Abstract: Solid compositions of organosiloxane block copolymers are disclosed having a refractive index greater than 1.5. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12SiC2/2] 9 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiC2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiC2/2] per linear block, the trisiloxy units [R12SiC3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: Solid compositions of organosiloxane block copolymers are disclosed having a tensile strength greater than 1.0 MPa and a % elongation at break greater than 40%. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiO2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, the trisiloxy units [R2SiO3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer by reacting in a first step an endcapped linear organosiloxane and an organosiloxane resin to form a resin-linear organosiloxane block copolymer. The resulting resin-linear organosiloxane block copolymer is then crosslinked in a second step to sufficiently increase the average molecular weight of the resin-linear organosiloxane block copolymer by at least 50%. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable”.

Abstract: Curable compositions of “resin-linear” organosiloxane block copolymers comprising a superbase catalyst are disclosed.

Abstract: A silicone composition comprises a curable silicone composition and nanoparticles. The nanoparticles of the silicone composition are produced via a plasma process. A cured product formed from the silicone composition is also disclosed. The cured product includes the nanoparticles dispersed therein.

Abstract: The present disclosure provides aqueous silicone emulsions of a “resin-linear” organosiloxane block copolymers. The present disclosure further provides a process for making these emulsions by forming a mixture of an organosiloxane block copolymer, admixing a sufficient amount of water to the mixture from to form an emulsion, and optionally further shear mixing the emulsion. The present invention further relates to the cured and/or coating compositions prepared from the present emulsions.

Abstract: A curable resin formulation based on the modification of cyanate esters with silsesquioxane resins is provided for use in forming a cured composite structure or layer. More specifically, a resin formulation that generally comprises a silsesquioxane resin component having an equivalent weight of aromatic hydroxyl groups that is greater than 500 and less than 2,000 grams per mole of aromatic hydroxyl groups; a cyanate ester component; and optionally a catalyst is described. In this resin formulation, the silsesquioxane resin component is present in an amount greater than 10 wt. % of the total solids content of the resin formulation. The resin composite layer formed therefrom exhibits a glass transition temperature that is greater than or equal to 185° C., wherein this glass transition temperature decreases by less than or equal to 40% upon exposure to water at an elevated temperature for a predetermined amount of time.

Abstract: This invention relates to thermoplastic elastomers comprising at least one silicone ionomer. These thermoplastic elastomers may be reprocessed and/or recycled.

Abstract: This invention relates to a coating composition comprising (A) 100 weight parts of at least one epoxy resin; (B) 40 to 900 weight parts of at least one alkoxy-containing aminofunctional silicone resin; (C) up to 50 weight parts of at least one organic hardener; (D) up to 100 weight parts of at least one epoxyfunctional silicone resin; and (E) up to 10 weight parts of at least one cure accelerator, provided the alkoxy-containing aminofunctional silicone resin (B) has a total alkoxy content ranging from 26 to 80 mol percent per mole of silicon (Si) in the alkoxy-containing aminofunctional silicone resin. Methods for preparing the above-described composition and for treating substrates are also disclosed.

Abstract: The present disclosure provides aqueous silicone emulsions of a “resin-linear” organosiloxane block copolymers. The present disclosure further provides a process for making these emulsions by forming a mixture of an organosiloxane block copolymer, admixing a sufficient amount of water to the mixture from to form an emulsion, and optionally further shear mixing the emulsion. The present invention further relates to the cured and/or coating compositions prepared from the present emulsions.

Abstract: This invention relates to the use of a thermoplastic elastomer comprising at least one silicone ionomer in the formation of electronic devices.

Abstract: Organosiloxane block copolymers, curable compositions, and solid compositions derived from these block copolymers are disclosed. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12—SiO2/2] 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiO2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, the trisiloxy units [R2SiO3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: A method for controlling morphology of a silicone organic block copolymer includes adding an MQ resin to the silicone organic block copolymer and annealing. The method is useful for forming thin films, which are useful in electronic device fabrication. The method is also useful for forming adhesives, release coatings, and reversible elastomers.

Abstract: An organosiloxane block copolymer includes 65 to 90 mol % of diorganosiloxane units having the formula R12SiO2/2 (I). These diorganosiloxane units are arranged in linear blocks which have an average of from 10 to 400 diorganosiloxane units per linear block. The organosiloxane block copolymer also includes 10 to 35 mol % of siloxane units that have the average formula R2x(OR3)ySiO(4-x-y)/2 (II). The siloxane units are arranged in nonlinear blocks having at least 2 siloxane units per nonlinear block wherein 0.5?x?1.5 and 0?y?1. In addition, each R1 is independently a C1 to C10 hydrocarbyl, each R2 is independently an aryl or C4 to C10 hydrocarbyl, at least 50 mol % of R2 are aryl, and each R3 is independently R1 or H. Moreover, the organosiloxane block copolymer has a light transmittance of at least 95%.

Abstract: Solid compositions of organosiloxane block copolymers are disclosed having a refractive index greater than 1.5. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12SiC2/2] 9 10 to 60 mole percent trisiloxy units of the formula [R2 SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiC2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiC2/2] per linear block, the trisiloxy units [R12SiC3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: A process is disclosed for preparing a resin-linear organosiloxane block copolymer by reacting in a first step an endcapped linear organosiloxane and an organosiloxane resin to form a resin-linear organosiloxane block copolymer. The resulting resin-linear organosiloxane block copolymer is then crosslinked in a second step to sufficiently increase the average molecular weight of the resin-linear organosiloxane block copolymer by at least 50%. The resin-linear organosiloxanes block copolymers prepared by the disclosed process may provide optically solid compositions which may be considered as “reprocessable”.

Abstract: Solid compositions of organosiloxane block copolymers are disclosed having a tensile strength greater than 1.0 MPa and a % elongation at break greater than 40%. The organosiloxane block copolymers comprise: 40 to 90 mole percent disiloxy units of the formula [R12SiO2/2] 10 to 60 mole percent trisiloxy units of the formula [R2SiO3/2] 0.5 to 35 mole percent silanol groups [?SiOH] where R1 is independently a C1 to C30 hydrocarbyl, R2 is independently a C1 to C20 hydrocarbyl, wherein; the disiloxy units [R12SiO2/2] are arranged in linear blocks having an average of from 10 to 400 disiloxy units [R12SiO2/2] per linear block, the trisiloxy units [R2SiO3/2] are arranged in non-linear blocks having a molecular weight of at least 500 g/mol, and at least 30% of the non-linear blocks are crosslinked with each other, each linear block is linked to at least one non-linear block, and the organosiloxane block copolymer has a molecular weight (Mw) of at least 20,000 g/mole.

Abstract: This invention relates to thermoplastic elastomers comprising at least one silicone ionomer. These thermoplastic elastomers may be reprocessed and/or recycled.

Abstract: The present invention relates to a curable rubber composition comprising an organic elastomer, a filler and at least one curing agent for the elastomer. Such curable rubber compositions are widely used in the production of cured rubber articles, such as tires, belts and hoses. The composition contains a branched silicone resin having Si-bonded hydroxyl groups or azo groups. This may lead to a reduction in the mixing energy required for processing, particularly in the energy required in the first (non-productive) mixing phase to give good dispersion of the filler in the organic elastomer. Use of the branched silicone resin can also accelerate cure (vulcanization), thus reducing the required cure time or reducing the amount of cure accelerator required.

Abstract: This invention relates to a coating composition comprising (A) 100 weight parts of at least one epoxy resin; (B) 40 to 900 weight parts of at least one alkoxy-containing aminofunctional silicone resin; (C) up to 50 weight parts of at least one organic hardener; (D) up to 100 weight parts of at least one epoxyfunctional silicone resin; and (E) up to 10 weight parts of at least one cure accelerator, provided the alkoxy-containing aminofunctional silicone resin (B) has a total alkoxy content ranging from 26 to 80 mol percent per mole of silicon (Si) in the alkoxy-containing aminofunctional silicone resin. Methods for preparing the above-described composition and for treating substrates are also disclosed.