Abstract: A drop is applied to an active area of an image sensor. A window is pressed into the drop to form a window support. The window support is then cured, or otherwise set-up, to form an image sensor package. During use, radiation is directed at the image sensor package. This radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. The window and the window support are transparent to the radiation.

Abstract: An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. A step up ring is mounted above a noncritical region of the upper surface of the image sensor between the active area and the bond pads. Electrically conductive traces on the step up ring are electrically connected to the bond pads by bond wires. An inner package body is formed between the step up ring and the window support and mechanically locks the window in place. An outer package body is formed to enclose the bond wires, the bond pads, and outer sides of the step up ring. The outer package body has outer sides coplanar with sides of the image sensor such that the image sensor assembly is chip size.

Abstract: To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the window support layer such that the windows are above active areas of the image sensors. The shallow cuts in combination with the window support layer define cavities above bond pads of the image sensors. The window sheet is cut from an exterior surface directly opposite of the cavities above the bond pads to singulating the windows from one another. The wafer is then singulated to form a plurality of image sensor packages.

Abstract: An image sensor package includes an image sensor having an upper surface with an active area and bond pads formed thereon. A noncritical region of the upper surface is between the active area and the bond pads. A window overlies the active area and is supported on the noncritical region by a window support. The window, window support and image sensor define a sealed cavity and the active area is located within the cavity. In particular, the active area is located within the cavity, which is sealed to protect the active area against external moisture, dust and contamination.

Abstract: A ball grid array (BAG) package includes a substrate having a central aperture. Traces are coupled to a lower surface of the substrate. First ends of the traces support an electronic component in the central aperture. Interconnection balls are formed on second ends of the traces. The interconnection balls extend from the second ends of the traces, through the substrate, and protrude above a second surface of the substrate.

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract: An image sensor package includes a molding having an interior locking feature and an exterior locking feature. The molding is a low cost molded part. The image sensor package further includes a window having an interior surface and an exterior surface. The exterior locking feature of the molding contacts a periphery of the exterior surface of the window and the interior locking feature of the molding contacts a periphery of the interior surface of the window. In this manner, the window is supported by the molding both top and bottom. Also, the distance which moisture must travel along the interface between the molding and window to reach the image sensor is maximized thus essentially eliminating moisture ingress into the image sensor package.

Abstract: A micromirror device package includes a micromirror device chip having a micromirror device area on an upper surface of the micromirror device chip. A window is mounted above the micromirror device area and to the upper surface of the micromirror device chip by a bead. By forming the window of borosilicate glass and the bead of solder glass, the micromirror device area is hermetically sealed. In this manner, corrosion and contamination of the micromirror device area is prevented.

Abstract: Disclosed herein are semiconductor packages and stacks thereof. An example package includes an insulative substrate having a first surface, first apertures, a second aperture, and circuit traces on the first surface. A first portion of each circuit trace overlies a first aperture and an end of the circuit trace is near the second aperture. A solder ball is in each first aperture, fused to the overlying circuit trace. A semiconductor die is in the second aperture and is electrically connected to the ends of the traces. A third aperture may extend through the first portion of each circuit trace. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.

Abstract: A first system is provided having a plurality of analog input signals for a plurality of analog input devices. Each analog input signal has an analog input signal value. The first system converts each analog input signal value to an ultimate digital input value. The first system has an input converter for converting each analog input signal to a digital input signal having a digital input value. The digital input value directly corresponds to the analog input signal value. The first system also has a conveying means for conveying the analog input signal value as an ultimate digital input value without performing any additional conversion. A second system is also provided having a plurality of analog output signals for a plurality of analog output devices. Each analog output signal has an analog output signal value, and each analog output signal value is converted from an initial digital output signal value.

Abstract: A method and a device for high-speed scale conversion wherein a value N within a range of N1 and N2 is converted into a small value M within a range of M1 and M2. The method includes the step of obtaining an approximate value of M by loading the value (N−N1+2p−1) into a multi-bit shift register and right-shifting p bits. A binary search process is then used to determine the error value between the actual value of M and the approximate value of M. By avoiding actual multiplication processes, the conversion can be carried out using low-cost electronic hardware such as a microprocessor or a PROM to carry out the binary search process, a shift-register to obtain the approximate value of M, a multiplexer to receive an analog input data N and an A/D converter to convert the analog input data N into a digital data N.

Abstract: A structure includes a substrate such as a wafer or an array of packages. The substrate has a front-side surface and a back-side surface. A reference feature such as a scribe grid is on the front-side surface. In at least one alignment mark is on the back-side surface, the alignment mark having a precise positional relationship to the reference feature on the front-side surface. The reference mark is used to cut the substrate from the back-side surface.

Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool that closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a custom substrate having holes. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard flip chip techniques. The resulting array of pressure sensor sub-assemblies is then molded, so that a cavity is formed that is open at the bottom of each hole in the custom substrate. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of the hole in the substrate. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the hole. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Abstract: Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.

Abstract: A miniature radio-frequency identification (RFID) transceiver and a method for making the same are provided. The RFID transceiver is small in size and physically rugged. The RFID transceiver includes an integrated circuit and a radio-frequency antenna that is fixed to the integrated circuit and electrically connected to the integrated circuit. The integrated circuit includes an RFID transceiver circuit. The antenna may be a single thin-film layer over the top surface of the integrated circuit or multiple layers that form a larger antenna in a compact, folded structure. Multiple antenna layers may also be used to form a three-dimensional structure for improved antenna operation or may be used to form separate, independent antennas.

Abstract: A structure comprises a substrate with electronic components formed on a first surface of the substrate. The structure includes a scribe line on a first surface of the substrate. The structure includes a trench formed by a laser on the second or back-side surface of the substrate, thus protecting the front-side surface of the substrate and, more particularly, the electronic component such as an integrated circuit and/or functional unit on the front-side surface of the substrate during singulation. Since, according to the invention, no saw blade is used, the width of the scribe line does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe line is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.

Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool which closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Abstract: An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.