Abstract: An encoding apparatus connected to a learning circuit processing learning of a deep neural network and configured to perform encoding for reconfiguring connection or disconnection of a plurality of edges in a layer of the deep neural network using an edge sequence generated based on a random number sequence and dropout information indicating a ratio between connected edges and disconnected edges of a plurality of edges included in a layer of the deep neural network.

Abstract: Provided are the organometallic compound represented by Formula 1 and an organic light-emitting device including the same: M, X1 to X4, X11, ring CY2 to ring CY4, T1, T2, R1 to R4, and a1 to a4 in Formula 1 are the same as described in the present specification.

Abstract: An encoding apparatus connected to a learning circuit processing learning of a deep neural network and configured to perform encoding for reconfiguring connection or disconnection of a plurality of edges in a layer of the deep neural network using an edge sequence generated based on a random number sequence and dropout information indicating a ratio between connected edges and disconnected edges of a plurality of edges included in a layer of the deep neural network.

Abstract: The disclosure relates to an artificial intelligence (AI) system that simulates functions such as cognition and judgment of the human brain by utilizing machine learning algorithms such as deep learning and its applications.

Abstract: There is provided a scan cell placing method including calculating a weight of each scan cell from a deterministic pattern input to a plurality of scan cells, dividing the scan cells into a coverage group and a power group on the basis of the weights, forming a plurality of power subgroups from a result of providing a pseudo random pattern to scan cells belonging to the power group, and scheduling one or more of the power subgroups to reduce peak power in a test process.

Abstract: A camera module is provided. The camera module includes a housing configured to have an inner space covered by a cover; a folded module which includes a reflective member configured to reflect light incident from the outside, and change a path of the light, and a moving holder on which the reflective member is mounted and configured to be movable in the inner space; a lens module positioned behind the folded module in the inner space and comprising a lens barrel including a plurality of lenses aligned in an optical axis direction and configured to allow light reflected from the reflective member to pass therethrough; and a damper positioned between the folded module and the lens module inside the housing, and comprising a first cushioning surface, a second cushioning surface, and a third cushioning surface which respectively face 3-axis directions orthogonal to each other.

Abstract: In a method of repairing through-electrodes, a plurality of through-electrodes are grouped into a plurality of through-electrode groups. A plurality of redundant through-electrodes are grouped into a plurality of redundant through-electrode groups. Repair paths for the plurality of through-electrodes are searched. When searching the repair paths, in response to a Y-th through-electrode included in an X-th through-electrode group being a defective through-electrode or in response to receiving a first signal from an (X?1)-th through-electrode group, it is determined whether a y-th redundant through-electrode included in an x-th redundant through-electrode group is available for performing signal transmission thereto. In response to the y-th redundant through-electrode being available for performing signal transmission thereto, a second signal input to the Y-th through-electrode is transmitted to the y-th redundant through-electrode.

Abstract: A semiconductor system, a semiconductor device, a through-silicon via (TSV) test method, and a method of manufacturing a semiconductor device are provided. The semiconductor system includes a semiconductor device including a buffer die and first to L-th (where L is an integer greater than or equal to 2) stack dies stacked on the buffer die and communicating with the buffer die through N (where N is a positive integer) TSVs; and a TSV test device that measures each of voltages at one end and voltages at another end on the N TSVs according to a clock signal, compares each of the voltages at the one end and the voltages at the other end with a reference voltage, and determines whether each of the N TSVs has a plurality of TSV defect types according to comparison results.

Abstract: Provided are scan device and method of diagnosing scan chain fault. The scan device for diagnosing a fault includes a scan partition including a plurality of scan chains which include path control scan flipflops connected to scan flipflops in cascade. In the scan partition, connection paths of the scan flipflops are controllable. The connection paths of the path control scan flipflops are controlled to detect a position of a fault such that a fault range in the scan partition is reduced to diagnose the fault.

Abstract: A zero-power plasmonic microelectromechanical system (MEMS) device is capable of specifically sensing electromagnetic radiation and performing signal processing operations. Such devices are highly sensitive relays that consume no more than 10 nW of power, utilizing the energy in detected electromagnetic radiation to detect and discriminate a target without the need of any additional power source. The devices can continuously monitor an environment and wake up an electronic circuit upon detection of a specific trigger signature of electromagnetic radiation, such as vehicular exhaust, gunfire, an explosion, a fire, a human or animal, and a variety of sources of radiation from the ultraviolet to visible light, to infrared, to terahertz radiation.

Abstract: An EUV mask inspection system includes a mask receiving unit configured to receive a manufactured EUV mask, a main chamber configured to perform an inspection on the EUV mask, and a load-lock chamber disposed between the mask receiving unit and the main chamber. The load-lock chamber includes a mask table for loading the EUV mask, an UV lamp disposed adjacent the mask table in a first direction, a cold trap disposed adjacent the mask table in a second direction, and a vacuum pump. The first direction is a direction perpendicular to a sidewall of the mask table, and the second direction is a direction perpendicular to a top surface of the mask table. The UV lamp is configured to evaporate water molecules on the EUV mask by irradiating UV light onto the EUV mask. The cold trap is configured to trap the water molecules evaporated from the EUV mask.

Abstract: Provided are scan device and method of diagnosing scan chain fault. The scan device for diagnosing a fault includes a scan partition including a plurality of scan chains which include path control scan flipflops connected to scan flipflops in cascade. In the scan partition, connection paths of the scan flipflops are controllable. The connection paths of the path control scan flipflops are controlled to detect a position of a fault such that a fault range in the scan partition is reduced to diagnose the fault.

Abstract: An EUV mask inspection system includes a mask receiving unit configured to receive a manufactured EUV mask, a main chamber configured to perform an inspection on the EUV mask, and a load-lock chamber disposed between the mask receiving unit and the main chamber. The load-lock chamber includes a mask table for loading the EUV mask, an UV lamp disposed adjacent the mask table in a first direction, a cold trap disposed adjacent the mask table in a second direction, and a vacuum pump. The first direction is a direction perpendicular to a sidewall of the mask table, and the second direction is a direction perpendicular to a top surface of the mask table. The UV lamp is configured to evaporate water molecules on the EUV mask by irradiating UV light onto the EUV mask. The cold trap is configured to trap the water molecules evaporated from the EUV mask.

Abstract: An electronic device and a control method therefor are disclosed. A method for controlling an electronic device according to the present invention comprises the steps of: receiving a current frame; determining a region, within the current frame, where there is a movement, on the basis of a prior frame and the current frame; inputting the current frame into an artificial intelligence learning model on the basis of the region where there is the movement, to obtain information relating to at least one object included in the current frame; and determining the object included in the region where there is the movement, by using the obtained information relating to the at least one object. Therefore, electronic device can rapidly determine an object included in a frame configuring a captured image.

Abstract: The present embodiments provides a memory repair solution finding device and method which find a fault by testing a memory and find a repair solution in parallel and dynamically reconfigure the stored fault information to minimize a repair solution searching time with an optimal repair rate.

Abstract: The present exemplary embodiments provide a security circuit which senses a micro probe attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal reflected by the connected wire path, or senses a focused ion beam attack by changing both ends of a wire of a shield to be a high impedance state to change a connection state of the wire and analyzing a test signal which passes through a selected wire for every group, or blocks a physical approach by changing an accessible signal path to be a high impedance state when an external attack is detected by the detection circuit.

Abstract: The present embodiments provide a stacked memory apparatus and a repairing method thereof which store information about a spare resource in a pre-bond process, check a spare resource available in a post-bond process, correct an error through an error correction code, and variably use the same number of spare resources to additionally ensure a number of spare resources in the post-bond process, thereby improving a yield.

Abstract: Zero-power system for remote monitoring of heat sources is provided. The systems detect failure indicators of remote equipment including power substations, oil rigs, large inaccessible machinery in a factory, and communications equipment. The systems also can be used to detect the presence of people in buildings or in other locations, so as to improve HVAC utilization in large buildings. When the zero-power monitoring systems detect heat sources, such as the presence of people, failure indicators, or a targeted environmental signal, a circuit is closed using the energy of the detected radiation, and activating an RFID tag, a radio transmitter, or an alarm. The monitoring systems can remain deployed and active for many years without the need for battery replacement.

Abstract: An electronic device and a control method therefor are disclosed. A method for controlling an electronic device according to the present invention comprises the steps of: receiving a current frame; determining a region, within the current frame, where there is a movement, on the basis of a prior frame and the current frame; inputting the current frame into an artificial intelligence learning model on the basis of the region where there is the movement, to obtain information relating to at least one object included in the current frame; and determining the object included in the region where there is the movement, by using the obtained information relating to the at least one object. Therefore, electronic device can rapidly determine an object included in a frame configuring a captured image.

Abstract: The present disclosure relates to an artificial intelligence (AI) system that utilizes a machine learning algorithm, and applications therefore. Disclosed is an electronic device. The electronic device comprises: a storage unit which stores therein an artificial intelligence model trained to determine parameters for a plurality of filters used for image processing on the basis of a deep neural network (DNN); and a processor for determining, through the artificial intelligence mode, parameters for each of the plurality of filters used for image processing for an input image, and performing, through the plurality of filters, filtering of the input image on the basis of the determined parameters so as to perform image processing for the input image.