Abstract: FileNameFileName-33-Integrated circuit packages including interconnection posts with multiple metal terminals are disclosed. An exemplary package includes a molded plastic body with integral plastic posts extending from the body. Each post is coated with a plurality of electrically separate metal terminals. The metal terminals extend from a surface of the body, along a sidewall of a respective post, to an end of the post. An integrated circuit is mounted on the body. Conductive paths, which may include vias through the body, electrically couple different bond pads of the integrated circuit to the metal terminals of the posts. In some embodiments, posts on opposing sides of the plastic body enable stacking, and electrical coupling, of two or more packages. The metal terminals of posts of the lower package may be engaged with the metal terminals of corresponding posts on a mounting substrate.

Abstract: A thin integrated circuit package having an optically transparent window provides a small profile optical integrated circuit assembly for use in digital cameras, video cellular telephones and other devices requiring a small physical size and optical integrated circuit technology. A tape having a conductive metal layer on a surface is used to interface the optical integrated circuit die with electrical interconnects disposed on a surface of the tape opposite the die. A supporting structure surrounds the die and a glass cover is either bonded to the top of the supporting structure over the die, or the glass cover is bonded to the top of the die and the gap between the glass cover and supporting structure filled with encapsulant. The resulting assembly yields a very thin optical integrated circuit package.

Abstract: A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, such as a leadframe or a laminate sheet, and input/output terminals. A chip is on a first side of the base and is electrically connected (directly or indirectly) to the input/output terminals. A cap, which may be a molded encapsulant, is provided on the first side of the base over the chip. The package is mounted on the substrate so that the cap is in the aperture, and a peripheral portion of the first side of the base is over the mounting surface so as to support the package in the aperture and allow the input/output terminals of the package to be juxtaposed with to the circuit patterns of the mounting surface. Because the cap is within the aperture, a height of the package above the mounting surface is minimized.

Abstract: A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully supported and structurally fortified by the molded image sensor die package. An image sensor die is then attached to the thus supported lead frame or LGA using a standard flip-chip connection.

Abstract: A central aperture is formed in a substrate. Traces are formed on a lower surface of the substrate, the traces having tabs protecting beyond a sidewall of the central aperture. An image sensor is supported in the central aperture by the tabs. By mounting the image sensor in the central aperture, the resulting image sensor package is relatively thin.

Abstract: A method of capturing an image at an angle to a line of sight an image sensor includes receiving radiation of the image. The received radiation is reflected towards an active area of the image sensor with a first panel of a reflector. The radiation strikes the active area and the image sensor captures the image.

Abstract: The present invention is directed to facilitating communication within an automation system having a plurality of networks and network protocols. Specifically, a Modbus network is operably connected to a network. A fieldbus coupler operably connected to both networks having a program facilitates communication within the automation system wherein devices connected to the network can be accessed for monitoring and/or controlling via Modbus commands. The fieldbus coupler (FBC) program accepts a Modbus function code containing one or more embedded message of varying types. The FBC program using additional information contained in the Modbus function code and the message type reads or writes only the required information to and from the field devices. This specific read or write request of the information and the embedding of more than one message type reduces overhead and bandwidth usage, thus improving bus response time and efficiency.

Abstract: An optical module includes a lens housing and a substrate having a base and a sidewall. An image sensor is mounted to the base. The sidewall includes a joint surface and the lens housing includes a mounting surface. The mounting surface of the lens housing is bonded to the joint surface of the substrate thus mounting the lens housing to the sidewall. To minimize the overall width of the optical module and to maximize the strength of the bond between the lens housing and the substrate, the mounting surface of the lens housing is formed with a locking feature. The locking feature includes a horizontal surface bonded to the joint surface and a vertical surface bonded to an interior surface of the sidewall.

Abstract: An image sensor package includes a substrate and an image sensor coupled to the substrate. The image sensor includes an upper surface having an active area. A reflector lid is coupled to the substrate. The reflector lid has a first panel having a planar surface. The planar surface is at least partially reflective and is angled relative to the upper surface of the image sensor to reflect electromagnetic radiation to the active area of image sensor.

Abstract: A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optical connector for the fiber includes a base having a receiving section and a waveguide formed therein. The receiving section is a flared channel having opposing orthogonal tapered sidewalls and a horizontal bottom surface perpendicular to the sidewalls. The waveguide is optically accessible at a narrow inner end of the channel. The angle of taper of the sidewalls of the channel matches the angle of taper of the sidewalls of the optical fiber. When the optical fiber is inserted into the open end of the channel and is moved toward the narrow inner end of the channel, the sidewalls of the fiber and channel come into contact with each other. In addition, a bottom surface of the fiber rests on the horizontal bottom surface of the channel.

Abstract: A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated copper and are therefore harder and less malleable and subject to deformation than prior art solder balls. The connection contacts are formed to align with, and contact, attachment pads formed on the motherboard or other system component. A tension device is then used to mechanically attach the packaged electronic device of the invention to the motherboard.

Abstract: A structure includes holes formed in a layer of tape. The holes are aligned over active areas on chips formed in a wafer. A custom vacuum chuck with a plurality of suction ports is aligned on the tape such that the suction ports contact only the tape and not the hole portions. Flats of the custom vacuum chuck are formed so that a perimeter of the flats contacts, and rests on, the tape. In addition, the flats of the custom vacuum chuck are formed so that the flats cover the entire active area on the first surface of each of the chips. Consequently, the combination of the custom vacuum chuck and the single layer of tape form a protective cavity over the active areas of the chips during singulation from the wafer.

Abstract: To form a micromachine package, a bead is applied to the rear surface of a controller chip. The controller chip is positioned above an active area in a front surface of a micromachine chip. The bead is attached to the front surface of the micromachine chip to attach the controller chip to the micromachine chip. Once the controller chip is attached to the micromachine chip, the bead and controller chip form an enclosure around the micromachine area. This enclosure protects the micromachine area from the ambient environment. Bond pads on a front surface of the controller chip are then wirebonded to leads of a leadframe or substrate.

Abstract: To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the upper surface of the image sensor. Bumps are formed between the interior traces and the bond pads thus flip chip mounting the step up ring to the image sensor. The step up ring is mounted such that the window is located in or adjacent a central aperture of the step up ring. An underfill material is applied into the central aperture. The underfill material flows from the central aperture between the lower surface of the step up ring and the upper surface of the image sensor. The underfill material encloses the bumps. The underfill material is cured, if necessary, to form a package body.

Abstract: A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically connected through the substrate to input/output terminals of the substrate. The substrate has a metal film on the top surface thereof around the opening of the respective the cavities. A metal lid panel, covering the cavity openings, is soldered to the metal film by reflowing a layer of solder disposed over a lid panel bottom surface, thereby sealing the die in each cavity. Subsequently, individual packages are singulated from the ceramic substrate.

Abstract: A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

Abstract: A window is mounted directly to an upper surface of a micromirror device chip. More particularly, the window is mounted above a micromirror device area on the upper surface of the micromirror device chip by a bead. The window in combination with the bead form a hermetic enclosure about the micromirror device area thus protecting the micromirror device area from moisture and contamination.

Abstract: To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface of a step up ring is mounted above the noncritical region of the upper surface of the image sensor. An upper surface of the step up ring includes a plurality of electrically conductive traces. Bond wires are formed between the bond pads of the image sensor and the electrically conductive traces on the upper surface of the step up ring. The step up ring is mounted so that the window is located in or adjacent a central aperture of the step up ring.

Abstract: A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective layer includes a polymerizable material, which includes the adhesive lower surface. The method further includes rendering the adhesive lower surface to be nonadhesive. The adhesive lower surface is rendered nonadhesive by polymerizing the polymerizable material of the protective layer with ultraviolet radiation.

Abstract: An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied. In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.