Abstract: An electronic device including: a first chip component, having approximately rectangular parallelepiped shape; a second chip component, having approximately rectangular parallelepiped shape; and an external terminal electrically connected to a first terminal electrode and a second terminal electrode. The external terminal includes an electrode connecting component, connected to the first terminal electrode and the second terminal electrode. The electrode connecting component includes: a first component, connected to the coupling component and faces the first terminal electrode; and a second component, extends upward from the first component and faces the first terminal electrode and the second terminal electrode. Length of the second component in a width direction is shorter than a length of the first component in a width direction. Length W2 of the second component in a width direction is shorter than lengths W3, W4 of the first chip component and the second chip component in a width direction.

Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.

Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.

Abstract: An electronic device includes a plurality of chip components and an external terminal. The chip components are provided with a terminal electrode formed on an end surface of a ceramic element body. The external terminal is electrically connected with the terminal electrodes to support the plurality of chip components adjacently in a first direction. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable with a mounting surface. The terminal electrode connection part is provided with a plurality of convex portions protruding toward the terminal electrode. At least one of the plurality of convex portions is respectively connected with each terminal electrode of the plurality of chip components.

Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.

Abstract: A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

Abstract: A first substrate includes a substrate main body including a first principal surface and a second principal surface opposing each other in a first direction, first and second connection electrodes disposed on the first principal surface, and third and fourth connection electrodes disposed on the second principal surface. A first metal terminal includes a first connection portion electrically connected with the first connection electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion electrically connected with the fourth connection electrode, and a second leg portion extending from the second connection portion. A multilayer capacitor is disposed on the first principal surface side of the first substrate, and an overcurrent protection device is disposed on the second principal surface side of the first substrate. The second connection electrode and the third connection electrode are electrically connected to each other.

Abstract: An external terminal 30 comprises a terminal electrode connection part 32 connected to the terminal electrode 22 to face to the end surface of the element body 26; a mounting connection part 34 connectable to a mounting surface 62; and a joint part 36 which joins the terminal electrode connection part 32 with the mounting connection part 34 to separate one side surface 26a of the element body 26 closest to the mounting surface 64 therefrom. A width W1 of the joint part 36 along a direction parallel to the mounting surface 62 is smaller than a width W0 of the terminal electrode connection part 32.

Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.

Abstract: A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a first principal surface and a third side surface oppose each other. An electrode portion of a first external electrode and an electrode portion of a fourth external electrode are connected to each other.

Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.

Abstract: An external terminal 30 comprises a terminal electrode connection part 32 connected to the terminal electrode 22 to face to the end surface of the element body 26; a mounting connection part 34 connectable to a mounting surface 62; and a joint part 36 which joins the terminal electrode connection part 32 with the mounting connection part 34 to separate one side surface 26a of the element body 26 closest to the mounting surface 64 therefrom. A width W1 of the joint part 36 along a direction parallel to the mounting surface 62 is smaller then a width W0 of the terminal electrode connection part 32.

Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.

Abstract: The present invention is ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with said terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.

Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.

Abstract: A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face

Abstract: A printing apparatus includes a transfer mechanism that transfers a print medium, a printing device that prints on the print medium, a stationary blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device to cut the print medium, a movable blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device and that cut the print medium, and a step portion that is provided on a reverse face of the downstream blade which is located on downstream side in transferring of the print medium, the reverse face being reverse of a slide face of the downstream blade sliding on the upstream blade which is located on upstream side in transferring of the print medium, and that projects along a thickness direction of the downstream blade.

Abstract: A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved.

Abstract: A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved.

Abstract: A printing apparatus includes a transfer mechanism that transfers a print medium, a printing device that prints on the print medium, a stationary blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device to cut the print medium, a movable blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device and that cut the print medium, and a step portion that is provided on a reverse face of the downstream blade which is located on downstream side in transferring of the print medium, the reverse face being reverse of a slide face of the downstream blade sliding on the upstream blade which is located on upstream side in transferring of the print medium, and that projects along a thickness direction of the downstream blade.