Abstract: There is provided an ink path structure, including: a pressure chamber storing ink introduced thereinto to discharge the ink to a nozzle; and a path discharging the ink by pressure generated within the pressure chamber and then supplying the ink to the pressure chamber and being repeatedly expanded and contracted in a direction toward the pressure chamber to attenuate a residual pressure wave remaining in the pressure chamber.

Abstract: There is provided an inkjet print head that includes: an inkjet head plate with a plurality of head cells including ink passages where introduced ink is ejected through a nozzle by passing through a pressure chamber; and a piezoelectric actuator formed on the top of the inkjet head plate and formed at a position corresponding to the pressure chamber, wherein the area of at least one of the pressure chamber and the piezoelectric actuator is changed to make ejection characteristics of the ink ejected from the plurality of head cells uniform.

Abstract: There are provided a thin film transistor substrate for transflective liquid crystal display device (LCD) and a manufacturing method thereof, which can reduce manufacturing cost and simplifying manufacturing processes. In the method, a thin film transistor is formed on a reflection region of a device substrate defined by the reflection region and a transmission region. A passivation layer is formed on the thin film transistor so as to expose a drain electrode of the thin film transistor and to cover the thin film transistor. A pixel electrode is formed on the transmission and reflection regions. The pixel electrode has a structure of a first pixel electrode electrically connected to the drain electrode and a second pixel electrode formed to have an embossed pattern on the first pixel electrode. A reflective layer is formed on the second electrode pixel having the embossed pattern on the reflection region.

Abstract: A base member including two-step recesses and a hard disk drive (HDD) including the same. The HDD includes a base member; a spindle motor installed in the base member; a data storage disk assembled to the spindle motor; and an actuator rotatably installed in the base member and for moving a read/write head to a desired position on the disk, wherein the base member includes: a first floor surface disposed in a region facing the disk and having a center portion in which the spindle motor is installed; a shroud formed on a circumference of the first floor surface and extending the exterior circumference of the disk; and two-step recesses formed in an operating region of the actuator, wherein the two-step recesses comprise a first step recess formed on the first floor surface and a second step recess formed on a floor surface of the first step recess.

Abstract: An inkjet print head assembly includes: an ink tank storing ink provided from the exterior; a partition demarcating the interior of the ink tank; a tank head including at least two ink movement holes allowing ink to flow into the interior of the ink tank therethrough and a common channel communicating with the ink movement holes; and an inkjet print head coupled to the tank head to discharge the ink from the common channel.

Abstract: A spindle motor assembly includes a spindle motor, a disk for storing data, the disk being installed on the spindle motor, and a disk clamp for fixing the disk to the spindle motor. The disk clamp includes a hollow formed in a central portion thereof, a coupling portion formed around an external circumference of the hollow and including a plurality of screw insertion holes into which clamp fastening screws to be coupled to the spindle motor are inserted, and a pressing portion formed around an external circumference of the coupling portion to press the disk. The coupling portion includes a first region and a second region that are asymmetrical with respect to each other, the plurality of screw insertion holes are formed in the first region only, and a thickness extension portion or a through hole is formed in at least a portion of the second region.

Abstract: The present invention relates to a fused heterocyclic compound having the Formula 1, which is useful as a platelet aggregation inhibitor, a method for preparing the same, and a pharmaceutical composition for inhibiting platelet aggregation comprising the same.

Abstract: A microchip for making a cartridge to be compatible with an imaging device is disclosed. The microchip can be used for various cartridges such as toner cartridges, ink cartridges, and so on, and includes a pair of electrodes which receive electronic signal from an imaging device, wherein the electronic signal includes clock signal and data signal; and a microprocessor which detects (a) a clock generation time and (b) a clock frequency from the electronic signal received by the electrodes, determines the type of cartridge which is compatible with the imaging device, operates a communication program according to the determined type of cartridge, and communicates with the imaging device with the communication program.

Abstract: The present invention concerns a joining structure and a substrate-joining method using the same. The joining structure comprises a substrate, and comprises a plurality of joining patterns which are located on the said substrate and which are spaced apart from each other. The substrate-joining method using the joining structure can comprise: a stage involving the formation of a plurality of joining patterns which are spaced apart from each other on a first substrate; and a stage of joining a second substrate on the plurality of joining patterns. When the said joining structure is employed, it is possible to reduce or prevent damage due to spreading of the joining substance during joining of the two substrates.

Abstract: The present invention provides a method of manufacturing a TFT array panel in a cost-effective manner. The method includes: forming thin film transistors each having a gate electrode, a source electrode, and a drain electrode; forming an insulating layer on the thin film transistors; forming a first conductive layer electrically connected to the drain electrodes on the insulating layer; forming a second conductive layer on the first conductive layer; forming a photoresist layer including first portions and second portions thinner than the first portions; selectively etching the second conductive layer with a first etchant by using the photoresist layer as an etch blocker; and selectively etching the first conductive layer with a second etchant by using the photoresist layer and the second conductive layer as etch blockers.

Abstract: An apparatus for heating a chip includes: a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip; and a beam intensity adjuster disposed on a laser emission path between the semiconductor chip and the laser generator to equalize the intensity of the laser beam to be emitted to the semiconductor chip. A flip chip bonder having the chip heating apparatus, and a method for bonding a flip chip using the same are also provided.

Abstract: A bump structure with multiple layers may include a first layer electrically connected to a protective substrate hermetically packaging a base substrate, the first layer allowing the base substrate and the protective substrate to be spaced apart from each other at a predetermined distance; and a second layer electrically connected to the first layer, the second layer being eutectically bonded on a surface of the base substrate. The first layer may have a melting point higher than a eutectic temperature of the second layer and the base substrate. When using a bump structure with multiple layers, it is possible to secure a space in which a micro-structure such as a microelectromechanical systems (MEMS) device on a base substrate may be driven. Further, it is possible to prevent a contact between adjacent structures or electrodes from being generated due to diffusion of a bonding material in a hermetical packaging process.