Abstract: The present invention relates to a polyester resin. The polyester resin is useful for bottles, sheets, multilayer sheets, stretched films and fiber applications due to excellent heat resistance and transparency, and in particular, the polyester resin has little deterioration of physical properties such as yellowing, etc.

Abstract: Provided are a novel disilylamine compound, a method for preparing same, and a composition for depositing a silicon-containing thin film including the same. A disilylamine compound of the present invention has excellent reactivity, is thermally stable, and has high volatility, and thus, is used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film.

Abstract: The present invention relates to a polyarylene sulfide which has more improved compatibility with other polymer materials or fillers, and a method for preparing the same. The polyarylene sulfide is characterized in that at least part of end groups of the main chain of the polyarylene sulfide is hydroxyl group (—OH), the polyarylene sulfide contains iodine bonded to its main chain and free iodine, and the content of iodine bonded to the main chain and free iodine is 10 to 10,000 ppmw.

Abstract: The present invention relates to a polyarylene sulfide having more improved miscibility with other polymer materials or fillers, and a method of preparing the same. At least part of end groups of the main chain of the polyarylene sulfide is carboxyl group (—COOH) or amine group (—NH2).

Abstract: Provided are a silylamine compound, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing a silicon-containing thin film using the composition, and more particularly, to a silylamine compound capable of being usefully used as a precursor of a silicon-containing thin film, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing a silicon-containing thin film using the composition.

Abstract: Provided are a composition for depositing a silicon-containing thin film containing a trisilylamine compound and a method for producing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film containing a trisilylamine compound which is capable of forming a silicon-containing thin film at a very high deposition rate at a low temperature to be usable as a precursor of a silicon-containing thin film and an encapsulant of a display, and a method for producing a silicon-containing thin film by using the same.

Abstract: The present invention relates to a polyarylene sulfide which has more improved compatibility with other polymer materials or fillers, and a method for preparing the same. The polyarylene sulfide is characterized in that at least part of end groups of the main chain of the polyarylene sulfide is hydroxyl group (—OH), the polyarylene sulfide contains iodine bonded to its main chain and free iodine, and the content of iodine bonded to the main chain and free iodine is 10 to 10,000 ppmw.

Abstract: There are provided a polyester based copolymer resin capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature, and a molded product comprising the same. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a predetermined residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate and a predetermined residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol.

Abstract: There is provided a heat shrinkable film comprising a polyester based copolymer capable of having an excellent shrinkage rate and being heat shrunk at a low temperature. The heat shrinkable film according to an exemplary embodiment of the present invention includes a polyester based copolymer, wherein the polyester based copolymer includes: a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.

Abstract: There is provided a composition for forming a heat shrinkable film capable of providing a heat shrinkable film capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature. The composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g, and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.

Abstract: There is provided a composition for forming a heat shrinkable film capable of providing a heat shrinkable film capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature. The composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g, and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.

Abstract: A polyester based copolymer resin which can be used a heat shrinkable film is disclosed. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid, and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol. The heat shrinkable film including polyester based copolymer resin has a shrinkage initiation temperature of 60° C. or less, the maximum heat shrinkage rate at 60° C. of 4% or more, and the maximum heat shrinkage rate at 90° C. of 80% or more.

Abstract: A heat shrinkable film comprising a polyester based copolymer is provided.

Abstract: The present invention relates to a polyester fiber, a preparation method thereof and a molded article prepared therefrom. The polyester fiber comprises a diol moiety derived from isosorbide in a specific amount and is formed into a polyester resin having a specific oligomer content, thereby providing a molded article having excellent saline water resistance, chemical resistance, light resistance and good knot strength, and capable of maintaining high transparency.

Abstract: The present invention relates to a polyester container. The polyester container is formed from a polyester resin containing a particular content of diol moieties derived from isosorbide and diethylene glycol, and thus can show high transparency in spite of a great wall thickness thereof.

Abstract: The present invention relates to a polyester film and a preparation method thereof. The polyester film is formed of a polyester resin having a specific content of isosorbide and diethylene glycol introduced therein, containing a low content of oligomer, and exhibiting a specific intrinsic viscosity, thereby exhibiting excellent mechanical properties, heat resistance and chemical resistance, and good heat sealability.

Abstract: Provided are a novel disilylamine compound, a method for preparing same, and a composition for depositing a silicon-containing thin film including the same. A disilylamine compound of the present invention has excellent reactivity, is thermally stable, and has high volatility, and thus, is used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film.

Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.

Abstract: Provided are a composition for depositing a silicon-containing thin film containing a bis(aminosilyl)alkylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing the bis(aminosilyl)alkylamine compound capable of being usefully used as a precursor of the silicon-containing thin film, and a method for manufacturing a silicon-containing thin film using the same.

Abstract: Provided are a composition containing a silylamine compund and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing a silylamine compound capable of forming a silicon-containing thin film having a significantly excellent water vapor transmission rate to thereby be usefully used as a precursor of the silicon-containing thin film and an encapsulant of a display, and a method for manufacturing a silicon-containing thin film using the same.