Patents by Inventor Sung-gi Kim

Sung-gi Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11447603
    Abstract: The present invention relates to a polyester resin. The polyester resin contains a particular content of diol moieties, derived from isosorbide and diethylene glycol, and thus can provide a resin molded product exhibiting high transparency in spite of a large wall thickness thereof.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: September 20, 2022
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Yoo Jin Lee, Sung-Gi Kim, Boo-Youn Lee
  • Publication number: 20220275010
    Abstract: Provided is a novel silylcyclodisilazane compound, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing the silicon-containing thin film using the same, and since the silylcyclodisilazane compound of the present invention has high reactivity, thermal stability and high volatility, it can be used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film by various deposition methods.
    Type: Application
    Filed: August 13, 2020
    Publication date: September 1, 2022
    Inventors: Se Jin JANG, Sung Gi KIM, Jeong Joo PARK, Tae Seok BYUN, Yong Hee KWONE, Yeong Hun KIM, Haengdon LIM, Sang Yong JEON, Sang Ick LEE
  • Patent number: 11396579
    Abstract: The present invention relates to a polyester film and a preparation method thereof. The polyester film is formed of a polyester resin having a specific content of isosorbide and diethylene glycol introduced therein, containing a low content of oligomer, and exhibiting a specific intrinsic viscosity, thereby exhibiting excellent mechanical properties, heat resistance and chemical resistance, and good heat sealability.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: July 26, 2022
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Yoo Jin Lee, Sung-Gi Kim, Boo-youn Lee
  • Patent number: 11393676
    Abstract: Provided are a composition for depositing a silicon-containing thin film containing a bis(aminosilyl)alkylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing the bis(aminosilyl)alkylamine compound capable of being usefully used as a precursor of the silicon-containing thin film, and a method for manufacturing a silicon-containing thin film using the same.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: July 19, 2022
    Assignee: DNF CO., LTD.
    Inventors: Sung Gi Kim, Jeong Joo Park, Joong Jin Park, Se Jin Jang, Byeong-Il Yang, Sang-Do Lee, Sam Dong Lee, Sang Ick Lee, Myong Woon Kim
  • Patent number: 11390714
    Abstract: The present invention relates to a polyarylene sulfide which has more improved compatibility with other polymer materials or fillers, and a method for preparing the same. The polyarylene sulfide is characterized in that at least part of end groups of the main chain of the polyarylene sulfide is hydroxyl group (—OH), the polyarylene sulfide contains iodine bonded to its main chain and free iodine, and the content of iodine bonded to the main chain and free iodine is 10 to 10,000 ppmw.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: July 19, 2022
    Assignee: HDC POLYALL CO., LTD.
    Inventors: Se-Ho Lee, Sung-Gi Kim
  • Patent number: 11390635
    Abstract: Provided are a composition for depositing a silicon-containing thin film, containing a trisilylamine compound and a method for producing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing a trisilylamine compound which is capable of forming a silicon-containing thin film at a very high deposition rate at a low temperature to be usable as a precursor of a silicon-containing thin film and an encapsulant of a display, and a method for producing a silicon-containing thin film by using the same.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: July 19, 2022
    Assignee: DNF CO., LTD.
    Inventors: Sung Gi Kim, Joong Jin Park, Byeong-il Yang, Se Jin Jang, Gun-Joo Park, Jeong Joo Park, Hee Yeon Jeong, Sam Dong Lee, Sang Ick Lee, Myong Woon Kim
  • Patent number: 11370915
    Abstract: The present invention relates to a polyarylene sulfide resin composition having good processability and showing excellent properties due to its more improved miscibility with other polymer materials or fillers, and a formed article. Such polyarylene sulfide resin composition includes a polyarylene sulfide including a disulfide repeating unit in the repeating units of the main chain; and at least one component selected from the group consisting of a thermoplastic resin, a thermoplastic elastomer, and a filler.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: June 28, 2022
    Assignee: HDC POLYALL Co., Ltd.
    Inventors: Se-Ho Lee, Sung-Gi Kim
  • Patent number: 11358974
    Abstract: Provided are a silylamine compound, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing a silicon-containing thin film using the composition, and more particularly, to a silylamine compound capable of being usefully used as a precursor of a silicon-containing thin film, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing a silicon-containing thin film using the composition.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: June 14, 2022
    Assignee: DNF CO., LTD.
    Inventors: Sung Gi Kim, Jeong Joo Park, Joong Jin Park, Se Jin Jang, Byeong-il Yang, Sang-Do Lee, Sam Dong Lee, Sang Ick Lee, Myong Woon Kim
  • Publication number: 20220181578
    Abstract: The present invention relates to a silicon oxide encapsulation film comprising a metal or a metal oxide, and a manufacturing method therefor. The silicon metal oxide encapsulation film according to the present invention has a high thin film growth rate and low moisture and oxygen permeabilities, thereby exhibiting a very excellent sealing effect even at a low thickness, and the stress strength and refractive index thereof can be controlled, thereby enabling a high-quality silicon metal oxide encapsulation film that is applicable to a flexible display to be readily manufactured.
    Type: Application
    Filed: March 6, 2020
    Publication date: June 9, 2022
    Inventors: Myoung Woon KIM, Sang Ick LEE, Se Jin JANG, Sung Gi KIM, Jeong Joo PARK, Won Mook CHAE, A Ra CHO, Byeong il YANG, Joong Jin PARK, Gun Joo PARK, Sam Dong LEE, Haeng don LIM, Sang Yong JEON
  • Publication number: 20220139704
    Abstract: Provided are a composition for depositing a silicon-containing thin film containing a bis(aminosilyl)alkylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing the bis(aminosilyl)alkylamine compound capable of being usefully used as a precursor of the silicon-containing thin film, and a method for manufacturing a silicon-containing thin film using the same.
    Type: Application
    Filed: January 10, 2022
    Publication date: May 5, 2022
    Inventors: Sung Gi KIM, Jeong Joo PARK, Joong Jin PARK, Se Jin JANG, Byeong-il YANG, Sang-Do LEE, Sam Dong LEE, Sang Ick LEE, Myong Woon KIM
  • Patent number: 11319333
    Abstract: Provided are a novel disilylamine compound, a method for preparing same, and a composition for depositing a silicon-containing thin film including the same. A disilylamine compound of the present invention has excellent reactivity, is thermally stable, and has high volatility, and thus, is used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: May 3, 2022
    Assignee: DNF CO., LTD
    Inventors: Sung Gi Kim, Se Jin Jang, Byeong-il Yang, Joong Jin Park, Sang-Do Lee, Jeong Joo Park, Sam Dong Lee, Gun-Joo Park, Sang Ick Lee, Myong Woon Kim
  • Publication number: 20220127417
    Abstract: The polyester copolymer according to the present disclosure can be extrusion-molded, and thus, can be usefully applied for the preparation of various containers.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 28, 2022
    Inventors: Jin-Kyung LEE, Sung-Gi KIM, Joo Young KIM
  • Patent number: 11267934
    Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: March 8, 2022
    Inventors: Seol-Hee Lim, Ji Yea Lee, Sung-Gi Kim, Sun Dongbang
  • Patent number: 11236210
    Abstract: A composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g, and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis)cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: February 1, 2022
    Inventors: Seol-Hee Lim, Sung-Gi Kim
  • Patent number: 11203676
    Abstract: There is provided a heat shrinkable film comprising a polyester based copolymer capable of having an excellent shrinkage rate and being heat shrunk at a low temperature. The heat shrinkable film according to an exemplary embodiment of the present invention includes a polyester based copolymer, wherein the polyester based copolymer includes: a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: December 21, 2021
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim, Ji Yea Lee
  • Publication number: 20210380770
    Abstract: The present invention relates to a drawn polyester film and a method for preparing the same. The drawn polyester film according to the present invention is formed of a polyester resin having a specific content of isosorbide and diethylene glycol introduced therein and exhibiting a specific intrinsic viscosity, and thus exhibits excellent mechanical properties, heat resistance, chemical resistance and good heat sealability.
    Type: Application
    Filed: May 9, 2019
    Publication date: December 9, 2021
    Inventors: Da-Young HWANG, Sung-Gi KIM, Yoo Jin LEE
  • Publication number: 20210163734
    Abstract: The polyester copolymer according to the present invention is excellent in chemical resistance and transparency and thus can be usefully applied to the production of various containers.
    Type: Application
    Filed: May 9, 2019
    Publication date: June 3, 2021
    Inventors: Yoo Jin LEE, Sung-Gi KIM, Da-Young HWANG
  • Patent number: 11020947
    Abstract: This disclosure relates to a thermo-shrinkable polyester film with excellent UV absorbance and heat resistance. According to one embodiment of the invention, provided is a thermo-shrinkable polyester film comprising a first resin layer comprising polyester resin comprising residues of dicarboxylic acid components comprising aromatic dicarboxylic acid, and residues of diol components comprising 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexanecarboxylate, and 4,4-(oxybis(methylene)bis)cyclohexane methanol; and a second resin layer comprising the polyester resin and a UV absorber, formed on at least one side of the first layer.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: June 1, 2021
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim
  • Publication number: 20210147451
    Abstract: Provided are a novel disilylamine compound, a method for preparing same, and a composition for depositing a silicon-containing thin film including the same. A disilylamine compound of the present invention has excellent reactivity, is thermally stable, and has high volatility, and thus, is used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film.
    Type: Application
    Filed: April 19, 2018
    Publication date: May 20, 2021
    Inventors: Sung Gi KIM, Se Jin JANG, Byeong-il YANG, Joong Jin PARK, Sang-Do LEE, Jeong Joo PARK, Sam Dong LEE, Gun-Joo PARK, Sang Ick LEE, Myong Woon KIM
  • Publication number: 20210079166
    Abstract: The present invention relates to a polyarylene sulfide having more improved miscibility with other polymer materials or fillers, and a method of preparing the same. At least part of end groups of the main chain of the polyarylene sulfide is carboxyl group (—COON) or amine group (—NH2).
    Type: Application
    Filed: November 20, 2020
    Publication date: March 18, 2021
    Inventors: Se-Ho LEE, Sung-Gi KIM