Patents by Inventor Sung-gi Kim

Sung-gi Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200087450
    Abstract: The present invention relates to a polyester resin. The polyester resin contains a particular content of diol moieties, derived from isosorbide and diethylene glycol, and thus can provide a resin molded product exhibiting high transparency in spite of a large wall thickness thereof.
    Type: Application
    Filed: May 29, 2018
    Publication date: March 19, 2020
    Inventors: Yoo Jin LEE, Sung-Gi KIM, Boo-Youn LEE
  • Publication number: 20200062954
    Abstract: The present invention relates to an MDO heat-shrinkable film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides a copolymer polyester MDO (machine direction orientation) thermoresistant heat-shrinkable film that consists of a copolymer polyester resin including isosorbide and 1,4-cyclohexanedimethanol at an optimized content ratio as a diol component copolymerized with an acid component including terephthalic acid, and having a number average molecular weight of 18,000 g/mol or more, and can be used for labels, cap seals, direct packaging, etc. of various containers due to the high shrink initiation temperature.
    Type: Application
    Filed: November 24, 2017
    Publication date: February 27, 2020
    Inventors: Seol-Hee LIM, Sung-Gi KIM, So-Yeon KIM
  • Publication number: 20200056040
    Abstract: The present invention relates to a polyarylene sulfide resin composition having good processability and showing excellent properties due to its more improved miscibility with other polymer materials or fillers, and a formed article. Such polyarylene sulfide resin composition includes a polyarylene sulfide including a disulfide repeating unit in the repeating units of the main chain; and at least one component selected from the group consisting of a thermoplastic resin, a thermoplastic elastomer, and a filler.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Inventors: Se-Ho LEE, Sung-Gi KIM
  • Patent number: 10550223
    Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: February 4, 2020
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Ji Yea Lee, Sung-Gi Kim, Sun Dongbang
  • Patent number: 10494526
    Abstract: The present invention relates to a polyarylene sulfide resin composition having good processability and showing excellent properties due to its more improved miscibility with other polymer materials or fillers, and a formed article. Such polyarylene sulfide resin composition includes a polyarylene sulfide including a disulfide repeating unit in the repeating units of the main chain; and at least one component selected from the group consisting of a thermoplastic resin, a thermoplastic elastomer, and a filler.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: December 3, 2019
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Se-Ho Lee, Sung-Gi Kim
  • Publication number: 20190329538
    Abstract: The present invention relates to an MDO thermoresistant heat-shrinkable multilayer film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides an MDO thermoresistant heat-shrinkable multilayer film that includes multiple skin layers capable of improving thermal resistance formed on a substrate layer capable of providing high shrinkage, and simultaneously has excellent thermal resistance and high shrinkage properties through MD orientation instead of the conventional TD orientation method.
    Type: Application
    Filed: November 24, 2017
    Publication date: October 31, 2019
    Inventors: Seol-Hee LIM, Sung-Gi KIM, So-Yeon KIM
  • Publication number: 20190249296
    Abstract: The present invention relates to a method for manufacturing a high-purity silicon nitride thin film using plasma atomic layer deposition. More specifically, the present invention can realize improved thin film efficiency and a step coverage by performing a two-stage plasma excitation step and can provide a high-purity silicon nitride thin film with an improved deposition rate despite a low film-forming temperature.
    Type: Application
    Filed: July 19, 2017
    Publication date: August 15, 2019
    Inventors: Se Jin JANG, Sang-Do LEE, Joong Jin PARK, Sung Gi KIM, Byeong-il YANG, Gun-Joo PARK, Jeong Joo PARK, Jang Hyeon SEOK, Sang Ick LEE, Myong Woon KIM
  • Publication number: 20190062505
    Abstract: The present invention relates to a polyarylene sulfide having more improved miscibility with other polymer materials or fillers, and a method of preparing the same. At least part of end groups of the main chain of the polyarylene sulfide is carboxyl group (—COOH) or amine group (—NH2).
    Type: Application
    Filed: October 30, 2018
    Publication date: February 28, 2019
    Inventors: Se-Ho LEE, Sung-Gi KIM
  • Publication number: 20190055349
    Abstract: The present invention relates to a polyester resin. The polyester resin is useful for bottles, sheets, multilayer sheets, stretched films and fiber applications due to excellent heat resistance and transparency, and in particular, the polyester resin has little deterioration of physical properties such as yellowing, etc.
    Type: Application
    Filed: March 29, 2017
    Publication date: February 21, 2019
    Inventors: Yoo Jin LEE, Su-Min LEE, Sung-Gi KIM, Min-Young HAN, Dong-jin HAN
  • Patent number: 10202407
    Abstract: Provided are a novel trisilyl amine derivative, a method for preparing the same, and a silicon-containing thin film using the same, wherein the trisilyl amine derivative, which is a compound having thermal stability, high volatility, and high reactivity and being present in a liquid state at room temperature and under pressure where handling is possible, may form a high purity silicon-containing thin film having excellent physical and electrical properties by various deposition methods.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: February 12, 2019
    Assignee: DNF CO.,LTD.
    Inventors: Se Jin Jang, Sang-Do Lee, Jong Hyun Kim, Sung Gi Kim, Do Yeon Kim, Byeong-il Yang, Jang Hyeon Seok, Sang Ick Lee, Myong Woon Kim
  • Publication number: 20180346721
    Abstract: The present invention relates to a polyarylene sulfide resin composition which has excellent processability and exhibit excellent physical properties due to its more improved compatibility with other polymer materials or fillers, and a molded article including the same. Such polyarylene sulfide resin composition comprises: a polyarylene sulfide including a disulfide repeating unit in the repeating units of the main chain, wherein at least part of end groups of the main chain is hydroxyl group (—OH); and one or more components selected from the group consisting of a thermoplastic resin, a thermoplastic elastomer and a filler.
    Type: Application
    Filed: November 22, 2016
    Publication date: December 6, 2018
    Applicant: SK CHEMICALS CO., LTD.
    Inventors: Se-Ho LEE, Sung-Gi KIM
  • Publication number: 20180334542
    Abstract: The present invention relates to a polyarylene sulfide which has more improved compatibility with other polymer materials or fillers, and a method for preparing the same. The polyarylene sulfide is characterized in that at least part of end groups of the main chain of the polyarylene sulfide is hydroxyl group (—OH), the polyarylene sulfide contains iodine bonded to its main chain and free iodine, and the content of iodine bonded to the main chain and free iodine is 10 to 10,000 ppmw.
    Type: Application
    Filed: November 22, 2016
    Publication date: November 22, 2018
    Inventors: Se-Ho LEE, Sung-Gi KIM
  • Patent number: 10098252
    Abstract: A display apparatus which enables a display to rotate with a tilting angle across a large range is provided. This allows a user to, conveniently use the display apparatus in order to enable quality of use to be improved during a tilting operation, and slim and elegant appearance to be implemented. The display apparatus includes a display configured to display an image on the front surface, a stand supporting the display, and a hinge device connecting the display to the stand such that the display may be tilted, wherein the hinge device includes a guide member formed on a rear surface of the display, a latch fixed to the stand and to slide along the guide member when the display is tilted, and a fixing member fixing the display not to move when an external force applied to the display is removed.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: October 9, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Jung, Bo Ram Park, Se Ki Jang, Yong Sub Jung, Woo Young Kan, Sung Gi Kim, Hyun Jun Jung, You Slk Hong
  • Publication number: 20180230591
    Abstract: The present invention relates to a method for manufacturing a silicon nitride thin film using a plasma atomic layer deposition method and, more particularly, the purpose of the present invention is to provide a method for manufacturing a silicon nitride thin film including a high quality Si—N bond under the condition of lower power and film-forming temperature, by applying an aminosilane derivative having a specific Si—N bond to a plasma atomic layer deposition method.
    Type: Application
    Filed: July 14, 2016
    Publication date: August 16, 2018
    Inventors: Se Jin JANG, Sang-Do LEE, Sung Woo CHO, Sung Gi KIM, Byeong-il YANG, Jang Hyeon SEOK, Sang Ick LEE, Myong Woon KIM
  • Publication number: 20180223060
    Abstract: There is provided a composition for forming a heat shrinkable film capable of providing a heat shrinkable film capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature. The composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g, and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.
    Type: Application
    Filed: March 13, 2018
    Publication date: August 9, 2018
    Inventors: Seol-Hee LIM, Sung-Gi KIM
  • Patent number: 9916974
    Abstract: Provided are a novel amino-silyl amine compound and a manufacturing method of a dielectric film containing Si—N bond using the same. Since the amino-silyl amine compound according to the present invention, which is a thermally stable and highly volatile compound, may be treated at room temperature and used as a liquid state compound at room temperature and pressure, the present invention provides a manufacturing method of a high purity dielectric film containing a Si—N bond even at a low temperature and plasma condition by using atomic layer deposition (PEALD).
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: March 13, 2018
    Assignee: DNF CO., LTD.
    Inventors: Se Jin Jang, Sang-Do Lee, Jong Hyun Kim, Sung Gi Kim, Sang Yong Jeon, Byeong-il Yang, Jang Hyeon Seok, Sang Ick Lee, Myong Woon Kim
  • Patent number: 9809608
    Abstract: Provided are a novel cyclodisilazane derivative, a method for preparing the same, and a silicon-containing thin film using the same, wherein the cyclodisilazane derivative having thermal stability, high volatility, and high reactivity and being present in a liquid state at room temperature and under a pressure where handling is easy, may form a high purity silicon-containing thin film having excellent physical and electrical properties by various deposition methods.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: November 7, 2017
    Assignee: DNF CO., LTD.
    Inventors: Se Jin Jang, Byeong-il Yang, Sung Gi Kim, Jong Hyun Kim, Do Yeon Kim, Sang-Do Lee, Jang Hyeon Seok, Sang Ick Lee, Myong Woon Kim
  • Publication number: 20170303425
    Abstract: A display apparatus which enables a display to rotate with a tilting angle across a large range is provided. This allows a user to, conveniently use the display apparatus in order to enable quality of use to be improved during a tilting operation, and slim and elegant appearance to be implemented. The display apparatus includes a display configured to display an image on the front surface, a stand supporting the display, and a hinge device connecting the display to the stand such that the display may be tilted, wherein the hinge device includes a guide member formed on a rear surface of the display, a latch fixed to the stand and to slide along the guide member when the display is tilted, and a fixing member fixing the display not to move when an external force applied to the display is removed.
    Type: Application
    Filed: June 29, 2017
    Publication date: October 19, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin JUNG, Bo Ram PARK, Se Ki JANG, Yong Sub JUNG, Woo Young KAN, Sung Gi KIM, Hyun Jun JUNG, You Slk HONG
  • Publication number: 20170275419
    Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.
    Type: Application
    Filed: August 24, 2015
    Publication date: September 28, 2017
    Inventors: Seol-Hee LIM, Ji Yea LEE, Sung-Gi KIM, Sun DONGBANG
  • Patent number: 9759325
    Abstract: There is provided a cylinder device having optimal arrangement of fine textures and optimal surface roughness capable of reducing wear of a cylinder bore side and a piston ring by processing fine textures in an optimal selection region of the cylinder bore side to improve lubrication characteristics between the piston ring and the cylinder bore side while reducing engine oil consumption by processing surface roughness of the cylinder bore side to an optimal status.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: September 12, 2017
    Assignee: Doosan Infracore Co., Ltd.
    Inventors: Seok Ju Oh, Sung Gi Kim, Kyu Bong Han