Patents by Inventor Sung Nam Cho
Sung Nam Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11121476Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: GrantFiled: December 23, 2019Date of Patent: September 14, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
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Patent number: 11069954Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).Type: GrantFiled: February 12, 2020Date of Patent: July 20, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo Kim, Jae Yeong Kim, Sung Yong An, Sung Nam Cho, Ji Hyung Jung
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Publication number: 20210143527Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: ApplicationFiled: January 19, 2021Publication date: May 13, 2021Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Nam CHO, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
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Publication number: 20210111478Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).Type: ApplicationFiled: February 12, 2020Publication date: April 15, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Jae Yeong KIM, Sung Yong AN, Sung Nam CHO, Ji Hyung JUNG
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Publication number: 20210066814Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.Type: ApplicationFiled: January 2, 2020Publication date: March 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Ji Hyung JUNG, Chin Mo KIM, Sung Nam CHO, Sung Yong AN
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Publication number: 20210066782Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: ApplicationFiled: January 15, 2020Publication date: March 4, 2021Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Nam CHO, Sung Yong AN, Jae Yeong KIM, Ju Hyoung PARK
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Patent number: 10938091Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.Type: GrantFiled: January 15, 2020Date of Patent: March 2, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Nam Cho, Sung Yong An, Jae Yeong Kim, Ju Hyoung Park
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Patent number: 10923822Abstract: A wireless communications antenna includes: a magnetic body including one or more slits formed therein; and a coil part having solenoid form and disposed around the magnetic body, wherein the one or more slits are configured such that the magnetic body is not disconnected and a magnetic path of the magnetic body is continuous.Type: GrantFiled: June 19, 2018Date of Patent: February 16, 2021Assignee: WITS Co., Ltd.Inventors: Tae Jun Choi, Jung Young Cho, Seung Hee Oh, Sung Nam Cho, Chang Hak Choi
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Publication number: 20210036407Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: ApplicationFiled: March 24, 2020Publication date: February 4, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo KIM, Sung Yong AN, Ji Hyung JUNG, Jae Yeong KIM, Ju Hyoung PARK, Sung Nam CHO
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Publication number: 20200335870Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: ApplicationFiled: February 27, 2020Publication date: October 22, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
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Publication number: 20200328530Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.Type: ApplicationFiled: January 10, 2020Publication date: October 15, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung PARK, Sung Yong AN, Myeong Woo HAN, Sung Nam CHO, Jae Yeong KIM
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Publication number: 20200313279Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: January 2, 2020Publication date: October 1, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Publication number: 20200259269Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: ApplicationFiled: December 23, 2019Publication date: August 13, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
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Publication number: 20200259267Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: ApplicationFiled: October 31, 2019Publication date: August 13, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung PARK, Kyu Bum HAN, Jae Yeong KIM, Jeong Ki RYOO, Sung Nam CHO, Sung Yong AN
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Patent number: 10692648Abstract: A magnetic field shielding structure includes a magnetic layer and a resonance reactive shielding circuit including a capacitor and a conductor connected to the capacitor and having a loop form. At least a portion of the magnetic layer overlaps an area surrounded by the conductor in a thickness direction of the magnetic layer.Type: GrantFiled: November 29, 2017Date of Patent: June 23, 2020Assignee: WITS Co., Ltd.Inventors: Seung Hee Oh, Doo Ho Park, Tae Jun Choi, Sung Nam Cho, Chang Hak Choi, Jung Young Cho
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Patent number: 10692638Abstract: A magnetic sheet includes one or more magnetic layers formed of a metal ribbon, the metal ribbon includes fragments with metal oxide coating layers formed in spaces between the fragments.Type: GrantFiled: September 29, 2017Date of Patent: June 23, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jung Young Cho, Tai Yon Cho, Sung Nam Cho, Chang Hak Choi, San Kyeong
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Patent number: 10553949Abstract: A wireless communication antenna includes: a magnetic body including a plurality of bar-shaped unit ribbons arranged in columns, wherein the unit ribbons have shape anisotropy and a radiation direction on a side of the wireless communication antenna; and a solenoid coil including conductive patterns disposed around the magnetic body.Type: GrantFiled: December 5, 2016Date of Patent: February 4, 2020Assignee: WITS Co., Ltd.Inventors: Sung Nam Cho, Jung Young Cho, Jae Hyuk Jang, Chang Hak Choi, Jeong Ki Ryoo, Soon Kwang Kwon
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Patent number: 10460136Abstract: A terminal for magnetic secure transmission (MST) includes a body including a magnetic head and a coil member wound around the magnetic head, and an electromagnetic wave shielding structure disposed around the magnetic head and being formed of a magnetic material.Type: GrantFiled: November 3, 2017Date of Patent: October 29, 2019Assignee: WITS Co., Ltd.Inventors: Seung Min Lee, Sung Nam Cho, Ji Hyo Lee
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Publication number: 20190305609Abstract: A magnetic sheet includes a magnetic layer, a heat radiation layer having a prominence and a depression formed in a surface and that faces the magnetic layer, and an adhesive layer disposed between the magnetic layer and the heat radiation layer, and including a heat radiation filler that has shape anisotropy.Type: ApplicationFiled: October 18, 2018Publication date: October 3, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Doo Ho PARK, Jung Young CHO, San KYEONG, Sung Nam CHO, Ji Hyo LEE, Byeong Cheol MOON
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Publication number: 20190173183Abstract: A wireless communications antenna includes: a magnetic body including one or more slits formed therein; and a coil part having solenoid form and disposed around the magnetic body, wherein the one or more slits are configured such that the magnetic body is not disconnected and a magnetic path of the magnetic body is continuous.Type: ApplicationFiled: June 19, 2018Publication date: June 6, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Jun CHOI, Jung Young CHO, Seung Hee OH, Sung Nam CHO, Chang Hak CHOI