Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Abstract: A fuel cell stack includes a plurality of membrane electrode assemblies (MEAs) and a stamped metal separator. The metal separator is positioned between the membrane electrode assemblies. The separator includes at least one channel on both surfaces of the separator formed by a stamping process. The separator comprises a plurality of holes, each of which form a manifold communicating with each the channels.

Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: Disclosed herein is an insulating layer conduction method, and more particularly, an insulating layer conduction method of conducting between the insulating layers through a bump. The method includes providing a hard insulating layer; configuring a land on the hard insulating layer; configuring a bump on the land; laminating a soft insulating layer on the hard insulating layer while being penetrated by the bump; curing the laminated soft insulating layer; and polishing, by a polishing machine, the cured soft insulating layer and an upper surface of the bump.

Abstract: Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer.

Abstract: A method of operating a mobile terminal may include receiving a first application via the mobile terminal; setting, on a first category page corresponding to characteristic information of the first application, an arrangement of an execution icon of the first application, wherein the first category page is among category pages of the mobile terminal that are defined in preset user setting information; and/or resetting the arrangement of the execution icon of the first application based on the preset user setting information, according to an arrangement period included in the preset user setting information.

Abstract: The present invention relates to a method for manufacturing a razor blade edge and a razor blade for a razor, and more specifically, to a method for manufacturing razor blade edge of a razor blade provided with a light complex thin film having metallic and ceramic properties for improving durability and hardness. According to the present invention, the method comprises: a first step of heat-treating stainless steel; a second step of forming the razor blade edge by polishing the heat-treated stainless steel; and a third step of depositing a plurality of coating materials on the razor blade edge that is formed, wherein a sputtering device is used in the third step, the sputtering device being provided with a sputter target, and the sputtering target comprising a first ingredient and a second ingredient which are deposited on the razor blade edge and on the razor blade.

Abstract: A memory card socket is provided. The memory card socket includes an outer case, an inner case which is movable within the outer case and includes a slot into which a memory card is insertable. The memory card socket also includes a locking portion which locks the inner case to the outer case upon a withdrawal of the memory card.

Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Abstract: A memory card socket is provided. The memory card socket includes an outer case, an inner case which is movable within the outer case and includes a slot into which a memory card is insertable. The memory card socket also includes a locking portion which locks the inner case to the outer case upon a withdrawal of the memory card.

Abstract: A fuel cell stack including an electricity generating unit for generating electrical energy by electrochemically reacting a fuel and an oxidizing agent, the electricity generating unit including: a first separator; a second separator; a membrane electrode assembly (MEA) between the first separator and the second separator, each of the first and second separators including a channel on a surface facing the MEA and a manifold in the surface facing the MEA, the manifold communicating with the channel; and a gasket, positioned at an outer circumference portion of an area where the MEA is positioned, for sealing a space between the first and second separators and for covering an open area of a channel extension area of at least one of the first and second separators where the manifold communicates with the channel.

Abstract: Disclosed herein is a printed circuit board, including: a base substrate having a connection pad; a lead pin bonded to the connection pad; and a surface treatment layer formed at the exposed portions of the connection pad and the lead pin.

Abstract: Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.

Abstract: Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and the plating thickness of the second plating layer is greater than the plating thickness of the first plating layer, thus balancing the plating volumes of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate which results from the coefficients of thermal expansion being different.

Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic part, and open portions are formed on the first plating layer, thus balancing the plating areas of the plating layers formed on the layers of the package substrate, thereby minimizing warpage of the package substrate due to differing coefficients of thermal expansion.

Abstract: Fuel cell systems and methods for controlling fuel cell systems. In one embodiment, the method includes supplying power produced by operating the fuel cell stack in a maximum output mode to the load while concurrently charging the secondary cell with the produced power when an amount of charge of the secondary cell is smaller than a first standard value, supplying both power produced by operating the fuel cell stack in a stable output mode and the power discharged by the secondary cell to the load when the amount of charge of the secondary cell is larger than a second standard value, and maintaining an existing output mode among the output modes when the amount of charge of the secondary cell is larger than the first standard value and smaller than the second standard value.

Abstract: Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

Abstract: Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate that is bonded to a package substrate by interposing a solder paste between the lead pin for the package substrate and the package substrate, the lead pin for the package substrate including: a cylindrical connection pin; and a head part that is formed on one end of the connection pin, wherein the head part includes a disk shaped flange part, and a round part that is formed on one surface of the flange part and is configured to include first and second curved surfaces having different radii of curvature, the first and second curved surfaces each having different radii of curvature selected from a range of 1:0.1 to 1:5 as compared to a diameter of the connection pin.