Abstract: Semiconductor device structures with reduced gate end width formed at gate structures and methods for manufacturing the same are provided.

Abstract: Semiconductor device structures with reduced gate end width formed at gate structures and methods for manufacturing the same are provided. In one example, a semiconductor device structure includes a plurality of gate structures formed over a plurality of fin structures, the gate structures formed substantially orthogonal to the fin structures, wherein the plurality of gate structures includes a first gate structure having a first gate end width and a second gate structure having a second gate end width, wherein the second gate end width is shorter than the first gate end width.

Abstract: Some embodiments of the present disclosure relates to a method of forming a semiconductor device having a strained channel and an associated device. In some embodiments, the method includes performing a first etching process by selectively exposing a substrate to a first etchant to produce a recess defined by sidewalls and a bottom surface of the substrate. An implantation process is performed to form an etch stop layer along the bottom surface. A second etching process is performed by exposing the sidewalls and the bottom surface defining the recess to a second etchant to form a source/drain recess. The source/drain recess laterally extends past the etch stop layer in opposing directions. A semiconductor material is formed within the source/drain recess.

Abstract: A semiconductor device includes: active regions arranged in a first grid oriented parallel to a first direction; and gate electrodes arranged spaced apart in a second grid and overlying corresponding ones of the active regions, the second grid being oriented parallel to a second direction, the second direction being orthogonal to the first direction. The first gaps are interspersed between neighboring ones of the active regions. For a flyover intersection at which a corresponding gate electrode crosses over a corresponding active region and for which the gate electrode is not functionally connected to the corresponding active region, the gate electrode does not extend substantially beyond the corresponding active region and so does not extend substantially into the corresponding gap.

Abstract: A semiconductor structure includes: first and second active regions arranged in a first grid oriented in a first direction; and gate electrodes arranged spaced apart in a second grid and on corresponding ones of the active regions, the second grid being oriented in a second direction, the second direction being substantially perpendicular to the first direction; wherein: the first and second active regions are separated, relative to the second direction, by a gap; each gate electrode includes a first segment and a gate extension; each gate extension extends, relative to the second direction, beyond the corresponding active region and into the gap by a height HEXT, where HEXT?(?150 nm); and each gate extension, relative to a plane defined by the first and second directions, is substantially rectangular. In an embodiment, the height HEXT is HEXT?(?100 nm).

Abstract: A length adjustable arm and MEMS position detection equipment rotation test apparatus includes an extendible section and first and second rotary bodies provided at one end of a rotation device for variation of a feeding position of a first feeding component so that feeding component is capable of conducting various feeding ways. Further, a worktable is provided thereon with at least one rotation section, which has a surface on which a plurality of operation stations is mounted. As such, through circular change made by the rotation section in respect of the locations of the operation stations, an effect of effectively and efficiently burning or testing can be achieved. Further, the operation stations are provided, on a periphery thereof, with a turning section, and the turning section is operable to turn each of the operation stations in order to effectively conduct tests for various MEMS inertial components.

Abstract: An electronic device and a method for generating or storing data are provided. A method of operating an electronic device includes outputting a first application execution screen in a first reproduction area in response to an application execution request, outputting a second reproduction area for generating a command related to recording data generation in at least a part of the first reproduction area, outputting a second application execution screen in the second reproduction area, and generating recording data in response to an input for the second reproduction area.

Abstract: A semiconductor device includes a metal oxide semiconductor device disposed over a substrate and an interconnect plug. The metal oxide semiconductor device includes a gate structure located on the substrate and a raised source/drain region disposed adjacent to the gate structure. The raised source/drain region includes a top surface above a surface of the substrate by a distance. The interconnect plug connects to the raised source/drain region. The interconnect plug includes a doped region contacting the top surface of the raised source/drain region, a metal silicide region located on the doped region, and a metal region located on the metal silicide region.

Abstract: A semiconductor device includes a substrate having a source feature and a drain feature therein configured to enhance charge mobility, a gate stack directly over a portion of the source feature and a portion of the drain feature, a first salicide layer over substantially the entire source feature exposed by the gate stack, and a second salicide layer over substantially the entire drain feature exposed by the gate stack. The first salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight. The second salicide layer has a germanium concentration greater than about 0% by weight and less than about 3% by weight.

Abstract: A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.

Abstract: The present disclosure relates to a transistor device having a channel region comprising a sandwich film stack with a plurality of different layers that improve device performance, and an associated apparatus. In some embodiments, the transistor device has a source region and a drain region disposed within a semiconductor substrate. A sandwich film stack is laterally positioned between the source region and the drain region. The sandwich film stack has a lower layer, a middle layer of a carbon doped semiconductor material disposed over the lower layer, and an upper layer disposed over the middle layer. A gate structure is disposed over the sandwich film stack. The gate structure is configured to control a flow of charge carriers in a channel region located between the source region and the drain region.

Abstract: A method of forming a semiconductor device includes forming a gate stack over a first portion of a source and a first portion of a drain. The method includes depositing a first cap layer comprising silicon over a second portion of the source and depositing a second cap layer comprising silicon over a second portion of the drain. The method includes depositing a metal layer over the gate stack, the first cap layer and the second cap layer. The method includes annealing the semiconductor device until all of the silicon in the first and second cap layers reacts with metal from the metal layer, wherein the annealing causes metal from the metal layer to react with silicon in the first cap layer, the second cap layer, the source, and the drain. Annealing the semiconductor device includes forming a salicide layer having a germanium concentration less than 3% by weight.

Abstract: Embodiments of the present disclosure related to a head mounted display (HMD) that enable adjustment of lenses for a particular consumer. In some example embodiments, the HMD enables up to three-degrees of freedom of lens alignment with a consumer's pupils. For example, the HMD includes an actuation device or rotatable disc, both of which are in slidable engagement with at least one elongated members. Ends of the elongated members are coupled to a mirror/lens such that actuation of the actuation device or rotation of the disc translates the elongated member along an axis, which is in general alignment with a pupillary distance (PD) of the consumer. Additionally, the elongated members include mirror/lens interfaces to which the lenses are coupled. The mirror/lens interfaces are slidably and rotatably coupled to the elongated members thereby providing additional degrees of freedom for movement of the lenses.

Abstract: A safety power socket device includes a housing having a depositing space, a power plug, a temperature sensor module, a power supply module, a transformer rectifier, a charging battery, an illumination module, and a power failure switch module. In addition of having power supply and power expansion, the safety power socket device may compare its temperature and an overhead threshold with its embedded temperature sensor module to prevent from high temperature lasting and damage resulting from electric fire by cutting off power supplying. Moreover, home safety protection is also improved by an embedded illumination module of the safety power socket device.

Abstract: A semiconductor device and a method of forming the same are disclosed. The semiconductor device includes a substrate, and a source region and a drain region formed in the substrate. The semiconductor device further includes an impurity diffusion stop layer formed in a recess of the substrate between the source region and the drain region, wherein the impurity diffusion stop layer covers bottom and sidewalls of the recess. The semiconductor device further includes a channel layer formed over the impurity diffusion stop layer and in the recess, and a gate stack formed over the channel layer.

Abstract: A system for attaching a device to a glasses frame includes a spring clip that applies pressure to two sides of the glasses frame, and a magnet for attaching the device thereto. The device may attach directly to the magnet, or via a slide-on attachment piece. The spring clip may include a spring arm having distal ends that assist the spring clip in applying pressure to the glasses frames.

Abstract: A device includes a dielectric layer, a passive device including a portion in the dielectric layer, and a plurality of voids in the dielectric layer and encircling the passive device.

Abstract: One or more techniques or systems for controlling a profile of a surface of a semiconductor region are provided herein. In some embodiments, an etching to deposition (E/D) ratio is set to be less than one to form the region within the semiconductor. For example, when the E/D ratio is less than one, an etching rate is less than a deposition rate of the E/D ratio, thus ‘growing’ the region. In some embodiments, the E/D ratio is subsequently set to be greater than one. For example, when the E/D ratio is greater than one, the etching rate is greater than the deposition rate of the E/D ratio, thus ‘etching’ the region. In this manner, a smooth surface profile is provided for the region, at least because setting the E/D ratio to be greater than one enables etch back of at least a portion of the grown region.

Abstract: A method includes forming a low-k dielectric layer over a substrate of a wafer, forming a first dielectric layer over the low-k dielectric layer, forming a second dielectric layer over the first dielectric layer, forming a stress tuning dielectric layer over the second dielectric layer, forming an opening in the stress tuning dielectric layer to expose a top surface of the second dielectric layer, and etching the stress tuning dielectric layer and the second dielectric layer to form a trench. The formation of the opening and the etching of the stress tuning dielectric layer are performed in separate etching steps. The method further includes etching the first dielectric layer to form a via opening connected to the trench, and filling the trench and the via opening to form a metal line and a via, respectively.

Abstract: Some embodiments of the present disclosure relates to a method of forming a semiconductor device having a strained channel and an associated device. In some embodiments, the method includes performing a first etching process by selectively exposing a substrate to a first etchant to produce a recess defined by sidewalls and a bottom surface of the substrate. An implantation process is performed to form an etch stop layer along the bottom surface. A second etching process is performed by exposing the sidewalls and the bottom surface defining the recess to a second etchant to form a source/drain recess. The source/drain recess laterally extends past the etch stop layer in opposing directions. A semiconductor material is formed within the source/drain recess.