Patents by Inventor Sunao Masuda
Sunao Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190304691Abstract: An electronic device assembly includes a first electronic device, a second electronic device, and a connection member. The first electronic device includes a first metal terminal configured to hold a first chip component. The second electronic device includes a second metal terminal configured to hold a second chip component. The connection member connects the first electronic device and the second electronic device.Type: ApplicationFiled: March 29, 2019Publication date: October 3, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20190304690Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body and sandwiches the chip component. A width, a protrusion length, or a protrusion area of one of the pair of holding pieces is different from that of the other holding piece.Type: ApplicationFiled: March 28, 2019Publication date: October 3, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20190304692Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body. One of the pair of holding pieces is formed at one end of the terminal body. An adjustment portion is formed in a boundary region between the holding piece and the end of the terminal body.Type: ApplicationFiled: March 12, 2019Publication date: October 3, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Patent number: 10381157Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.Type: GrantFiled: March 22, 2018Date of Patent: August 13, 2019Assignee: TDK CORPORATIONInventors: Norihisa Ando, Katsumi Kobayashi, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Patent number: 10381158Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.Type: GrantFiled: November 21, 2017Date of Patent: August 13, 2019Assignee: TDK CORPORATIONInventors: Norihisa Ando, Sunao Masuda, Masahiro Mori, Kayou Matsunaga, Kosuke Yazawa
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Publication number: 20190206626Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes an element body containing laminated internal electrodes and a terminal electrode formed outside the element body to connect with ends of the internal electrodes. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes an electrode facing portion, a holding portion, and a mount portion. A connection member connecting between the electrode facing portion and the end surface of the terminal electrode exists in a joint region in a predetermined range. A non-joint region is formed between an edge of the joint region and the holding portion. A non-joint gap between the electrode facing portion and the end surface of the terminal electrode becomes larger toward the holding portion in the non-joint region.Type: ApplicationFiled: November 21, 2018Publication date: July 4, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20190164694Abstract: A ceramic electronic device includes a chip component, a metal terminal, and a conductive connection member. The component includes a terminal electrode surface on which a terminal electrode is formed. The metal terminal includes an opposing surface to the electrode surface. The connection member contains at least Sn and Sb and connects the terminal electrode surface and the opposing surface. The connection member includes a first part and a second part. In the first part, a distance between the terminal electrode surface and the opposing surface is a first distance, and Sb/Sn is a first value. In the second part, a distance between the terminal electrode surface and the opposing surface is a second distance being smaller than the first distance, and Sb/Sn is a second value being larger than the first value.Type: ApplicationFiled: October 17, 2018Publication date: May 30, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20190157010Abstract: A metal terminal is connectable to terminal electrodes of chip components arranged side by side. The metal terminal includes units corresponding to each chip. Each unit includes an electrode facing portion, a pair of upper and lower holding portions, a mount portion, and protrusions. The electrode facing portion faces the electrode of the chip. The pair of upper and lower holding portions holds the chip. The mount portion is located below the lower holding portion of the electrode facing portion. The protrusions protrude from the electrode facing portion toward the electrode. The protrusions in each unit are arranged substantially line-symmetrically to a virtual center line passing through a middle point between the upper and lower holding portions.Type: ApplicationFiled: October 19, 2018Publication date: May 23, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Patent number: 10276305Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.Type: GrantFiled: December 26, 2017Date of Patent: April 30, 2019Assignee: TDK CORPORATIONInventors: Kosuke Yazawa, Norihisa Ando, Masahiro Mori, Sunao Masuda, Kayou Matsunaga
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Patent number: 10242805Abstract: An electronic device includes a plurality of chip components and an external terminal. The chip components are provided with a terminal electrode formed on an end surface of a ceramic element body. The external terminal is electrically connected with the terminal electrodes to support the plurality of chip components adjacently in a first direction. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable with a mounting surface. The terminal electrode connection part is provided with a plurality of convex portions protruding toward the terminal electrode. At least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components.Type: GrantFiled: March 28, 2017Date of Patent: March 26, 2019Assignee: TDK CORPORATIONInventors: Sunao Masuda, Katsumi Kobayashi
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Publication number: 20190080842Abstract: An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.Type: ApplicationFiled: September 5, 2018Publication date: March 14, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20190080841Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.Type: ApplicationFiled: September 5, 2018Publication date: March 14, 2019Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Kenichi INOUE, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Patent number: 10102971Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.Type: GrantFiled: October 5, 2016Date of Patent: October 16, 2018Assignee: TDK CORPORATIONInventors: Norihisa Ando, Masahiro Mori, Sunao Masuda, Kayou Kusano
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Publication number: 20180294100Abstract: An electronic device includes a chip component and an external terminal. The chip component includes a terminal electrode formed on an end surface of a ceramic element body containing an internal electrode. The external terminal includes a first end electrically connected with the terminal electrode and a second end disposed opposite to the first end and connected with a mounting surface. The external terminal includes a first metal and a second metal different from the first metal. The first metal and the second metal are alternately exposed on a surface of the external terminal.Type: ApplicationFiled: March 28, 2018Publication date: October 11, 2018Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Patent number: 10096426Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.Type: GrantFiled: December 27, 2016Date of Patent: October 9, 2018Assignee: TDK CORPORATIONInventors: Sunao Masuda, Katsumi Kobayashi, Masahiro Mori, Kayou Matsunaga, Norihisa Ando
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Publication number: 20180286584Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.Type: ApplicationFiled: March 22, 2018Publication date: October 4, 2018Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Katsumi KOBAYASHI, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20180211784Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.Type: ApplicationFiled: November 21, 2017Publication date: July 26, 2018Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Katsumi KOBAYASHI, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20180211783Abstract: A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, a pair of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The pair of engagement arm portions sandwich and hold the chip component. The mount portion extends from one of terminal second sides toward the chip component and is partially substantially vertical to the electrode face portion. The electrode face portion has a slit.Type: ApplicationFiled: November 21, 2017Publication date: July 26, 2018Applicant: TDK CORPORATIONInventors: Norihisa ANDO, Katsumi KOBAYASHI, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20180197681Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.Type: ApplicationFiled: November 21, 2017Publication date: July 12, 2018Applicant: TDK CorporationInventors: Norihisa ANDO, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
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Publication number: 20180182553Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.Type: ApplicationFiled: December 26, 2017Publication date: June 28, 2018Applicant: TDK CORPORATIONInventors: Kosuke YAZAWA, Norihisa ANDO, Masahiro MORI, Sunao MASUDA, Kayou MATSUNAGA