing hot melt. In some embodiments, the composition is a resin-linear silicone-containing hot melt composition and the composition comprises a phase separated resin-rich phase and a phase separated linear-rich phase.

Abstract: Curable compositions of resin-linear organosiloxane block copolymers that exhibit stress relaxation behavior are disclosed.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer by reacting a silanol terminated linear organosiloxane and an organosiloxane resin containing hydrolyzable groups to form a resin-linear organosiloxane block copolymer. The resulting resin-linear organosiloxane block copolymer is then crosslinked to sufficiently increase the average molecular weight of the resin-ituted organosiloxane block copolymer by at least 50%. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable”.

Abstract: The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

Abstract: Curable compositions of “resin-linear” organosiloxane block copolymers comprising a metal ligand complex are disclosed. The addition of a metal ligand complex to compositions of certain resin-linear organosiloxane block copolymers results in curable compositions having faster cure rates, and improved mechanical strength and/or thermal stability over similar compositions without the metal ligand complex.

Abstract: A method of forming an optical article includes the step of applying a silicone composition to a surface, wherein the silicone composition is a solid and has a glass transition temperature greater than room temperature. The silicone composition is heated to a temperature at or above the glass transition temperature such that the silicone composition flows. The silicone composition forms a light transmitting sheet upon cooling following the heating.

Abstract: Resin-linear organosiloxane block copolymers combined with linear or resin organopolysiloxane components are disclosed. In some embodiments, the combination of resin-linear organosiloxane block copolymers with linear or resin organopolysiloxane components provides compositions having improved physical properties, such as improved toughness and flow behavior.

Abstract: An optical article includes a silicone-containing composition. The silicone composition includes a first region having a first refractive index and a second region having a second refractive index. The first refractive index is different than the second refractive index.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer by reacting a linear organosiloxane and an organosiloxane resin to form a resin-linear organosiloxane block copolymer. The resulting resin-linear organosiloxane block copolymer is then crosslinked to increase the average molecular weight of the resin-linear organosiloxane block copolymer. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide solid, optically clear compositions which may be considered as “reprocessable.

Abstract: Hot melt adhesive compositions are disclosed containing the reaction product of a resin linear organosiloxane block copolymer and an organosilane capping agent containing hydrolyzable groups.

Abstract: An organosiloxane block copolymer includes 65 to 90 mol % of diorganosiloxane units having the formula R12-SiO2/2 (I). These diorganosiloxane units are arranged in linear blocks which have an average of from 10 to 400 diorganosiloxane units per linear block. The organosiloxane block copolymer also includes 10 to 35 mol % of siloxane units that have the average formula R2x(OR3)ySiO(4-x-y)/2 (II). The siloxane units are arranged in nonlinear blocks having at least 2 siloxane units per nonlinear block wherein 0.5?x?1.5 and 0?y?1. In addition, each R1 is independently a C1 to C10 hydrocarbyl, each R2 is independently an aryl or C4 to C10 hydrocarbyl, at least 50 mol % of R2 are aryl, and each R3 is independently R1 or H. Moreover, the organosiloxane block copolymer has a light transmittance of at least 95%.

Abstract: Amphiphilic organosiloxane block copolymers and methods for making them are disclosed. The compositions incorporate an amphiphilic “linear” segment with a “resinous” segment. For example, a polyether (A) modified PDMS (B) with (AB)n architecture and polydiorganosiloxane with Si—H end-groups can be reacted with a phenyl silsesquioxane resin bearing vinyl functionality to form an amphiphilic resin-linear copolymer.

Abstract: Curable compositions of “resin-linear” organosiloxane block copolymers comprising a metal ligand complex are disclosed. The addition of a metal ligand complex to compositions of certain resin-linear organosiloxane block copolymers results in curable compositions having faster cure rates, and improved mechanical strength and/or thermal stability over similar compositions without the metal ligand complex.

Abstract: A process for preparing resin-linear organosiloxane block copolymers is disclosed. The process involves an initial hydrosilylation reaction to link a linear organosiloxane block with a resin organosiloxane portion to form the resin-linear block copolymer. The resulting resin-linear organosiloxane block copolymer is further crosslinked to provide copolymer compositions that are useful as coatings for various electronics and lighting components.

Abstract: Curable compositions of resin-linear organosiloxane block copolymers having improved shelf stability are disclosed. A stabilizer compound is added to the resin-linear organosiloxane block copolymer which increases the temperatures needed to effect final cure of the compositions. In other embodiments, the present disclosure provides curable compositions of resin linear organosiloxane block copolymers having improved physical properties, such as improved toughness.

Abstract: Optical assemblies comprising an optical device and a composition comprising a resin-linear organosiloxane block copolymer are disclosed. In some embodiments, the organosiloxane block copolymers has a weight average molecular weight of at least 20,000 g/mole and includes 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] arranged in linear blocks each having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, 10 to 60 mole percent trisiloxy units of the formula [R2—SiO3/2] arranged in non-linear blocks each having a weight average molecular weight of at least 500 g/mol, and 0.5 to 25 mole percent silanol groups. R1 is independently a C1 to C30 hydrocarbyl and R2 is independently a C1 to C20 hydrocarbyl. At least 30% of the non-linear blocks are crosslinked with another non-linear block and aggregated in nano-domains. Each linear block is linked to at least one non-linear block.