Patents by Inventor Steven Webster

Steven Webster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Digital camera module package fabrication method
    Patent number: 7342215
    Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: March 11, 2008
    Assignee: Altus Technology Inc.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu
  • Camera module fabrication method including the step of removing a lens mount and window from the mold
    Patent number: 7332712
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: February 19, 2008
    Assignee: Amkor Technology, Inc.
    Inventor: Steven Webster
  • Camera module fabrication method
    Publication number: 20070152147
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Application
    Filed: February 14, 2007
    Publication date: July 5, 2007
    Inventor: Steven Webster
  • Testing system for digital camera modules
    Publication number: 20070146486
    Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.
    Type: Application
    Filed: November 3, 2006
    Publication date: June 28, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Yuan-Po Wang
  • Sortable Collection Browser
    Publication number: 20070136286
    Abstract: Disclosed is a method of browsing a collection of sortable items (201) stored in a digital system. A plurality of grouping hierarchies (207, 217) are provided, each comprising a sort order and zero or more grouping levels (204-206, 214-216) forming groups with which the items are associable. At least one grouping hierarchy comprises a sort order and at least one grouping level. One item (203) in the collection is set to be a focus item (208, 218) thereby establishing a current focus group (209, 219) of a current grouping hierarchy. The focus item is then maintained upon selection of a new grouping hierarchy (210-220) from one of the plurality. A displaying of the collection of items may be performed by arranging the items in a list sorted according to one sort order of a plurality of sort orders associable with the items.
    Type: Application
    Filed: November 2, 2006
    Publication date: June 14, 2007
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Steven Webster, Jonathan Duhig, Laurence Crew
  • Image sensor chip packaging method
    Publication number: 20070126916
    Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.
    Type: Application
    Filed: November 10, 2006
    Publication date: June 7, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu
  • Digital camera module packaging method
    Publication number: 20070126915
    Abstract: An image sensor chip package method includes the following steps: firstly, a plurality of shaped conductors are provided. Secondly, plastics are injected to partially enclose the conductors, thereby forming a base. Some of the conductors are exposed outside of the base. Thirdly, a ring-like middle portion is further formed on the base by means of injection. The base and the middle portion cooperatively form a space. Fourthly, an image sensor having a plurality of pads is disposed in the space. Fifthly, a number of bonding wires are provided to connect the pads and the conductors. Finally, a cover is secured to the top of the middle portion via an adhesive glue, thereby hermetically sealing the space and allowing light beams to pass therethrough.
    Type: Application
    Filed: November 10, 2006
    Publication date: June 7, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu
  • Digital Camera Module
    Publication number: 20070126081
    Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.
    Type: Application
    Filed: September 22, 2006
    Publication date: June 7, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu
  • Image sensor chip package
    Publication number: 20070108561
    Abstract: An image sensor chip package (200) includes a carrier (20), an image sensor chip (30), a number of wires (50) and a holder (60). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a plurality of conductive leads (233) spaced from each other. Each lead has a first terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301) and a number of contacts (302). The wires electrically connect the contacts of the chip and the first terminal portions of the leadframe. The holder is mounted to the carrier to close the cavity, and allows light to pass therethrough to reach the active area of the chip.
    Type: Application
    Filed: September 22, 2006
    Publication date: May 17, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu
  • Camera module fabrication method including singulating a substrate
    Patent number: 7199359
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: April 3, 2007
    Assignee: Amkor Technology, Inc.
    Inventor: Steven Webster
  • Digital camera module package fabrication method
    Publication number: 20070057148
    Abstract: A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.
    Type: Application
    Filed: June 14, 2006
    Publication date: March 15, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu
  • Image sensor chip package fabrication method
    Publication number: 20070057149
    Abstract: An image sensor package method includes the steps of first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.
    Type: Application
    Filed: June 14, 2006
    Publication date: March 15, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Kun-Hsieh Liu
  • Digital camera module
    Publication number: 20070057150
    Abstract: A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.
    Type: Application
    Filed: June 28, 2006
    Publication date: March 15, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventor: Steven Webster
  • Image sensor chip package
    Publication number: 20070034772
    Abstract: A digital camera module includes a barrel (10), a seat (20) and an image sensor chip package (30) in accordance with a preferred embodiment is shown. The image sensor chip package includes a carrier (32), a chip (34), a number of bonding wires (36) and a cover (38). The carrier includes a base (24). The chip is mounted on the base and has an active area. The second conductive means electronically connects the chip and the conductive means. An adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover adheres to the carrier with the adhesive means and defines a sealing space (37) for sealing the active area of the chip therein. The active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.
    Type: Application
    Filed: June 7, 2006
    Publication date: February 15, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu
  • Image sensor chip package
    Publication number: 20070023608
    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.
    Type: Application
    Filed: June 7, 2006
    Publication date: February 1, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu
  • CAMERA MODULE FABRICATION METHOD
    Publication number: 20070012864
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Application
    Filed: September 21, 2006
    Publication date: January 18, 2007
    Inventor: Steven Webster
  • Digital camera module with improved image quality
    Publication number: 20070008631
    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.
    Type: Application
    Filed: June 9, 2006
    Publication date: January 11, 2007
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Ching-Lung Jao
  • Digital camera module with small sized image sensor chip package
    Publication number: 20060290802
    Abstract: A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.
    Type: Application
    Filed: April 12, 2006
    Publication date: December 28, 2006
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Po-Chih Hsu, Kun-Hsieh Liu
  • Image sensor chip package and method of manufacturing the same
    Publication number: 20060273249
    Abstract: An image sensor chip package (200) includes a base (20), an image sensor chip (23), a plurality of wires (24), an adhesive means (26) and a cover (28). The base has a top surface (201) and a plurality of top pads (204) arranged on the top surface. The image sensor chip is mounted on the top surface of the base and includes a photosensitive area (231) and a plurality of chip pads (232) around the photosensitive area. The wires electrically connect the chip pads of image sensor chip and the top pads of the base. The adhesive means is applied on peripheral edge of the image sensor chip, over the wires and covers areas where the wires connecting with the chip pads. The cover is transparent and is mounted to the image sensor chip via the adhesive means. The cover seals the photosensitive area of the image sensor chip.
    Type: Application
    Filed: April 4, 2006
    Publication date: December 7, 2006
    Applicant: ALTUS TECHNOLOGY INC.
    Inventors: Steven Webster, Ying-Cheng Wu, Po-Chih Hsu, Kun-Hsieh Liu
  • Camera module having a threaded lens barrel and a ball grid array connecting device
    Patent number: 7126111
    Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: October 24, 2006
    Assignee: Amkor Technology, Inc.
    Inventor: Steven Webster