Patents by Inventor Sung yong An

Sung yong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11646504
    Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: May 9, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Young Sik Hur, Sung Yong An, Myeong Woo Han, Kyu Bum Han, Dae Ki Lim
  • Publication number: 20230128367
    Abstract: This disclosure relates to, among other things, secure data rights management and governance. Certain embodiments disclosed herein provide for a data access control and management architecture that enforces one or more rules, restrictions, and/or configurations in connection with managing access requests to data. In various embodiments, one or more of the enforced rules, restrictions, and/or configurations may articulate access conditions that depend, at least in part, on a source, physical location, and/or an execution environment associated with a data access request. In this manner, data access may be managed and/or governed based, at least in part, on the source, location, system and/or associated environment requesting access to the data.
    Type: Application
    Filed: October 25, 2022
    Publication date: April 27, 2023
    Applicant: Intertrust Technologies Corporation
    Inventors: Kristo Iila, Eric Swenson, Christopher Kalima, Oleg Mürk, Sung Yong Chun, Michael Manente
  • Publication number: 20230125914
    Abstract: A display apparatus including a display and a supporter. The supporter being mounted on the display and configured to support the display and rotate the display module between a first position and a second position. The supporter including a drive motor, a first gear, and a detection sensor. The drive motor configured to supply a driving force to rotate the display. The first gear configured to rotate together with the display by receiving the driving force from the drive motor. The detection sensor configured to detect a rotation amount of a second gear configured to rotate in with the first gear.
    Type: Application
    Filed: December 23, 2022
    Publication date: April 27, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyun Yong CHOI, Young Chul KIM, Ji Su KIM, Hun Sung KIM, Sung Yong PARK, Jin Soo SHIN, Dae Sik YOON, Yong Yeon HWANG
  • Patent number: 11637362
    Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: April 25, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Yong An, Chang Hak Choi
  • Patent number: 11637380
    Abstract: The present disclosure provides technology that proposes an ultra-high frequency band (mmWave band) vertical polarization antenna having a new structure applicable to a slim planar structure (e.g., a terminal).
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: April 25, 2023
    Assignees: SK TELECOM CO., LTD., POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Hee Chang Seong, Joon Young Shin, Sung Yong Kang, Won Bin Hong, Jun Ho Park
  • Patent number: 11629714
    Abstract: A compressor may include a casing, and a compression device installed inside of the casing and that compresses the refrigerant while rotating by receiving a rotational force of an electric motor through a rotational shaft. A high/low pressure separation plate may be installed at an upper portion of the compression device, and an insulation plate may be provided to block the high/low pressure separation plate and the suction tube from each other by being located therebetween. The insulation plate may reduce heat transfer between a refrigerant discharge space having a high temperature located at the upper portion of the high/low pressure separation plate and a refrigerant suction space having a relatively low temperature located at a lower portion of the high/low pressure separation plate.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: April 18, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Changeol Jo, Suchul Kim, Jeonghun Kim, Sung Yong Ahn
  • Publication number: 20230116739
    Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes a chamber comprising a support, the support configured to have mounted thereon a substrate; at least one channel disposed in the chamber and into which a conductive fluid or a non-conductive fluid is configured to be injected; and a control unit. The control unit includes a first pump and a second pump configured to respectively supply the conductive fluid and the non-conductive fluid to the at least one channel; and a first valve configured to receive the conductive fluid and the non-conductive fluid from the first pump and the second pump, respectively, and control proportions at which the conductive fluid and the non-conductive fluid are injected into the at least one channel.
    Type: Application
    Filed: July 1, 2022
    Publication date: April 13, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Hwi CHO, Sung-Yeol KIM, Mee Hyun LIM, Sung Yong LIM, Seong Ha JEONG, Woong Jin CHEON
  • Publication number: 20230111469
    Abstract: Embodiments of the present invention relate to an organic electronic device capable of ensuring high luminous efficiency, low driving voltage and high heat resistance, and improving color purity or lifespan.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 13, 2023
    Inventors: Hyoung Keun PARK, Junggeun LEE, Sun-Hee LEE, Yong Wook PARK, Sung Yong HAN
  • Publication number: 20230104985
    Abstract: Provided is a vacuum cleaner, including a main body including a power supply part configured to supply power, a first motor configured to generate suction force, and a first printed circuit board (PCB) on which the first controller is mounted, and a nozzle including a cleaning part, a second motor configured to drive the cleaning part and a second PCB equipped with a second controller, the nozzle configured to suck air containing foreign substances by the suction force, wherein a first power line communication from the first controller to the second controller is voltage pulse width modulation (PWM), and a second power line communication from the second controller to the first controller is a current shaping method.
    Type: Application
    Filed: November 11, 2020
    Publication date: April 6, 2023
    Inventors: Sun Ku KWON, Cha Seung JUN, Sung Yong SHIN, Se Hwa CHOE, Dong Hyun LIM
  • Patent number: 11621491
    Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: April 4, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
  • Patent number: 11612964
    Abstract: A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: March 28, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Sung Yong Lee, Toshinaru Suzuki, Seung Ho Myoung, Gyeong Hee Han, Gyoo Wan Han
  • Publication number: 20230093683
    Abstract: The present technology includes a semiconductor memory device. The semiconductor memory device includes a first channel pattern and a second channel pattern each extending in a vertical direction and facing each other, a channel separation pattern formed between the first channel pattern and the second channel pattern and extending in the vertical direction, a stack including conductive patterns each surrounding the first channel pattern, the second channel pattern, and the channel separation pattern and stacked apart from each other in the vertical direction, a first memory pattern disposed between each of the conductive patterns and the first channel pattern, and a second memory pattern disposed between each of the conductive patterns and the second channel pattern.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: SK hynix Inc.
    Inventors: Jung Dal CHOI, Jung Shik JANG, Jin Kook KIM, Dong Sun SHEEN, Se Young OH, Ki Hong LEE, Dong Hun LEE, Sung Hoon LEE, Sung Yong CHUNG
  • Publication number: 20230093329
    Abstract: The present technology includes a semiconductor memory device. The semiconductor memory device includes a first channel pattern and a second channel pattern each extending in a vertical direction and facing each other, a channel separation pattern formed between the first channel pattern and the second channel pattern and extending in the vertical direction, a stack including conductive patterns each surrounding the first channel pattern, the second channel pattern, and the channel separation pattern and stacked apart from each other in the vertical direction, a first memory pattern disposed between each of the conductive patterns and the first channel pattern, and a second memory pattern disposed between each of the conductive patterns and the second channel pattern.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: SK hynix Inc.
    Inventors: Jung Dal CHOI, Jung Shik JANG, Jin Kook KIM, Dong Sun SHEEN, Se Young OH, Ki Hong LEE, Dong Hun LEE, Sung Hoon LEE, Sung Yong CHUNG
  • Publication number: 20230090656
    Abstract: A memory device includes a memory block, peripheral circuit, and control logic. The memory block includes a plurality of pages coupled to a plurality of word lines, respectively. The peripheral circuit is configured to perform a program loop including a program pulse operation of applying a program voltage to a selected word line, and a verify operation of applying at least one verify voltage corresponding to the program voltage to the selected word line and applying a verify pass voltage to unselected word lines. The control logic is configured to increase a level of the verify pass voltage applied to at least one unselected word line among the unselected word lines whenever the peripheral circuit performs the next program loop when threshold voltages of memory cells included in a page coupled to the selected word line are greater than a reference level.
    Type: Application
    Filed: February 11, 2022
    Publication date: March 23, 2023
    Applicant: SK hynix Inc.
    Inventor: Sung Yong LIM
  • Patent number: 11603584
    Abstract: Embodiments of the disclosure relate to a ferritic alloy having excellent ability to withstand nuclear power plant accidents and a method of manufacturing a nuclear fuel cladding tube using the same. The alloy includes iron (Fe), aluminum (Al), chromium (Cr), and nickel (Ni). The nickel (Ni) may be included 0.5 to 10 wt % based on a total amount of the alloy. The chromium may be included 13 to 18 wt % based on the total amount of the alloy. The aluminum may be included 5 to 7 wt % based on the total amount of the alloy.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: March 14, 2023
    Assignees: KEPCO NUCLEAR FUEL CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Yong Lee, Hun Jang, Seung Jae Lee, Yoon Ho Kim, Dae Gyun Ko, Changheui Jang, Chaewon Kim, Hyunmyung Kim
  • Publication number: 20230072272
    Abstract: Provided is a heating unit including: a heating plate for heating a substrate; a heater installed in the heating plate; and a control unit for controlling the heater, in which wherein the heater includes: a first heater; and a second heater installed at a position different from a position of the first heater, and the control unit includes: a power source for transferring power to at least one of the first heater and the second heater; and a switching module for connecting the first heater and the second heater in series or connecting the first heater and the second heater in parallel.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 9, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Tae Sub LEE, Gyu Hyun KIM, Sung Yong LEE, Dong Hyuk SEO
  • Publication number: 20230062770
    Abstract: The inventive concept relates to a heating member for heating a substrate. In an embodiment, the heating member includes a heater plate having at least one heating element bonded thereto, a connecting plate having a first space formed therein in which the heating element is accommodated, and a control plate having a control element bonded thereto, the control element being electrically connected with the heating element to control the heating element.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 2, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Dong Hyuk SEO, Myung Hwan OH, Bong Kuk KIM, Sung Yong LEE, Min Jun KIM
  • Patent number: 11591274
    Abstract: Disclosed herein are compositions including cells of defined sets of microbial species (for example, 3, 16, 18, 19, 21, or 22 microbial species). Also disclosed are methods of using the microbial compositions that include contacting soil, plants, plant parts, or seeds with the composition. The microbial compositions are also used in methods of degrading biological materials, such as chitin-containing biological materials.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 28, 2023
    Assignee: AMVAC Chemical Corporation
    Inventors: Frederic Kendirgi, Xing Liang Liu, D. Ry Wagner, Sung-Yong H. Yoon
  • Publication number: 20230050456
    Abstract: Provided are a method and apparatus for providing a counseling service. A method of operating a counseling center server interworking with an instant messaging service includes activating a connection with a chatbot server linked to a channel in a chat room, calling a chatbot block corresponding to a specific task included in the chatbot server through the chat room, transmitting a message received from a terminal of a user connected to the chat room to the chatbot server as an input of the chatbot block, and transmitting an output of the chatbot block in response to the message received from the chatbot server to the terminal of the user.
    Type: Application
    Filed: August 12, 2022
    Publication date: February 16, 2023
    Inventors: Ho Jun LEE, Han Yong PARK, Jung Han CHOI, Sung Yong CHANG, Sang Hyeon SEO, Hye Ryeon LEE
  • Publication number: 20230052061
    Abstract: Disclosed is a substrate polishing method comprising placing a substrate into a substrate polishing apparatus, rotating each of the substrate and a polishing pad of the substrate polishing apparatus, allowing a bottom surface of the substrate to contact a top surface of the polishing pad, and determining whether the polishing pad would benefit from maintenance. The polishing pad includes a plurality of annular regions that are homocentric with a central point of the top surface of the polishing pad. The step of determining whether the polishing pad would benefit from maintenance includes ascertaining a state of the bottom surface of the substrate, and selecting one of the plurality of annular regions by using information about the state of the bottom surface of the substrate. The one of the plurality of annular regions would benefit from maintenance.
    Type: Application
    Filed: March 16, 2022
    Publication date: February 16, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyojin PARK, Songyun KANG, Sung Yong PARK, Keon-Woo KIM