Abstract: Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit board can be formed in an ecofriendly and economic manner. Further, high-reliability microcircuits can be realized by enhancing interface adhesive strength between a resin substrate and a metal layer in a buildup type printed circuit board.

Abstract: Disclosed herein is a printed circuit board and a method of manufacturing the same. The printed circuit board includes preparing a base substrate; forming a pattern layer for forming via holes on the base substrate by printing ink for forming via holes; forming an insulating layer on the base substrate including the pattern layer for forming via holes; and removing the pattern layer for forming via holes.

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing.

Abstract: There is provided a resist ink printing device according to an exemplary embodiment of the present invention including: a transfer unit transferring a substrate on which lead-in wires for electrolytic gold plating are patterned into a main body; a controller formed on the main body to measure a warpage degree of the substrate and recognizing a gerber file stored with circuit diagram information of the substrate to compensate for the warpage degree of the substrate and correct the gerber file; and at least one inkjet printing head part discharging liquid photo resist ink to the lead-in wires by the corrected gerber file.

Abstract: Disclosed herein is an inkjet printer head assembly. The inkjet printer head assembly according to exemplary embodiments of the present invention includes: a storage unit having an inner space in which a solution is stored; a fluid supplier supplying fluid to the storage unit; and an agitator provided in the storage unit and driven by the fluid supplied to the storage unit from the fluid supplier to agitate the solution.

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the substrate by using an inkjet printing method; curing the resists; and performing plating on the active regions of the substrate. The resists are masked on the dummy portions corresponding to the non-active regions of the substrate to prevent plating from being performed on the dummy portions, thereby reducing manufacturing costs.

Abstract: There is provided an inkjet head cleaning apparatus including: an air blowing unit spaced apart from a nozzle ejecting ink at a predetermined distance and blowing air toward the nozzle; a blocking surface disposed to face the air blowing unit and blocking ink being removed from the nozzle due to the air released by the air blowing unit; a rebound blocking unit disposed between the blocking surface and the nozzle and blocking ink droplets being rebounded farther than a predetermined distance from the blocking surface among the ink blocked by the blocking surface; and a storage unit receiving the removed ink.

Abstract: A nonaqueous ink composition for an ink jet and a method of manufacturing ink comprising the same are provided. The nonaqueous ink composition for the ink jet includes: a glycol ether acetate solvent represented by a specific chemical formula; and a polypropylene glycol binder represented by a specific chemical formula. The nonaqueous ink composition for an ink jet has dynamic viscoelasticity obtained by a chemical interaction between the solvent and the binder, exhibits excellent print quality and is capable of high-speed printing.

Abstract: An ink suction apparatus is disclosed. In accordance with an embodiment of the present invention, the ink suction apparatus, which sucks in residual ink of an inkjet head, includes: a suction nozzle, which sucks in the residual ink; a heater, which is adjacent to the suction nozzle and heats the suction nozzle to prevent the suction nozzle from being blocked by the residual ink; a nozzle cover, which is installed on the suction nozzle and opens and closes the suction nozzle to control sucking power of the suction nozzle; a collection chamber, which collects the residual ink having been sucked into the suction nozzle; and a suction pump, which generates sucking power and provides the sucking power to the suction nozzle. The ink suction apparatus can prevent a suction nozzle from being blocked when sucking in hyper-viscous residual ink and control the sucking power of the suction nozzle by controlling the suction nozzle's opening and closing.

Abstract: An inkjet printer and a printing method using the inkjet printer are disclosed. The inkjet printer in accordance with an embodiment of the present invention can include: a first inkjet head, which prints in one direction; and a second inkjet head, which prints in a different direction intersecting the one direction. In accordance with an embodiment of the present invention, the inkjet printer can print a pattern having a plurality of directions with a stable printing quality.

Abstract: Disclosed are methods of forming a printed circuit pattern and forming a guide, and a guide-forming ink. The method of forming a printed circuit pattern in accordance with the present invention includes forming a guide by using guide-forming ink having a slip property, curing the formed guide by in-situ UV, and forming a printed circuit pattern on the inside of the cured guide by using metal ink.

Abstract: A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern by inkjet printing on the insulation layer coated with the chemical compound. Certain embodiments of the invention can be utilized to improve adhesive strength between the insulation layer and the inkjet-printed circuit patterns, suppress spreading in the inkjet-printed circuit patterns to improve resolution, and reduce manufacturing costs by forming the circuits using inkjet printing.

Abstract: The present invention relates to a method for producing metal nanoparticles and metal nanoparticles produced thereby, in particular, to a method for producing metal nanoparticles used for inkjet that comprises, preparing metal nanoparticles capped with a fatty acid; heating a mixture of the capped metal nanoparticles and a linear or branched first amine of C1-C7 so that a part of the fatty acid is substituted to the first amine; and heating after adding a linear or branched second amine of C8-C20 to the mixture so that the first amine is re-substituted to the second amine. According to the present invention, metal nanoparticles capped with 2 kinds of dispersants can be produced massively, and its application to ink for inkjet technique can lower the curing temperature of ink.

Abstract: The present invention relates to a method for producing metal nanoparticles and metal nanoparticles produced thereby, in particular, to a method for producing metal nanoparticles used for inkjet that comprises, preparing metal nanoparticles capped with a fatty acid; heating a mixture of the capped metal nanoparticles and a linear or branched first amine of C1-C7 so that a part of the fatty acid is substituted to the first amine; and heating after adding a linear or branched second amine of C8-C20 to the mixture so that the first amine is re-substituted to the second amine. According to the present invention, metal nanoparticles capped with 2 kinds of dispersants can be produced massively, and its application to ink for inkjet technique can lower the curing temperature of ink.

Abstract: The present invention relate to a method for manufacturing a multi-layer printed circuit board using inkjet printing and a vacuum printing equipment, in particular, a method for manufacturing a multi-layer printed circuit board including; preparing a board; forming wiring using inkjet printing on the board; forming an insulation layer using a thermosetting polymer compound on the board; forming via holes by a laser irradiation on the insulation layer; and filling metal nanoparticle paste in the via holes by a vacuum printing method.

Abstract: The present invention relates to a metal ink composition for inkjet printing, more particularly to a metal ink composition which includes 20 to 85 weight % of metal nanoparticles and 15 to 80 weight % of organic solvent, where the organic solvent is made of an ethylene glycol-based ether or a mixed solvent including an ethylene glycol-based ether. The invention provides a metal ink composition in which an organic solvent suited for an inkjet head is used to improve the ejection, storage, and viscosity properties of the ink.

Abstract: The present invention provides a method of producing metal nanoparticles, having a high yield rate and uniform size achieved by employing a heterologous reducing agent that considerably reduces unreactant, and using ethylene glycol that allows effective separation of desired metal nanoparticles. In addition, the present invention provides metal nanoparticles having high dispersion stability achieved by capping with polyvinyl pyrrolidone(PVP) and conductive ink including these metal nanoparticles. One aspect of the invention may provide a method of producing nanoparticles comprising, (a) mixing ethylene glycol, capping molecules and a reducing agent, (b) mixing a metal precursor with alcohol-based compound and reacting it with the mixture of (a), and (c) finishing the reaction by adding acetone and ethylene glycol to the reaction solution (b).

Abstract: Disclosed are a metallic nanoparticle cluster ink and a method for forming a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster ink comprises colloidal metallic nanoparticles and a bifunctional compound. The conductive metal pattern is formed by forming a metallic nanoparticle pattern on a substrate using a mold made from PDMS (poly(dimethylsiloxane) polymer as a stamp, and heat-treating the substrate. Micrometer-sized conductive metal patterns can be easily formed on various substrates in a simple and inexpensive manner without the use of costly systems, thereby being very useful in various industrial fields.

Abstract: Disclosed are a metallic nanoparticle cluster ink and a method for forming a conductive metal pattern using the cluster ink. The metallic nanoparticle cluster ink comprises colloidal metallic nanoparticles and a bifunctional compound. The conductive metal pattern is formed by forming a metallic nanoparticle pattern on a substrate using a mold made from PDMS (poly(dimethylsiloxane) polymer as a stamp, and heat-treating the substrate. Micrometer-sized conductive metal patterns can be easily formed on various substrates in a simple and inexpensive manner without the use of costly systems, thereby being very useful in various industrial fields.