Abstract: A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.

Abstract: A resistive switching memory device using a brownmillerite-structured material, the resistive switching memory device comprises a first electrode comprising an oxide electrode; a resistive switching unit that is disposed on the first electrode and comprises a thin-film of a brownmillerite structured oxide; and a second electrode that is disposed on the resistive switching unit. Furthermore, the resistive switching unit has a structure in which an octahedron structure layer and a tetrahedron structure layer are sequentially stacked.

Abstract: A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

Abstract: A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.

Abstract: A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: An optical power splitter includes a zig-zag and a reflector element associated with the zig-zag. The zig-zag is to split an input signal based on the reflector element, and output a plurality of split signals.

Abstract: A glass-silicon wafer stacked platform. The platform includes a plurality of silicon pillars defining a ferrule receptacle, a silicon spacer connected to bases of the pillars and enclosing an aperture, a glass wafer bonded to the spacer, a microlens array formed in a first surface of the glass wafer and located in the aperture, conductive material carried by a second surface of the glass wafer, and contacts in electrical communication with the conductive material.

Abstract: A fiber connector assembly is provided. The fiber connector assembly includes a fiber connector, a zig-zag member, a signal direction element, and a signal splitting element. The fiber connector receives an input signal from an input fiber. The zig-zag member relays the input signal using a plurality of relay mirrors. The signal direction element directs the input signal and the output signal. The signal splitting element separates the output signal from the input signal. The fiber connector couples the output signal to an output fiber.

Abstract: An optoelectronic interface includes an optically transparent substrate; and an alignment layer comprising a pattern of alignment features disposed on said optically transparent substrate.

Abstract: A glass-silicon wafer stacked platform.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: A mechanically aligned optical engine includes an optoelectronic component connected to a first side of a bench substrate and a transparent substrate bonded to a second side of the bench substrate. The transparent substrate comprises a mechanical feature designed to fit within an aperture of the bench substrate such that a lens formed onto the transparent substrate is aligned with an active region of the optoelectronic component.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: An optoelectronic interface includes an optically transparent substrate; and an alignment layer comprising a pattern of alignment features disposed on said optically transparent substrate.

Abstract: The invention relates to a method of making a nanotubular titania substrate having a titanium dioxide surface comprised of a plurality of vertically oriented titanium dioxide nanotubes containing oxygen vacancies, including the steps of anodizing a titanium metal substrate in an acidified fluoride electrolyte and annealing the titanium oxide surface in a non-oxidating atmosphere. The invention further relates to a nanotubular titania substrate having an annealed titanium dioxide surface comprised of self-ordered titanium dioxide nanotubes containing oxygen vacancies. The invention further relates to a photo-electrolysis method for generating H2 wherein the photo-anode is a nanotubular titania substrate of the invention. The invention also relates to an electrochemical method of synthesizing CdZn/CdZnTe nanowires, wherein a nanoporous TiO2 template was used in combination with non-aqueous electrolyte.

Abstract: The invention relates to a method of making a nanotubular titania substrate having a titanium dioxide surface comprised of a plurality of vertically oriented titanium dioxide nanotubes containing oxygen vacancies, including the steps of anodizing a titanium metal substrate in an acidified fluoride electrolyte and annealing the titanium oxide surface in a non-oxidating atmosphere. The invention further relates to a nanotubular titania substrate having an annealed titanium dioxide surface comprised of self-ordered titanium dioxide nanotubes containing oxygen vacancies. The invention further relates to a photo-electrolysis method for generating H2 wherein the photo-anode is a nanotubular titania substrate of the invention. The invention also relates to an electrochemical method of synthesizing CdZn/CdZnTe nanowires, wherein a nanoporous TiO2 template was used in combination with non-aqueous electrolyte.

Abstract: A process for the fabrication of macroporous silicon from silicon wafers. Preferred embodiments include a two-step-etch process that results in a single, macroporous layer of silicon with pore depths of several microns and relatively uniform equivalent diameters with an operator chosen mean equivalent diameter. The mean diameter determined by the operator is a mean diameter within the range of about 40 nm to about 250 nm and is determined, at least in part, by selection of an applied current density. Uniformity of equivalent pore diameter is greatly improved as compared to prior art porous silicon fabrication techniques. In a first electrochemical anodisation step, a macroporous layer is created that is covered by a shallower combination microporous-mesoporous layer. The wafer is removed and the top surface of the wafer is dissolved under alkaline conditions, producing “pits”.