Abstract: A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Abstract: A lithographically fabricated electrode comprises a continuous metal film; and a discontinuous metal film. The discontinuous metal film has a first edge proximal to the continuous metal film, and a second edge distal the continuous metal film.

Abstract: The present disclosure relates to a hybrid opto-electrical module apparatus. The apparatus may have a module substrate having a plurality of electrically conductive circuit traces for carrying electrical signals, and at least one waveguide element for carrying optical signals. A waveguide substrate is in optical communication with the waveguide element. A transducer is supported on the waveguide substrate and in electrical communication with the circuit traces. The waveguide substrate has at least one three dimensional (3D) waveguide formed within its interior volume for routing optical signals between the waveguide element and the transducer. A first optical wirebond interfaces the waveguide element to the 3D waveguide, and a second optical wirebond interfaces the 3D waveguide to the transducer.

Abstract: The present disclosure relates to a high density electrical interconnect apparatus for interfacing with remotely located electrical components. The apparatus may have a housing, a substrate element supported within the housing, and a plurality of independent substrate interface connect subsystems arranged in a planar grid on the substrate element. The apparatus further has a plurality of independent electrical interface connector subassemblies, each configured to be coupled to an associated subplurality of the substrate interface connect subsystems, to form a plurality of electrical communication channels with the remotely located electrical components.

Abstract: The present disclosure relates to an electro-optical modulator system having a source laser which generates an input optical signal. The input optical signal is received by an electro-optical module. The electro-optical module is implantable into an anatomy and includes a plurality of pixels. Each pixel has associated therewith an electrode and an optical modulator subsystem. The electrode receives electrical signals from the anatomy. The optical modulator subsystem receives the input optical signal and modulates the input optical signal to generate modulated optical output signals in relation to the received electrical signals. A detector subsystem may be used to receive and collect the modulated optical output signals.

Abstract: An electro-optical interface system is disclosed which incorporates a housing, an electrical circuit supported from the housing and configured to interface to a plurality of remote electrical components, an electronics subsystem and an optical subsystem. The electronics subsystem is housed within the housing and in communication with the electrical circuit. The optical subsystem is housed within the housing and in communication with the electronics subsystem. The optical subsystem receives electrical signals from the electronics subsystem which are representative of electrical signals received from the remote electrical components, and converts the received electrical signals into optical signals for transmission to a remote subsystem.

Abstract: An opto-electronic probe system is disclosed. The probe system has a probe element including at least one microelectrode, with the probe element being implantable in tissue of an anatomy to receive electrical signals generated within the anatomy. A subsystem is included for at least one of generating excitation signals to be used in stimulating the anatomy, or for receiving electrical signals received from the anatomy. An interface portion is included which is in communication with the subsystem for communicating at least one of electrical signals or optical signals indicative of the electrical signals received by the microelectrode.

Abstract: The present technology can be used to control the current injection profile in the longitudinal direction of a high-power diode laser in order to optimize current densities as a function of position in the cavity to promote higher reliable output power and increase the electrical to optical conversion efficiency of the device beyond the level which can be achieved without application of this technique. This approach can be utilized, e.g., in the fabrication of semiconductor laser chips to improve the output power and wall plug efficiency for applications requiring improved performance operation.

Abstract: De-normalized data structure files generation systems and methods are provided. The system obtains files from sources wherein each file include records, parses files to validate records and attributes in the records, identifies a set of similar files from the validated files, and append two or more files from the set of similar files to obtain one or more consolidated files. Each of the one or more consolidate files corresponds to a specific category. The system further a predefined logic validation on each of the one or more consolidated files to obtain a logic validated file for each of the one or more consolidated files. Each logic validated file obtained for the one or more consolidated files include validated records. The system further generates a de-normalized data structure file including de-normalized records by merging each of the logic validated files to be used for generating intelligence reports.

Abstract: The present invention relates to a variable resistor comprises a first electrode, a second electrode, and a resistive switching layer disposed between the first electrode and the second electrode, wherein the resistive switching layer has a Brown-Millerite structure crystallized in an inclined orientation across the first electrode and the second electrode as an initial structure.

Abstract: A Cu—Si—Cu substrate having a silicon substrate, copper plating on opposite sides of the silicon substrate, and copper vias extending thru the silicon substrate to electrically and thermally connect the copper platings together. The thicknesses of the silicon substrate and the copper platings are selected so that a coefficient of thermal expansion (CTE) of the Cu—Si—Cu substrate is substantially the same as a CTE of a material to be mounted on the Cu—Si—Cu substrate.

Abstract: A pyrolytic graphite (PG) substrate and laser diode package includes a substrate body having a PG crystalline structure with a basal plane oriented at a pre-determined orientation angle as measured from a longitudinal axis of a heat generating material, such as a laser diode, mounted on a surface of the PG substrate, so that a coefficient of thermal expansion (CTE) of the PG substrate is substantially matched with a CTE of the material.

Abstract: The present invention relates to a variable resistor comprises a first electrode, a second electrode, and a resistive switching layer disposed between the first electrode and the second electrode, wherein the resistive switching layer has a Brown-Millerite structure crystallized in an inclined orientation across the first electrode and the second electrode as an initial structure.

Abstract: A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Abstract: A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Abstract: The present disclosure relates to a modular system for deep brain stimulation (DBS) and electrocorticography (ECoG). The system may have an implantable neuromodulator for generating electrical stimulation signals adapted to be applied to a desired region of a brain via an attached electrode array. An aggregator module may be used for collecting and aggregating electrical signals and transmitting the electrical signals to the neuromodulator. A control module may be used which is in communication with the aggregator module for controlling generation of the electrical signals and transmitting the electrical signals to the aggregator.

Abstract: A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.

Abstract: A cylindrical microelectrode array having an elongated cylindrical core, and a multilayer structure conformally folded around and affixed to the cylindrical core so as to extend between opposite ends of the core. The multilayer structure has integrated sections including an electrode section with electrodes exposed through electrically insulating layers, a connector section with conductive bond pads for interfacing with external electronics, and a cable section with conductive traces encapsulated in electrically insulating layers and which connect between the electrodes and their corresponding bond pads. The array may be fabricated using a planar multilayer structure having the electrode, connector, and cable sections, and conformally folding the multilayer structure around and affixing to the cylindrical core. The cable section in particular may be conformally coiled around and affixed to the cylindrical core so that the electrical conduits helically extend between the connector and electrode sections.

Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

Abstract: De-normalized data structure files generation systems and methods are provided. The system obtains files from sources wherein each file include records, parses files to validate records and attributes in the records, identifies a set of similar files from the validated files, and append two or more files from the set of similar files to obtain one or more consolidated files. Each of the one or more consolidate files corresponds to a specific category. The system further a predefined logic validation on each of the one or more consolidated files to obtain a logic validated file for each of the one or more consolidated files. Each logic validated file obtained for the one or more consolidated files include validated records. The system further generates a de-normalized data structure file including de-normalized records by merging each of the logic validated files to be used for generating intelligence reports.