Patents by Inventor Sung yong An

Sung yong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9984821
    Abstract: A multilayer ceramic capacitor includes an active region including a plurality of dielectric layers, and first and second internal electrodes alternately disposed with each of the dielectric layers interposed therebetween; and upper and lower cover regions including at least one ferromagnetic layer and disposed on and below the active region, respectively.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: May 29, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Yong An, Kang Ryong Choi, Jae Yeong Kim, Yong Hui Li, Byeong Cheol Moon, Jeong Gu Yeo
  • Patent number: 9966179
    Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: May 8, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chin Mo Kim, Jung Wook Seo, Eun Hye Na, Hak Kwan Kim, Hyung Jin Jeon, Sung Yong An
  • Patent number: 9793741
    Abstract: The present invention relates to a magnetic sheet, a wireless charging sheet, and a method for manufacturing a magnetic sheet. According to an embodiment of the present invention, a magnetic sheet used in a wireless charging sheet, which includes a metal sheet layer consisting of a plurality of divided segments; and an insulating material filled in a dividing space between the segments and forms a magnetic path of a magnetic field generated around a coil, is provided. Further, a wireless charging sheet and a method for manufacturing a magnetic sheet are provided.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: October 17, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Gu Yeo, Kang Ryong Choi, Dong Hyeok Choi, Sung Yong An, Chang Ryul Jung, Ji Man Ryu
  • Patent number: 9614491
    Abstract: A composite electronic component includes a composite body containing a capacitor and an inductor coupled to each other, the capacitor including a ceramic body having a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part, an input terminal disposed on a first end surface of the composite body and connected to the coil part, an output terminal including first output terminals disposed on a second end surface of the composite body and connected to the coil part and a second output terminal disposed on a second side surface of the composite body and connected to the first internal electrodes, and a ground terminal disposed on a first side surface of the composite body. The capacitor and the inductor are coupled in a vertical direction, and a magnetic metal layer is provided between the inductor and the capacitor.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: April 4, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kang Ryong Choi, Il Jin Park, Sung Yong An, Jung Wook Seo, Myeong Gi Kim
  • Patent number: 9609183
    Abstract: There is provided a camera module including: a lens housing in which a lens is disposed; a glass cover formed of a transparent material and covering the lens housing; and a coil conductive part formed between an outer surface of the lens and an inner surface of the glass cover.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: March 28, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kang Ryong Choi, Hyung Jin Jeon, Jeong Gu Yeo, Kang Heon Hur, Sung Yong An, Jung Wook Seo
  • Publication number: 20170084392
    Abstract: A multilayer ceramic capacitor includes an active region including a plurality of dielectric layers, and first and second internal electrodes alternately disposed with each of the dielectric layers interposed therebetween; and upper and lower cover regions including at least one ferromagnetic layer and disposed on and below the active region, respectively.
    Type: Application
    Filed: February 24, 2016
    Publication date: March 23, 2017
    Inventors: Sung Yong AN, Kang Ryong CHOI, Jae Yeong KIM, Yong Hui LI, Byeong Cheol MOON, Jeong Gu YEO
  • Patent number: 9536647
    Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40?Ai:Ao?1.03 is satisfied.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: January 3, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Hahn, So Yeon Song, Sung Yong An, Byeong Cheol Moon, Soo Hwan Son
  • Patent number: 9524817
    Abstract: Disclosed herein is a metal magnetic powder, and the metal magnetic powder according to the exemplary embodiment of the present invention includes a soft magnetic core particle and a multilayer coating film covering the core particle and having a multilayer structure, the multilayer coating film including an oxide film formed by heat treating the core particle and an insulation film formed by coating a coating particle with respect to the core particle.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: December 20, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hak Kwan Kim, Sung Yong An, Sung Jae Lee, Jung Wook Seo
  • Patent number: 9496082
    Abstract: There are provided a coil substrate which includes a coil for wireless charging and an antenna and is capable of increasing charging efficiency, and an electronic device including the same. The coil substrate according to embodiments of the invention may include a coil pattern; a dummy part formed around the coil pattern; and at least one penetration part formed in the dummy part or in a central portion of the coil pattern.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: November 15, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: No Il Park, Chang Ryul Jung, Hak Kwan Kim, Sung Yong An
  • Publication number: 20160307687
    Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 20, 2016
    Inventors: Chin Mo KIM, Jung Wook SEO, Eun Hye NA, Hak Kwan KIM, Hyung Jin JEON, Sung Yong AN
  • Patent number: 9460837
    Abstract: Disclosed are a multilayered power inductor, including: a body in which a plurality of magnetic layers formed with inner electrodes are stacked; and a plurality of gap layers, wherein the plurality of gap layers are formed so as not to contact external electrodes formed at both sides of the body, and a gap composition of the multilayered power inductor. In addition, as the gap composition, the exemplary embodiment of present invention can prepare tetravalent or tetravalent dielectric oxide into the paste type and applies the gap layer structure thereto, thereby facilitating the structural design and the thickness control of the gap layer as compared with the case of forming the gap layer in the sheet shape of the related art and improving the DC-bias characteristics by maximally suppressing the diffusion with the body.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: October 4, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soo Hwan Son, Sung Yong An, Myeong Gi Kim, So Yeon Song, Byeong Cheol Moon
  • Patent number: 9424983
    Abstract: There is provided a thin film coil, including a thin type coil pattern, and a coil lead-out portion including a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: August 23, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kang Ryong Choi, Sung Yong An, Jeong Gu Yeo, Chang Ryul Jung
  • Patent number: 9391363
    Abstract: There are provided a multilayer ferrite sheet capable of performing communications in a wideband frequency, an antenna device using the same, and a manufacturing method thereof. The multilayer ferrite sheet includes: a Y-type hexaferrite layer; and a Z-type hexaferrite layer, wherein the Y-type hexaferrite and the Z-type hexaferrite are alternately laminated.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: July 12, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hyeok Choi, Jin Young Kim, Sung Yong An, Ji Man Ryu
  • Patent number: 9378875
    Abstract: The present invention related to ferromagnetic nano-metal powders and more particularly, to ferromagnetic nano-metal powders for increasing packing density by decreasing the porosity between micro-sized soft magnetic metal powders. According to an embodiment of the present invention, the ferromagnetic nano-metal powder allows high packing density and high magnetic property at a high frequency to fill the pores inevitably generated during the manufacturing process of an inductor using the soft magnetic metal powders.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: June 28, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Yeong Kim, Sung-Yong An, Hak-Kwan Kim, Jung-Wook Seo
  • Patent number: 9349512
    Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 ?m?Tg?7 ?m, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: May 24, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Woo Hahn, Myeong Gi Kim, Sung Yong An, Ic Seob Kim, Byeong Cheol Moon
  • Publication number: 20150371781
    Abstract: A composite electronic component includes a composite body containing a capacitor and an inductor coupled to each other, the capacitor including a ceramic body having a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part, an input terminal disposed on a first end surface of the composite body and connected to the coil part, an output terminal including first output terminals disposed on a second end surface of the composite body and connected to the coil part and a second output terminal disposed on a second side surface of the composite body and connected to the first internal electrodes, and a ground terminal disposed on a first side surface of the composite body. The capacitor and the inductor are coupled in a vertical direction, and a magnetic metal layer is provided between the inductor and the capacitor.
    Type: Application
    Filed: June 19, 2015
    Publication date: December 24, 2015
    Inventors: Kang Ryong CHOI, Il Jin PARK, Sung Yong AN, Jung Wook SEO, Myeong Gi KIM
  • Patent number: 9183979
    Abstract: The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: November 10, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Kang Heon Hur, Sung Jin Park, Dong Jin Jeong, Jung Min Park, Hyeog Soo Shin, Sung Yong An, Hwan Soo Lee, Young Do Kweon, Jin Woo Hahn
  • Patent number: 9123460
    Abstract: Disclosed herein are a ferrite composition for a high frequency bead in that a part of Fe in M-type hexagonal ferrite represented by BaFe12O19 is substituted with at least one metal selected from a group consisting of 2-valence, 3-valence and 4-valence metals, as well as a chip bead material using the same. According to embodiments of the present invention, the dielectric composition is characterized in that a part of Fe as a constituent of M-type hexagonal barium ferrite is substituted by other metals, to thus decrease a sintering temperature to 920° C. or less without using any additive for low temperature sintering. Moreover, because of high SRF properties, the inventive composition is applicable to a multilayer type chip bead used at a high frequency of more than several hundreds MHz and a magnetic antenna.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: September 1, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Yong An, Jin Woo Hahn, Jeong Wook Kim, Sung Lyoung Kim, So Yeon Song, Soo Hwan Son, Ic Seob Kim
  • Patent number: 9088068
    Abstract: There is provided a magnetic composite sheet including: a magnetic layer including first and second magnetic pieces having different sizes; and a cover film formed on one surface or both surfaces of the magnetic layer, wherein, in a cross-section of the magnetic composite sheet taken in a direction parallel to a direction in which the magnetic layer and the cover film are laminated, when a length of the first magnetic piece in a vertical direction is a and a length thereof in a horizontal direction is b, and a length of the second magnetic piece in the vertical direction is a? and a length thereof in the horizontal direction is b?, b/a is greater than b?/a?(b/a>b?/a?).
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: July 21, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hyeok Choi, Jin Young Kim, Chang Ryul Jung, Ji Man Ryu, Sung Yong An
  • Patent number: 9041506
    Abstract: Disclosed herein are a multilayer power inductor and a method of manufacturing the same. The multilayer power inductor includes a multilayer body formed by multi-layering a plurality of body sheets; a coil portion including internal electrode patterns that are respectively formed on the plurality of body sheets; and external electrodes that are disposed on lateral surfaces of the multilayer body and are electrically connected to both ends of the coil portion, wherein a space portion is formed in the internal electrode pattern to correspond to contraction of the plurality of body sheet. The multilayer power inductor relieves internal stress generated in a product through the space portion so as to prevent the body sheet from being magnetized due to the internal stress, thereby preventing a reduction in inductance. The multilayer inductor may also be manufactured by using conventional manufacturing processes themselves without any influence on the productivity of a product.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Gi Kim, Sung Yong An, Soo Hwan Son